5CSXFC5C6U23C7N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM-A9 | Intel
MPN: 5CSXFC5C6U23C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $405 | $4,050.00 |
| 100 | $380 | $38,000.00 |
| 250 | $365 | $91,250.00 |
| 500 | $348 | $174,000.00 |
Drop-in alternatives for 5CSXFC5C6U23C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSXFC5C6U23C7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone V SX |
| Family | Cyclone V SoC FPGA |
| Logic Elements | 85,000 |
| Embedded Memory | 4,450 Kbits |
| DSP Blocks | 87 |
| Fractional PLLs | 8 |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| User I/Os | 145 |
| Speed Grade | C6 |
| Operating Temperature | 0C to +85C (commercial) |
| Core Voltage | 1.1 V |
| Process Technology | 28 nm TSMC |
| Package | 672-UBGA (UFBGA) 23x23 mm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
5CSXFC5C6U23C7N 672-ubga (ufbga) 23x23 mm Pin Configuration Guide
Complete pinout information for 5CSXFC5C6U23C7N (672-ubga (ufbga) 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC5C6U23C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC5C6U23C7N is suitable for 6 applications: Industrial Machine Vision Controller, Portable Medical Imaging (Ultrasound / Patient Monitor), Motor Drive and Industrial Servo Controller, Broadcast Video Processing and Bridging, Factory Automation Edge Gateway, Avionics Subsystem / Flight Control Interface.
Industrial Machine Vision Controller
The 5CSXFC5C6U23C7N is a strong fit for industrial machine vision controllers that need on-camera image pre-processing plus a Linux host stack for protocol handling. The 87 DSP blocks and 4,450 Kbits of embedded RAM let the FPGA fabric run real-time Sobel, Canny, or morphological filters on GigE Vision streams, while the dual-core 800 MHz ARM Cortex-A9 HPS runs the GigE Vision driver, OPC-UA, or MQTT client. The 145 user I/Os and the HPS USB 2.0 + EMAC peripherals simplify board integration with industrial Ethernet and USB3 vision cameras. Engineers typically connect an external DDR3 to the HPS memory controller and use the FPGA-to-HPS AXI bridge to pass detected features back to the processor at low latency, an architecture well-supported by the Cyclone V SX SoC EDS.
Recommended
Portable Medical Imaging (Ultrasound / Patient Monitor)
The 5CSXFC5C6U23C7N serves well in portable medical imaging systems such as handheld ultrasound probes or bedside patient monitors that need low power, FPGA DSP, and an embedded OS. The hard ARM Cortex-A9 runs the application UI on Linux, while the FPGA fabric implements beamforming, FIR filtering, and envelope detection on the ultrasound front-end. The 28 nm low-power Cyclone V process and the 1.1 V core keep total board power low enough for battery-operated enclosures, and the UFBGA-672 package provides a compact 23x23 mm footprint for small handheld form factors. Per the Intel Cyclone V device overview, the HPS also drives the LCD, touchscreen, and Wi-Fi/BLE link to a clinician's tablet, consolidating BOM compared to a discrete processor + FPGA design.
Recommended
Motor Drive and Industrial Servo Controller
The 5CSXFC5C6U23C7N integrates the control loop and communications for high-end industrial servo drives in a single device. The FPGA fabric implements field-oriented control (FOC), space-vector PWM, and encoder decoding at high update rates with deterministic latency, while the dual-core ARM Cortex-A9 HPS runs EtherCAT, CANopen, or PROFINET master stacks and the operator UI. The HPS EMAC and DDR3 controller enable high-speed industrial Ethernet without a separate MCU, and the 145 user I/Os provide enough GPIO for multiple encoders, gate drivers, and safety signals. Designers should leverage the LX/LY pin multiplexing from the Cyclone V SX architecture so FPGA I/O can be flexibly routed as LVDS pairs for encoder feedback or as single-ended GPIO for digital I/O.
Recommended
Broadcast Video Processing and Bridging
The 5CSXFC5C6U23C7N fits broadcast video processing bridges that need format conversion, scaling, and audio embedding at low power. The FPGA fabric can run video pipelines such as color-space conversion, deinterlacing, or HDR tone mapping with deterministic frame-buffer latency, while the HPS handles TCP/IP control, web UI, and SD card logging. The 4,450 Kbits of embedded memory and DDR3 HPS controller together support double-buffered HD or 4K processing pipelines with manageable external memory cost. Per the Intel Cyclone V device overview, the 28 nm process and the 672-ball UFBGA package also give broadcast designers the headroom to add 12G-SDI PHY support by mapping transceivers through FPGA GPIO banks if higher bandwidth is required.
Recommended
Factory Automation Edge Gateway
The 5CSXFC5C6U23C7N is a natural fit for industrial edge gateways that aggregate multiple fieldbuses and pre-process sensor data before sending it to the cloud. The HPS runs a Linux distribution with container support for OPC-UA, MQTT, or Modbus, while the FPGA fabric handles deterministic real-time preprocessing, edge analytics, or custom industrial protocols on GPIO/serial links. The 28 nm Cyclone V process keeps total gateway power low enough for DIN-rail or fanless enclosures, and the industrial temperature variants (A7N/I7N) share the same UFBGA-672 footprint for harsh-environment deployments. Per the Intel Cyclone V device overview, the HPS USB 2.0 + EMAC + CAN peripherals reduce external bridge chips on the BOM, while the FPGA-to-HPS AXI bridges allow low-latency DMA transfer of pre-processed sensor data.
Recommended
Avionics Subsystem / Flight Control Interface
The 5CSXFC5C6U23C7N can be deployed in avionics subsystems such as flight control interface boards, sensor concentrators, or MIL-STD-1553 bridges where a hard ARM Cortex-A9 simplifies RTOS or DO-178C certifiable software. The HPS runs a real-time operating system (VxWorks, INTEGRITY, or RTEMS) on the Cortex-A9 dual core, while the FPGA fabric implements custom ARINC 429, MIL-STD-1553, or discrete I/O interfaces with deterministic latency. The 145 user I/Os support many simultaneous avionics bus interfaces, and the UFBGA-672 package's 23x23 mm footprint fits into standard 6U avionics card mechanics. Per the Intel Cyclone V device overview, the C6 speed grade is generally adequate for avionics I/O rates; engineers should evaluate 5CSXFC5C6U23I7N for industrial temperature operation and follow Intel's FPGA aerospace design guidelines for radiation-tolerant mitigation if required.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC5C6U23C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC5C6U23C6N | 5CSXFC5C6U23A7N | 5CSXFC5C6U23I7N | 5CSXFC4C6U23C7N | 5CSXFC5C6U23C8N | 5CSEBA6U23C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (UFBGA) 23x23 mm | 672-UBGA (UFBGA) 23x23 mm - same | 672-UBGA (UFBGA) 23x23 mm - same | 672-UBGA (UFBGA) 23x23 mm - same | 672-UBGA (UFBGA) 23x23 mm - same | 672-UBGA (UFBGA) 23x23 mm - same | 672-UBGA (UFBGA) 23x23 mm - same |
| Logic Elements | 85,000 | 85,000 | 85,000 | 85,000 | 65,000 (-23%) | 85,000 | 110,000 (+29%) |
| Speed Grade | C7 | C6 (slower) | C7 (industrial temp) | I7 (industrial) | C7 | C8 (faster) | C7 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| HPS Processor | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 925 MHz |
| User I/Os | 145 | 145 | 145 | 145 | [DATA_NEEDED] | 145 | [DATA_NEEDED] |
| DSP Blocks | 87 | 87 | 87 | 87 | [DATA_NEEDED] | 87 | [DATA_NEEDED] |
| Family | Cyclone V SX (SoC) | Cyclone V SX (SoC) | Cyclone V SX (SoC) | Cyclone V SX (SoC) | Cyclone V SX (SoC) | Cyclone V SX (SoC) | Cyclone V SE (SoC + transceivers) |
| Approx. Qty-1 Price (USD) | 425.00 | 410.00 | 440.00 | 445.00 | 365.00 | 475.00 | 560.00 |
Key Differentiators
- Hard ARM Cortex-A9 dual-core processor subsystem (vs 5CGXBC5C7U19C8N (Cyclone V GX, no HPS))
- Higher logic density (85K LE) in UFBGA-672 with SoC HPS (vs 5CSXFC4C6U23C7N (65K LE Cyclone V SX))
- Cyclone V SX SoC at a lower cost than Cyclone V SE with transceivers (vs 5CSEBA6U23C7N (Cyclone V SE, with transceivers))
Design Notes
The Cyclone V SX device requires multiple independent supply rails: 1.1 V core, 2.5 V analog PLL, 1.5 V DDR3 HPS, and 3.3 V I/O. Per Intel AN 583 (Cyclone V Power Management user guide), the 1.1 V core can draw several amps during FPGA configuration and user-mode operation; use a switching regulator with a power-good output tied to the SoC's nSTATUS or supply-rail sequencing logic to avoid inrush current trips during hot-plug events. Decoupling should follow the Intel Cyclone V device handbook recommendations: 0.1 uF X7R on every power pin pair within 1 mm, plus bulk 22 uF-47 uF polymer caps per power plane.
The 672-ball UFBGA at 1.0 mm pitch demands a 6-layer PCB minimum with microvia stack-ups (laser-drilled 0.1 mm vias) for inner-row breakout. Per Intel AN 522 (Cyclone V Board Design Guidelines), route matched-length DDR3 traces from the HPS memory controller to the SDRAM within +/- 25 ps skew, and keep high-speed FPGA transceiver or LVDS pairs on the outer layers to minimize via stubs. The exposed pads and corner balls are power/ground - do NOT route signals through them and ensure a solid ground plane directly under the BGA for thermal dissipation and return-current continuity.
At full FPGA + HPS utilization (~85K LE utilization plus dual-core 800 MHz Cortex-A9 with DDR3 traffic), the 5CSXFC5C6U23C7N can dissipate 5 W to 8 W depending on toggle rates and I/O activity. The UFBGA-672 has a theta-JA of approximately 8 C/W with a 6-layer JEDEC JESD51 test board, meaning the junction can reach 85C with about 9C ambient rise in still air. For sealed enclosures, add a small heat spreader or thermal pad between the top of the BGA and an enclosure chassis, and use the Intel Quartus Prime PowerPlay early-power estimator during design to budget thermal headroom before PCB fab.
Three pitfalls to avoid on first-time Cyclone V SX designs: (1) Boot mode selection via MSEL pins - check Intel AN 446 (Configuration Handbook) for the exact MSEL strap values for NAND, SD/MMC, and QSPI boot, since incorrect straps cause silent boot failures; (2) HPS pin multiplexing (LX/LY) - the SoC EDS pin-mux tool must be run early to verify peripheral routing because many HPS peripherals share balls; (3) JTAG chain - both the FPGA and the HPS ARM CoreSight have separate JTAG TAPs that must be linked in series for combined debug, requiring a 4-wire JTAG header plus the optional HPS debug header per Intel AN 693.
Compliance Information
RoHS compliant per Intel/Altera product page and DigiKey environmental attribute listings. Lead-free UFBGA packaging (matte-tin or SAC305 balls). Not AEC-Q100 qualified - this is a commercial-grade SoC FPGA; for AEC-Q100 automotive qualified Cyclone V SX parts, an automotive OPN such as 5CSXFC5C6U23I7N may be considered, although AEC-Q100 specifically is not stated for this family.