MPC855TZQ50D4 vs MPC860DEZQ50D4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC855TZQ50D4 sa pamamagitan ng NXP Semiconductors at MPC860DEZQ50D4 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MPC855TZQ50D4 | MPC860DEZQ50D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | 32-bit Power Architecture | Power Architecture (embedded) |
| Core Frequency | 50 MHz | 50 MHz |
| Number of Cores | 1 | — |
| Communications Processor Module (CPM) | Yes (RISC-based offload engine) | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | — |
| ATM Support | Yes (ATM SAR) | — |
| HDLC/SDLC Support | Yes | — |
| PCMCIA Interface | Yes | Yes |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| MMU | Yes | — |
| Packhaging | 357-ball PBGA (25 x 25 mm) | 357-Ball PBGA (25x25 mm) |
| Temperature na Operasyon | 0C to +95C | 0 C to +95 C |
| Process Technology | 0.32 um CMOS (per FindIC reference data) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Contains Lead (legacy BGA) |
| Volte ng Pagbibigay | [DATA_NEEDED: core/IO voltage values] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-bit |
| Communications Processor Module | — | CPM with HDLC, Ethernet, PCMCIA, SCC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| HDLC/SDLC Channels | — | Yes (multi-channel) |
| Supply Voltage (I/O) | — | 3.3 V |
| Lead-Free Status | — | Contains Lead |
| Packaging | — | Tray |
| Sub-Brand Heritage | — | Freescale / NXP PowerQUICC |