MPC855TZQ50D4 vs MPC860DEZQ50D4 Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC855TZQ50D4 tarafından NXP Semiconductors ve MPC860DEZQ50D4 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | MPC855TZQ50D4 | MPC860DEZQ50D4 |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Obsolete | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | 32-bit Power Architecture | Power Architecture (embedded) |
| Core Frequency | 50 MHz | 50 MHz |
| Number of Cores | 1 | — |
| Communications Processor Module (CPM) | Yes (RISC-based offload engine) | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | — |
| ATM Support | Yes (ATM SAR) | — |
| HDLC/SDLC Support | Yes | — |
| PCMCIA Interface | Yes | Yes |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| MMU | Yes | — |
| Paket | 357-ball PBGA (25 x 25 mm) | 357-Ball PBGA (25x25 mm) |
| İşletim Sıcaklığı | 0C to +95C | 0 C to +95 C |
| Process Technology | 0.32 um CMOS (per FindIC reference data) | — |
| Montaj Türü | Surface Mount | Surface Mount (BGA) |
| RoHS Durumu | [DATA_NEEDED: RoHS status] | Contains Lead (legacy BGA) |
| Besleme Gerilimi | [DATA_NEEDED: core/IO voltage values] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-bit |
| Communications Processor Module | — | CPM with HDLC, Ethernet, PCMCIA, SCC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| HDLC/SDLC Channels | — | Yes (multi-channel) |
| Supply Voltage (I/O) | — | 3.3 V |
| Lead-Free Status | — | Contains Lead |
| Packaging | — | Tray |
| Sub-Brand Heritage | — | Freescale / NXP PowerQUICC |