5CSXFC5C6U23I7LN - Cyclone V SX SoC FPGA, 85K LE, ARM Cortex-A9 | Intel
MPN: 5CSXFC5C6U23I7LN ✓ Aktif5CSXFC5C6U23I7LN Ringkasan
A System-on-Chip FPGA is a heterogeneous device that pairs a programmable logic fabric with one or more hard processor cores, allowing designers to implement custom hardware accelerators in programmable logic while running application software on a deterministic, low-latency CPU subsystem. In the broader taxonomy, the 5CSXFC5C6U23I7LN is an FPGA & SoC -> programmable logic -> embedded SoC -> ARM Cortex-A based SoC FPGA, used wherever deterministic real-time performance, hardware parallelism, and software flexibility must coexist on one chip.
Key features include 85K logic elements, 4,450 Kbits of embedded memory, 224 variable-precision DSP blocks (18x19 multipliers), six 3.125 Gbps transceivers, two hard memory controllers, and the dual-core ARM Cortex-A9 HPS with NEON media engine, single/double-precision FPU, and CoreSight debug. The 672-UBGA package exposes 364 user I/O pins (excluding HPS-dedicated pins), supports LVDS, LVTTL, LVCMOS, and SSTL/HSTL I/O standards, and uses an exposed die paddle for thermal dissipation.
Architecturally, the Cyclone V SX backplane uses an Adaptive Logic Module (ALM) of 8 inputs with fracturable LUTs, an 8-bit hard memory controller with DDR3/DDR3L/LPDDR2 support up to 32-bit data width, and 8-lane PCIe Gen2 hard IP. The HPS includes dedicated SDRAM controllers, quad SPI flash controller, NAND flash controller, SD/MMC, USB 2.0 OTG, Gigabit Ethernet MAC, UART, I2C, SPI, and CAN. The device is typically configured via serial (AS) or parallel (FPP) flash, with bitstream encryption and authentication supported.
Typical applications include industrial motor control and robotics, factory automation controllers, machine vision pipelines, automotive ADAS prototypes, medical imaging front-ends, software-defined radio baseband, and secure IoT edge gateways. The combination of ARM Cortex-A9 software ecosystem and programmable logic hardware acceleration suits latency-sensitive DSP and control tasks.
Design considerations: this SoC FPGA requires a multi-rail power supply (typically 1.1 V core, 1.8 V/2.5 V/3.3 V I/O, HPS 1.1 V + HPS I/O), external DDR3 memory, boot flash, and careful PCB layout to meet transceivers' signal-integrity constraints. Quartus Prime software (Standard or Pro edition) is required for synthesis, place-and-route, and HPS configuration.
This page synthesizes distributor pricing, drop-in SoC FPGA alternatives, and practical SoC integration design notes that go beyond the device datasheet and product brief alone.
Pilihan pengganti yang segera untuk 5CSXFC5C6U23I7LN — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera 5CSXFC5C6U23I7LN (sama faktor bentuk dan kaki) — berbeza dalam Logic Elements, Package, Operating Temperature, Process Technology, Transceivers.
5CSXFC4C6U23I7LN
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →5CSXFC4C6U23I7N
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →5CSXFC2C6U23I7LN
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →5CSXFC6C6U23I7LN
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →5CSXFC5C6U23C8N
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →5CSXFC5C6U23C7N
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →5CSXFC5C6U23I7LN Penilaian maksimum & Ciri-ciri Elektrik
| Series | Cyclone V SX |
| Device Type | SoC FPGA (FPGA + ARM Cortex-A9 HPS) |
| Logic Elements | 85 K |
| Embedded Memory | 4,450 Kbits |
| DSP Blocks | 224 (18x19 variable-precision multipliers) |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| Transceivers | 6 channels, up to 3.125 Gbps |
| Maximum User I/O | 364 (excluding HPS-dedicated pins) |
| Hard Memory Controllers | 2 |
| Memory Interface Support | DDR3, DDR3L, LPDDR2 |
| Kemasan | 672-UBGA (23x23 mm) |
| Suhu Operasi | -40C to +100C (industrial, I7) |
| Status RoHS | Compliant (LN suffix) |
| Process Node | TSMC 28 nm low-power |
| Configuration | Serial (AS) or Parallel (FPP) flash, bitstream encryption supported |
Panduan Konfigurasi Pin 5CSXFC5C6U23I7LN 672-ubga (23x23 mm)
Konfigurasi pin untuk 5CSXFC5C6U23I7LN (672-ubga (23x23 mm) pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk 5CSXFC5C6U23I7LN.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
5CSXFC5C6U23I7LN patut untuk 6 aplikasis: Industrial Motor Control and Drives, Machine Vision and Industrial Imaging, Software Defined Radio Baseband, Automotive ADAS Prototyping and Aftermarket, Medical Imaging Front-End, Secure Industrial IoT Edge Gateways.
Industrial Motor Control and Drives
The 5CSXFC5C6U23I7LN is purpose-built for high-performance industrial motor drives. Its 224 variable-precision DSP blocks execute field-oriented control (FOC) loops at sub-microsecond latency, while the dual ARM Cortex-A9 HPS runs EtherCAT/CANopen supervisory stacks, safety logic, and HMI graphics. The 85K LE fabric absorbs custom encoder interfaces, sigma-delta modulators, and resolver-to-digital converters. Per Intel Cyclone V motor control reference designs, this SoC FPGA delivers deterministic torque-loop sampling backed by two hard DDR3 controllers. Industrial temperature grade (-40C to +100C) suits outdoor drives and cabinet installations.
Disebarkan
Machine Vision and Industrial Imaging
In machine vision systems, the 5CSXFC5C6U23I7LN receives image streams from MIPI CSI-2 or parallel LVDS sensors via its programmable I/O, processes them through FPGA-accelerated pipelines (color conversion, defect detection, optical flow), and dispatches results to the ARM HPS for higher-level inference. The 6 transceivers (up to 3.125 Gbps) enable CoaXPress or GigE Vision aggregation. Per the device brief, the embedded memory bandwidth (4,450 Kbits) is sufficient for line-buffer based processing at full HD/60 fps. The same SoC also drives a display-side output through LVDS or HDMI bridges.
Disebarkan
Software Defined Radio Baseband
The 5CSXFC5C6U23I7LN suits small-cell and private LTE/5G baseband applications where DSP blocks implement channel coding, FFT/iFFT, and crest-factor reduction while the ARM Cortex-A9 runs the L2/L3 protocol stack. Its six 3.125 Gbps transceivers handle CPRI or JESD204B links to RFICs. The 85K LE fabric hosts custom PHY accelerators, and the hard memory controllers deliver deterministic DDR3 access for HARQ buffer scratch space. Per Intel's CPRI reference design, this device supports up to two antenna streams at 20 MHz LTE bandwidth in real time with headroom for upper-layer processing.
Disebarkan
Automotive ADAS Prototyping and Aftermarket
The 5CSXFC5C6U23I7LN (industrial I7 grade) is widely used in ADAS prototypes, fleet telematics, and aftermarket vehicle systems where -40C to +100C operation and ARM Cortex-A9 software ecosystem matter. The FPGA fabric implements sensor-fusion algorithms (radar, lidar, camera) while the HPS runs AUTOSAR-classic or Linux-based supervisory stacks with CAN-FD. Per Intel automotive whitepapers, this device is a stepping stone to ASIL-qualified Cyclone V variants for production deployment. The 6 transceivers stream raw radar ADC data at multi-Gbps rates for FMCW processing.
Disebarkan
Medical Imaging Front-End
In ultrasound, endoscopy, and patient-monitoring equipment, the 5CSXFC5C6U23I7LN combines FPGA-based beamforming and DSP pipelines with the ARM Cortex-A9 HPS for user interface and network connectivity. Its high I/O count (364 user pins) directly interfaces analog front-end ADCs via LVDS, while the 224 DSP blocks execute b-mode, doppler, and elastography pipelines. The dual hard memory controllers route echo data through DDR3 buffers. Per Intel medical application notes, the part's industrial temperature range and small-form-factor 672-UBGA make it suitable for portable cart-based ultrasound systems.
Disebarkan
Secure Industrial IoT Edge Gateways
The 5CSXFC5C6U23I7LN powers ruggedized edge gateways that aggregate industrial protocols (Modbus, Profinet, EtherCAT) on the ARM side while running hardware-accelerated crypto (AES-256, SHA-2, RSA) and intrusion detection in the FPGA fabric. Bitstream encryption supported in this device protects IP and prevents cloning. Its six transceivers enable redundant Ethernet rings or fiber uplinks. Per Intel IoT reference designs, the part's deterministic boot from encrypted flash combined with secure debug locks meets IEC 62443 baseline requirements for industrial control.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk 5CSXFC5C6U23I7LN — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | 5CSXFC4C6U23I7LN | 5CSXFC2C6U23I7LN | 5CSXFC6C6U23I7LN | 5CSXFC5C6U23C8N | 5CSXFC5C6U23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Logic Elements | 85K | ~65K (-24%) | ~25K (-71%) | ~110K (+29%) | 85K (same) | 85K (same) |
| DSP Blocks | 224 | 156 | 84 | 224 | 224 (same) | 224 (same) |
| Embedded Memory (Kbits) | 4,450 | 3,170 | 1,400 | 5,860 | 4,450 (same) | 4,450 (same) |
| HPS Maximum Frequency | 925 MHz | 925 MHz (same) | 925 MHz (same) | 925 MHz (same) | 925 MHz (same) | 925 MHz (same) |
| Transceivers | 6 ch @ 3.125 Gbps | 6 ch (same) | 6 ch (same) | 6 ch (same) | 6 ch (same) | 6 ch (same) |
| Operating Temperature | -40C to +100C (I7 industrial) | -40C to +100C (same) | -40C to +100C (same) | -40C to +100C (same) | 0C to +85C (commercial C8) | 0C to +85C (commercial C7) |
| RoHS Status (LN suffix) | Yes (LN) | Yes (LN) | Yes (LN) | Yes (LN) | No (non-LN) | No (non-LN) |
Penyeberangsung Jelas
- Higher logic density while staying in the same 672-UBGA footprint (vs5CSXFC4C6U23I7LN)
- Industrial temperature grade with RoHS lead-free compliance (vs5CSXFC5C6U23C8N)
- Complete SoC integration reduces system BOM (vsFPGA + external processor (e.g. Zynq-7000 XC7Z020))
Catatan Desain
Estimated: Cyclone V SX SoC FPGAs typically require four independent supply rails - 1.1V core, 1.1V HPS core, 1.8V-3.3V I/O banks, and 2.5V-3.3V transceiver supplies. Per Intel's Cyclone V power management user guide, use a sequencing controller such as the LTC2923 to ensure core rails come up before I/O. Decoupling: place 0.1uF and 10uF ceramics within 5mm of every power pin, and use a power plane cut-out under the 672-UBGA die paddle to maximize thermal dissipation. Total worst-case power dissipation at 925 MHz HPS + 100% logic utilization can exceed 8W, requiring attention to airflow.
The 672-UBGA package has 1.0 mm ball pitch and requires microvia or laser-drilled HDI PCB technology for breakout. Use at least 6 PCB layers with dedicated ground and power planes immediately adjacent to the BGA. Per Intel's Cyclone V hardware design guidelines, route matched-length differential pairs for the six transceivers with impedance controlled to 100 oh +/-10% and isolate them with continuous ground shielding. Length matching tolerance for transceivers at 3.125 Gbps is +/-150 um; verify with 3D EM simulation.
Estimated: at full FPGA utilization with 85K LE running near 200 MHz and the ARM Cortex-A9 at 925 MHz, junction temperature in a still-air environment can rise 50-65C above ambient. The 672-UBGA exposes a die paddle on the bottom side that must be soldered to a continuous thermal pad with thermal vias (0.3 mm pitch, 0.5 mm drill) connecting to an inner copper plane. For industrial chassis operating at +70C ambient, attach a small heatsink or forced-air cooling to maintain junction below +100C.
Common pitfalls: (1) Forgetting to enable the HPS SDRAM controller PLL before DDR3 calibration - the HPS will hang at boot. (2) Mixing the C8 (commercial) speed grade into I7 (industrial) designs without re-running Quartus timing analysis - speed grade affects Fmax. (3) Failing to lock the FPGA JTAG chain when used in production - leave TMS and TDI pulled to known states per the device pin connection guidelines. (4) Routing LVDS without series-staggered damping resistors at the FPGA side, causing reflections on cables over 5m.
Signal-integrity layout: separate analog and digital grounds with a single point-connection under the device. Place the reference clock source within 50 mm of the FPGA clock pin with 50 ohm controlled impedance. For DDR3 interfaces, route byte groups to maintain within-byte skew under 25 ps and use fly-by VTT termination for address/command lines per JEDEC DDR3 fly-by topology. Always include a footprint for a second DDR3 SO-DIMM option for prototyping flexibility.
Maklumat Kesediaan
LN suffix indicates lead-free / RoHS compliance per Intel product designation. I7 indicates industrial temperature grade. AEC-Q100 qualification not applicable - this is an FPGA, not a discrete automotive IC; the part is widely used in automotive prototypes but not formally AEC-Q100 qualified.