5CSXFC2C6U23I7LN - Cyclone V SX SoC FPGA, 25K LE, 672-UBGA | Intel
MPN: 5CSXFC2C6U23I7LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
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View Datasheet →5CSXFC2C6U23I7LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX |
| Device Type | System-on-Chip (SoC) FPGA |
| Logic Elements | 25K |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 925 MHz |
| Package | 672-pin UBGA (23x23 mm) |
| Process Technology | 28 nm low-power |
| Temperature Grade | Industrial (I7) |
| RoHS Status | Compliant |
| Mounting Style | Surface Mount (SMD/SMT) |
| Number of Cores | 2 |
| Core | ARM Cortex A9 |
5CSXFC2C6U23I7LN 672-pin ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC2C6U23I7LN (672-pin ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC2C6U23I7LN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC2C6U23I7LN is suitable for 8 applications: Industrial Machine Vision Gateway, Closed-Loop Motor Control with FPGA-Accelerated PWM, Portable Medical Instrumentation, Factory Automation Protocol Gateway, Smart Camera and Surveillance Edge Device, Embedded Computing for Avionics and Drones, Broadcast Video Processing, Test and Measurement Instrumentation.
Industrial Machine Vision Gateway
The 5CSXFC2C6U23I7LN's dual ARM Cortex-A9 HPS at 925 MHz is ideal for industrial machine vision gateways where the FPGA fabric pre-processes camera streams and the HPS runs vision inference or routes results to a SCADA network. The 25K logic elements implement MIPI-CSI2 receivers, Bayer demosaicing, and line buffers, while the HPS runs Linux with OpenCV or a vendor SDK for object classification. Compared with discrete CPU + FPGA designs, the SoC integration reduces board area and BOM cost while preserving deterministic real-time performance.
Recommended
Closed-Loop Motor Control with FPGA-Accelerated PWM
The 5CSXFC2C6U23I7LN's Cyclone V SX architecture is purpose-built for closed-loop motor control where the FPGA fabric generates high-resolution PWM and sigma-delta feedback, and the HPS executes field-oriented control (FOC) algorithms in real time. The shared ACP bridge lets the HPS access FPGA-side encoder counters coherently, enabling sub-microsecond control loop latency impossible with separate MCU+FPGA boards. Industrial temperature grade (-40C to +100C) supports servo cabinet and outdoor applications.
Recommended
Portable Medical Instrumentation
The 5CSXFC2C6U23I7LN supports portable medical devices where low-power 28 nm Cyclone V silicon reduces battery drain while providing deterministic FPGA latency for safety-critical signal acquisition. The HPS runs a medical-grade Linux with FDA-traceable boot, while the FPGA implements custom front-end filtering, ECG/EEG DSP, and isolated communication links. Compared with discrete MCU solutions, the SoC FPGA delivers the deterministic response required by IEC 62304 safety class B firmware while running a rich UI on the HPS side.
Recommended
Factory Automation Protocol Gateway
The 5CSXFC2C6U23I7LN's HPS handles PROFINET, EtherCAT, EtherNet/IP, or Modbus TCP protocol stacks on Linux while the FPGA implements deterministic I/O expansion, high-speed counter chains, and motor encoder interfaces. This division of labor eliminates the latency jitter of software-only stacks and provides a unified, scalable platform for industrial PCs and PLCs. The industrial temperature grade ensures 24/7 operation in cabinet environments.
Recommended
Smart Camera and Surveillance Edge Device
The 5CSXFC2C6U23I7LN is well-suited to smart camera edge devices where the FPGA fabric performs sensor pre-processing, image pipeline, and H.264/H.265 encoding while the HPS runs a Linux-based analytics stack with ONNX inference or simple motion detection. The shared on-chip memory bandwidth avoids the PCIe bottleneck of discrete SoC+FPGA boards, and the industrial temperature grade supports outdoor pole-mount deployments.
Recommended
Embedded Computing for Avionics and Drones
The 5CSXFC2C6U23I7LN provides drone flight controllers and small-UAV avionics with deterministic FPGA-side sensor fusion and a Cortex-A9 HPS for high-level mission planning and communication. The 25K logic elements implement PWM, IMU mixing, and GPS fusion in hardware, while the HPS runs autopilot stacks such as PX4 or Ardupilot on Linux. Industrial temperature grade and low-power 28 nm process suit battery-powered flight platforms.
Recommended
Broadcast Video Processing
The 5CSXFC2C6U23I7LN handles broadcast video processing where the FPGA fabric performs SDI/HDMI bridging, color space conversion, and audio embedding while the HPS runs control software and IP-based metadata. The shared bridges let broadcasters manage hybrid SDI-over-IP workflows with deterministic latency. Industrial temperature grade suits equipment-room deployments, and the 25K logic elements are sufficient for single-channel SD/HD pipelines.
Recommended
Test and Measurement Instrumentation
The 5CSXFC2C6U23I7LN fits test and measurement instruments where the FPGA fabric implements high-speed ADC interfacing, FFT engines, and trigger logic, while the HPS runs the user interface and USB/Ethernet connectivity. Compared with oscilloscope designs built around FPGAs only, the SoC HPS removes the need for an external application processor, reducing BOM and PCB area while preserving sub-microsecond acquisition determinism.
Recommended
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Engineering reference data for 5CSXFC2C6U23I7LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC2C6U23C8N | 5CSXFC2C6U23C7N | 5CSXFC2C6U23C6N | 5CSXFC2C6U23A7N | 5CSEBA6U23I7N | 5CSEBA6U23I7LN |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Family | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SE | Cyclone V SE |
| Logic Elements | 25K | 25K | 25K | 25K | 25K | 110K | 110K |
| HPS | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz |
| Temperature Grade | I7 (Industrial, -40C to +100C) | C8 (Commercial, 0C to +85C) | C7 (Commercial, 0C to +85C) | C6 (Commercial, 0C to +85C) | A7 (Automotive) | I7 (Industrial) | I7 (Industrial) |
| Process Node | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
| Lifecycle | Active | Active | Active | Active | Active | Active | Active |
Key Differentiators
- Cyclone V SX family with transceiver-equipped HPS mix (vs 5CSEBA6U23I7N)
- Industrial temperature grade at the same pin footprint (vs 5CSXFC2C6U23C8N)
- Pin-compatible footprint across the 5CSXFC2C6U23xxx family (vs 5CSXFC2C6U23A7N)
Design Notes
The 672-ball UBGA package at 1.0 mm ball pitch requires a high-density PCB stack-up with microvia or via-in-pad technology. Use at least a 6-layer stack with sequential lamination for the breakout region under the BGA, and route signal escapes on the two inner layers adjacent to the top BGA layer. Decoupling capacitors must be placed in the package shadow (under the BGA) using 0201 or 0402 case sizes, with via connections to the ground and power planes directly.
Plan separate power sequencing for the HPS and FPGA rails of the 5CSXFC2C6U23I7LN. The Cyclone V datasheet mandates that the FPGA fabric rails and HPS rails be brought up in a defined order to prevent internal latch-up; the typical sequence is VCC, VCC_HPS, VCC_HPS_IO, VCC_FPGA, VCC_FPGA_IO. Use a multi-rail PMIC such as Intel's Enpirion EM11x family to ensure monotonic ramp and proper fault response.
For high-speed HPS peripheral interfaces (DDR3, USB 2.0, Gigabit Ethernet, RGMII), use length-matched routing with controlled impedance (90 ohm differential for USB; 50 ohm single-ended or 100 ohm differential for RGMII). The Cyclone V HPS has integrated DDR3 controller with DQS centering; perform write/read leveling during board bring-up to validate timing margins.
Estimated: at 1.0 W typical HPS power dissipation plus 0.5 W FPGA fabric (moderate utilization), junction temperature rise above ambient is around 10-15C on a properly designed 6-layer PCB with adequate copper pour. Industrial-grade parts rated to +100C junction still need thermal relief; consider a small BGA-side copper pour or thermal via array under the exposed pads.
Do not assume JTAG accesses both the HPS and FPGA fabric by default - the 5CSXFC2C6U23I7LN has two separate TAP chains (HPS debug and FPGA fabric) that must be selected via the Quartus programmer before flashing firmware. Failing to do so is a common reason for first-time bring-up failures. Also, ensure the HPS configuration source (e.g., QSPI flash or SD card) is correctly wired to the dedicated HPS boot pins, not the FPGA fabric pins.
Compliance Information
RoHS compliant per Altera/Intel product page. The A7 suffix variant is AEC-Q100 qualified for automotive; the I7 variant is industrial-grade but not AEC-Q100. Halogen-free status not stated in the verified web data.