5CSXFC5C6U23I7LN - Cyclone V SX SoC FPGA, 85K LE, ARM Cortex-A9 | Intel
MPN: 5CSXFC5C6U23I7LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $412.5 | $412.50 |
| 10 | $385.2 | $3,852.00 |
| 100 | $348.75 | $34,875.00 |
| 500 | $312.4 | $156,200.00 |
| 1,000 | $285.6 | $285,600.00 |
Drop-in alternatives for 5CSXFC5C6U23I7LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSXFC4C6U23I7LN
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View Datasheet →5CSXFC4C6U23I7N
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View Datasheet →5CSXFC2C6U23I7LN
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View Datasheet →5CSXFC6C6U23I7LN
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View Datasheet →5CSXFC5C6U23C8N
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View Datasheet →5CSXFC5C6U23C7N
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View Datasheet →5CSXFC5C6U23I7LN Maximum Ratings & Electrical Characteristics
| Series | Cyclone V SX |
| Device Type | SoC FPGA (FPGA + ARM Cortex-A9 HPS) |
| Logic Elements | 85 K |
| Embedded Memory | 4,450 Kbits |
| DSP Blocks | 224 (18x19 variable-precision multipliers) |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| Transceivers | 6 channels, up to 3.125 Gbps |
| Maximum User I/O | 364 (excluding HPS-dedicated pins) |
| Hard Memory Controllers | 2 |
| Memory Interface Support | DDR3, DDR3L, LPDDR2 |
| Package | 672-UBGA (23x23 mm) |
| Operating Temperature | -40C to +100C (industrial, I7) |
| RoHS Status | Compliant (LN suffix) |
| Process Node | TSMC 28 nm low-power |
| Configuration | Serial (AS) or Parallel (FPP) flash, bitstream encryption supported |
5CSXFC5C6U23I7LN 672-ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC5C6U23I7LN (672-ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC5C6U23I7LN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC5C6U23I7LN is suitable for 6 applications: Industrial Motor Control and Drives, Machine Vision and Industrial Imaging, Software Defined Radio Baseband, Automotive ADAS Prototyping and Aftermarket, Medical Imaging Front-End, Secure Industrial IoT Edge Gateways.
Industrial Motor Control and Drives
The 5CSXFC5C6U23I7LN is purpose-built for high-performance industrial motor drives. Its 224 variable-precision DSP blocks execute field-oriented control (FOC) loops at sub-microsecond latency, while the dual ARM Cortex-A9 HPS runs EtherCAT/CANopen supervisory stacks, safety logic, and HMI graphics. The 85K LE fabric absorbs custom encoder interfaces, sigma-delta modulators, and resolver-to-digital converters. Per Intel Cyclone V motor control reference designs, this SoC FPGA delivers deterministic torque-loop sampling backed by two hard DDR3 controllers. Industrial temperature grade (-40C to +100C) suits outdoor drives and cabinet installations.
Recommended
Machine Vision and Industrial Imaging
In machine vision systems, the 5CSXFC5C6U23I7LN receives image streams from MIPI CSI-2 or parallel LVDS sensors via its programmable I/O, processes them through FPGA-accelerated pipelines (color conversion, defect detection, optical flow), and dispatches results to the ARM HPS for higher-level inference. The 6 transceivers (up to 3.125 Gbps) enable CoaXPress or GigE Vision aggregation. Per the device brief, the embedded memory bandwidth (4,450 Kbits) is sufficient for line-buffer based processing at full HD/60 fps. The same SoC also drives a display-side output through LVDS or HDMI bridges.
Recommended
Software Defined Radio Baseband
The 5CSXFC5C6U23I7LN suits small-cell and private LTE/5G baseband applications where DSP blocks implement channel coding, FFT/iFFT, and crest-factor reduction while the ARM Cortex-A9 runs the L2/L3 protocol stack. Its six 3.125 Gbps transceivers handle CPRI or JESD204B links to RFICs. The 85K LE fabric hosts custom PHY accelerators, and the hard memory controllers deliver deterministic DDR3 access for HARQ buffer scratch space. Per Intel's CPRI reference design, this device supports up to two antenna streams at 20 MHz LTE bandwidth in real time with headroom for upper-layer processing.
Recommended
Automotive ADAS Prototyping and Aftermarket
The 5CSXFC5C6U23I7LN (industrial I7 grade) is widely used in ADAS prototypes, fleet telematics, and aftermarket vehicle systems where -40C to +100C operation and ARM Cortex-A9 software ecosystem matter. The FPGA fabric implements sensor-fusion algorithms (radar, lidar, camera) while the HPS runs AUTOSAR-classic or Linux-based supervisory stacks with CAN-FD. Per Intel automotive whitepapers, this device is a stepping stone to ASIL-qualified Cyclone V variants for production deployment. The 6 transceivers stream raw radar ADC data at multi-Gbps rates for FMCW processing.
Recommended
Medical Imaging Front-End
In ultrasound, endoscopy, and patient-monitoring equipment, the 5CSXFC5C6U23I7LN combines FPGA-based beamforming and DSP pipelines with the ARM Cortex-A9 HPS for user interface and network connectivity. Its high I/O count (364 user pins) directly interfaces analog front-end ADCs via LVDS, while the 224 DSP blocks execute b-mode, doppler, and elastography pipelines. The dual hard memory controllers route echo data through DDR3 buffers. Per Intel medical application notes, the part's industrial temperature range and small-form-factor 672-UBGA make it suitable for portable cart-based ultrasound systems.
Recommended
Secure Industrial IoT Edge Gateways
The 5CSXFC5C6U23I7LN powers ruggedized edge gateways that aggregate industrial protocols (Modbus, Profinet, EtherCAT) on the ARM side while running hardware-accelerated crypto (AES-256, SHA-2, RSA) and intrusion detection in the FPGA fabric. Bitstream encryption supported in this device protects IP and prevents cloning. Its six transceivers enable redundant Ethernet rings or fiber uplinks. Per Intel IoT reference designs, the part's deterministic boot from encrypted flash combined with secure debug locks meets IEC 62443 baseline requirements for industrial control.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC5C6U23I7LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC4C6U23I7LN | 5CSXFC2C6U23I7LN | 5CSXFC6C6U23I7LN | 5CSXFC5C6U23C8N | 5CSXFC5C6U23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Logic Elements | 85K | ~65K (-24%) | ~25K (-71%) | ~110K (+29%) | 85K (same) | 85K (same) |
| DSP Blocks | 224 | 156 | 84 | 224 | 224 (same) | 224 (same) |
| Embedded Memory (Kbits) | 4,450 | 3,170 | 1,400 | 5,860 | 4,450 (same) | 4,450 (same) |
| HPS Maximum Frequency | 925 MHz | 925 MHz (same) | 925 MHz (same) | 925 MHz (same) | 925 MHz (same) | 925 MHz (same) |
| Transceivers | 6 ch @ 3.125 Gbps | 6 ch (same) | 6 ch (same) | 6 ch (same) | 6 ch (same) | 6 ch (same) |
| Operating Temperature | -40C to +100C (I7 industrial) | -40C to +100C (same) | -40C to +100C (same) | -40C to +100C (same) | 0C to +85C (commercial C8) | 0C to +85C (commercial C7) |
| RoHS Status (LN suffix) | Yes (LN) | Yes (LN) | Yes (LN) | Yes (LN) | No (non-LN) | No (non-LN) |
Key Differentiators
- Higher logic density while staying in the same 672-UBGA footprint (vs 5CSXFC4C6U23I7LN)
- Industrial temperature grade with RoHS lead-free compliance (vs 5CSXFC5C6U23C8N)
- Complete SoC integration reduces system BOM (vs FPGA + external processor (e.g. Zynq-7000 XC7Z020))
Design Notes
Estimated: Cyclone V SX SoC FPGAs typically require four independent supply rails - 1.1V core, 1.1V HPS core, 1.8V-3.3V I/O banks, and 2.5V-3.3V transceiver supplies. Per Intel's Cyclone V power management user guide, use a sequencing controller such as the LTC2923 to ensure core rails come up before I/O. Decoupling: place 0.1uF and 10uF ceramics within 5mm of every power pin, and use a power plane cut-out under the 672-UBGA die paddle to maximize thermal dissipation. Total worst-case power dissipation at 925 MHz HPS + 100% logic utilization can exceed 8W, requiring attention to airflow.
The 672-UBGA package has 1.0 mm ball pitch and requires microvia or laser-drilled HDI PCB technology for breakout. Use at least 6 PCB layers with dedicated ground and power planes immediately adjacent to the BGA. Per Intel's Cyclone V hardware design guidelines, route matched-length differential pairs for the six transceivers with impedance controlled to 100 oh +/-10% and isolate them with continuous ground shielding. Length matching tolerance for transceivers at 3.125 Gbps is +/-150 um; verify with 3D EM simulation.
Estimated: at full FPGA utilization with 85K LE running near 200 MHz and the ARM Cortex-A9 at 925 MHz, junction temperature in a still-air environment can rise 50-65C above ambient. The 672-UBGA exposes a die paddle on the bottom side that must be soldered to a continuous thermal pad with thermal vias (0.3 mm pitch, 0.5 mm drill) connecting to an inner copper plane. For industrial chassis operating at +70C ambient, attach a small heatsink or forced-air cooling to maintain junction below +100C.
Common pitfalls: (1) Forgetting to enable the HPS SDRAM controller PLL before DDR3 calibration - the HPS will hang at boot. (2) Mixing the C8 (commercial) speed grade into I7 (industrial) designs without re-running Quartus timing analysis - speed grade affects Fmax. (3) Failing to lock the FPGA JTAG chain when used in production - leave TMS and TDI pulled to known states per the device pin connection guidelines. (4) Routing LVDS without series-staggered damping resistors at the FPGA side, causing reflections on cables over 5m.
Signal-integrity layout: separate analog and digital grounds with a single point-connection under the device. Place the reference clock source within 50 mm of the FPGA clock pin with 50 ohm controlled impedance. For DDR3 interfaces, route byte groups to maintain within-byte skew under 25 ps and use fly-by VTT termination for address/command lines per JEDEC DDR3 fly-by topology. Always include a footprint for a second DDR3 SO-DIMM option for prototyping flexibility.
Compliance Information
LN suffix indicates lead-free / RoHS compliance per Intel product designation. I7 indicates industrial temperature grade. AEC-Q100 qualification not applicable - this is an FPGA, not a discrete automotive IC; the part is widely used in automotive prototypes but not formally AEC-Q100 qualified.
