MT40A512M16JY-075E vs H5AN8G6NAFR-RDC Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MT40A512M16JY-075E disebabkan oleh Micron Technology dan H5AN8G6NAFR-RDC disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Micron Technology
MT40A512M16JY-075E MT40A512M16JY-075E - 8Gb DDR4 SDRAM 512Mx16 | Micron

MT40A512M16JY-075E - 8Gb DDR4 SDRAM 512Mx16 | Micron

MT40A512M16JY-075E ✓ Aktif
SK hynix
H5AN8G6NAFR-RDC H5AN8G6NAFR-RDC - 8Gb DDR4 SDRAM 512Mx16 | SK Hynix

H5AN8G6NAFR-RDC - 8Gb DDR4 SDRAM 512Mx16 | SK Hynix

H5AN8G6NAFR-RDC ✓ Aktif

Pengandingan Spesifikasi

Parametr MT40A512M16JY-075E H5AN8G6NAFR-RDC
Merek Micron Technology SK hynix
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Jenis Ingatan DDR4 SDRAM DDR4 SDRAM
Saiz Ingatan 8 Gbit —
Organisasi 512M x 16 512M x 16
Clock Frequency 1.33 GHz —
Kadar Data 2666 MT/s —
Supply Voltage (VDD/VDDQ) 1.14V to 1.26V —
VPP Voltage 2.5V (-125mV, +250mV) —
Antaramuka Parallel DDR4 (JEDEC-standard)
Kemasan 96-FBGA (8x14) —
Jenis Pemasangan Surface Mount Surface Mount
Gambaran Suhu Operasi 0°C to +95°C (TC) —
Refresh Time 8192 cycles; 64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C —
Status RoHS Compliant Compliant (Lead-Free & Halogen-Free)
Ciri-ciri Auto precharge, data mask, dynamic on-chip termination, write leveling, auto self-refresh, CRC —
I/O Type 1.2V pseudo open-drain —
Memory Density — 8 Gb
Tegangan Pemberi Arus — 1.2 V
Access Mode — Multi Bank Page Burst
Package Code — TFBGA
Package Shape — Rectangular
Number of Terminals — 96
Temperature Grade — OTHER (per Partstack listing)
Technology — CMOS
Speed Grade — -RDC (see datasheet for bin timing)
Family — H5AN8G4NAFR-xxC / H5AN8G8NAFR-xxC / H5AN8G6NAFR-xxC
Max Clock Rate — [DATA_NEEDED: max clock rate for -RDC bin]
Suhu Operasi — [DATA_NEEDED: operating temperature range]

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