S912XEQ512J2MALR vs MC9S12XDT512MAA Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci S912XEQ512J2MALR disebabkan oleh NXP Semiconductors dan MC9S12XDT512MAA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
S912XEQ512J2MALR S912XEQ512J2MALR - 16-bit S12X MCU 512KB Flash LQFP-112 | NXP

S912XEQ512J2MALR - 16-bit S12X MCU 512KB Flash LQFP-112 | NXP

S912XEQ512J2MALR ✓ Aktif
NXP Semiconductors
MC9S12XDT512MAA MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA Nrnd

Pengandingan Spesifikasi

Parametr S912XEQ512J2MALR MC9S12XDT512MAA
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif NRND
Core Architecture HCS12X (S12X) 16-bit CISC —
Co-Processor XGATE peripheral co-processor —
Program Flash Memory 512 KB —
Emulated EEPROM Region [DATA_NEEDED: exact bytes hardware-emulated] —
On-chip RAM 32 KB —
Maximum Bus Frequency 50 MHz —
Tegangan Pemberi Arus 1.8 V (single supply per part number prefix) [DATA_NEEDED: supply voltage range]
Gambaran Suhu Operasi -40 C to +125 C —
Automotive Qualification AEC-Q100 (per part suffix / PPAP documentation) —
ADC Resolution 12-bit 10-bit, 8-channel
ADC Conversion Time [DATA_NEEDED: conversion time spec] —
Timer Modules ECT, PIT, RTI —
Memory Protection Unit Yes (supervisor/user modes) —
Package Type LQFP-112 (gull wing) —
Package Dimensions [DATA_NEEDED: body size 14x14 mm or 20x20 mm] —
Gaya Pemasangan Surface Mount (SMT) —
Aras MSL [DATA_NEEDED: MSL rating] —
Status RoHS Compliant (per NXP product information) —
Core Processor — HCS12X
Core Size — 16-Bit
Maximum Clock Speed — 80 MHz
Program Memory Size — 512KB (512K x 8)
Program Memory Type — FLASH
RAM Size — 20KB
EEPROM Size — 4KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 59
Suhu Operasi — -40C to +125C (TA)
Kemasan — 80-QFP (14x14 mm), Square, Gull Wing
Jenis Pemasangan — Surface Mount
Packaging Method — Tray
Boson Bebas — Compliant
ECCN — 3A991.a.2
Estimated EOL Date — 2028

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