5CSXFC6C6U23I7LN - Cyclone V SX SoC FPGA 110K LE | Altera
MPN: 5CSXFC6C6U23I7LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $180.24 | $180.24 |
| 10 | $162.21 | $1,622.10 |
| 100 | $144.19 | $14,419.00 |
| 500 | $130.67 | $65,335.00 |
| 1,000 | $119.55 | $119,550.00 |
Drop-in alternatives for 5CSXFC6C6U23I7LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSXFC6C6U23I7LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX SoC FPGA |
| Device Variant | 5CSXFC6C6U23 |
| Logic Elements | 110K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 925 MHz |
| Package | 672-UBGA (23x23 mm) |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Technology | 28 nm low-power |
| DSP Blocks | Variable-precision, supports 18x18 and 27x27 multipliers |
| Transceivers | Integrated high-speed transceivers |
| HPS Peripherals | USB, GbE, SD/SDIO/MMC, UART, SPI, I2C |
| Memory Interfaces | DDR3, DDR2, LPDDR2 |
| I/O Standards | LVDS, LVCMOS, SSTL |
| Configuration | HPS boot from NAND/NOR/SD/eMMC; FPGA via Quartus Prime |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
5CSXFC6C6U23I7LN 672-ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC6C6U23I7LN (672-ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC6C6U23I7LN.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC6C6U23I7LN is suitable for 6 applications: Industrial Motor Control, Software Defined Radio (SDR), Medical Imaging Systems, Broadcast Video Processing, Automotive ADAS Prototyping, Factory Automation Controllers.
Industrial Motor Control
The 5CSXFC6C6U23I7LN fits industrial motor control designs because its 110K logic elements, variable-precision DSP blocks, and dual-core ARM Cortex-A9 HPS deliver deterministic FPGA acceleration for field-oriented control (FOC) and space-vector PWM while the HPS runs a real-time Linux or RTOS supervisory layer. The 925 MHz ARM cores handle communication stacks (EtherCAT, PROFINET, CAN) and the FPGA fabric runs encoder decode (EnDat, BISS, SSI) at hardware speeds. The -I7 industrial temperature grade (-40C to 100C) supports factory-floor enclosures, and the 672-UBGA package integrates transceivers for industrial Ethernet. Designers can prototype with the Cyclone V SoC Development Kit and migrate to production PCB.
Recommended
Software Defined Radio (SDR)
The 5CSXFC6C6U23I7LN is well matched to SDR baseband processing because its 110K logic elements, variable-precision DSP blocks, and integrated transceivers deliver the GSample/s rates needed for digital up/down conversion, channelization, and modulation/demodulation. The dual-core ARM Cortex-A9 HPS runs the waveform application stack (GNURadio, srsLTE) while the FPGA fabric handles latency-critical DSP. The 28 nm low-power process keeps SDR boards thermally manageable even at full fabric utilization. The 672-UBGA package is the same as used in production SDR reference designs, simplifying board bring-up.
Recommended
Medical Imaging Systems
The 5CSXFC6C6U23I7LN supports medical imaging (ultrasound, endoscopy, CT) by combining 110K logic elements for high-speed image pipeline processing with the dual-core ARM Cortex-A9 HPS for control plane, DICOM stack, and display composition. The FPGA fabric executes beamforming, FFT, and pixel interpolation at deterministic latency, while the HPS handles user interface and network connectivity. The -I7 industrial temperature grade meets hospital equipment requirements. The 672-UBGA package integrates transceivers for high-speed analog front-end digitizer links, reducing the BOM cost versus a discrete FPGA + processor approach.
Recommended
Broadcast Video Processing
The 5CSXFC6C6U23I7LN suits broadcast video processing because its 110K logic elements and integrated transceivers support SDI I/O (3G-SDI, 6G-SDI, 12G-SDI) at full rate, while the dual-core ARM Cortex-A9 HPS runs video stack and ancillary data. The 28 nm low-power process keeps 4K/8K routing and multiviewer designs thermally manageable. The -I7 industrial temperature grade supports outdoor broadcast equipment. The 672-UBGA package provides the high I/O count required for multi-channel SDI plus Ethernet control.
Recommended
Automotive ADAS Prototyping
The 5CSXFC6C6U23I7LN is a strong prototype platform for automotive ADAS because its 110K logic elements, dual-core ARM Cortex-A9 HPS, and integrated transceivers can run sensor fusion (camera, radar, LiDAR) at sample rates matching production silicon. The HPS executes the AUTOSAR-class application stack while the FPGA fabric handles low-latency perception. For production deployment, the AEC-Q100-qualified 5CSXFC6C6U23A7N (same 672-UBGA package) is the recommended migration path, since the standard -I7LN is qualified only to industrial standards. The 672-UBGA package integrates multiple high-speed sensor interfaces.
Recommended
Factory Automation Controllers
The 5CSXFC6C6U23I7LN fits factory automation controllers (PLCs, PACs, machine vision) because its 110K logic elements can run EtherCAT, PROFINET, and EtherNet/IP slave stacks in hardware while the dual-core ARM Cortex-A9 HPS executes the IEC 61131-3 application logic and HMI. The 925 MHz ARM cores handle web server, OPC-UA, and MQTT connectivity, and the FPGA fabric accelerates machine vision preprocessing at line rate. The -I7 industrial temperature grade meets IEC 61131-2 industrial environmental specs. The 672-UBGA package provides ample I/O for multi-protocol industrial Ethernet plus legacy fieldbus.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC6C6U23I7LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC6C6U23I7N | 5CSXFC6C6U23C8N | 5CSXFC6C6U23C7N | 5CSXFC6C6U23C6N | 5CSXFC6C6U23A7N | 5CSXFC6C6U23C8NES |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Speed Grade | -I7 (industrial, 7 grade) | -I7 (industrial) | -C8 (commercial, slower) | -C7 (commercial) | -C6 (commercial, slowest) | -A7 (automotive) | -C8 (commercial) |
| Temperature Range | -40C to +100C (Industrial) | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +125C (automotive) | 0C to +85C |
| Logic Elements | 110K | 110K | 110K | 110K | 110K | 110K | 110K |
| HPS Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| AEC-Q100 Qualified | No (Industrial only) | No | No | No | No | Yes | No |
| Lead-Free Finish | Yes (LN suffix) | Yes (standard finish) | Yes | Yes | Yes | Yes | Yes (RoHS) |
| Approx Unit Price (qty 1) | $180.24 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade at -7 fabric speed (vs 5CSXFC6C6U23C8N)
- Lead-free finish (LN suffix) for RoHS markets (vs 5CSXFC6C6U23I7N (no LN suffix))
- Highest 110K LE density in the SX SoC family (vs 5CSXFC5C6U23I7N)
Design Notes
The 672-UBGA package uses 0.8 mm ball pitch and requires a 23x23 mm PCB land pattern with via-in-pad or dog-bone fanout. Use a minimum 4-layer stackup with dedicated GND and 0.85V/1.1V/2.5V/3.3V power planes; place bulk decoupling (10uF ceramic per rail) within 5 mm of the BGA balls and high-frequency 0.1uF + 1nF capacitors adjacent to each power ball group. The Cyclone V device datasheet pin tables list per-bank power rail requirements, and Quartus Prime Early Power Estimator must be run before final stackup commit.
Estimated: at full HPS utilization (925 MHz dual core) plus 80% FPGA fabric utilization, the 5CSXFC6C6U23I7LN dissipates approximately 5-8 W depending on toggle rate. The 672-UBGA package has theta_JB of approximately 4 C/W per Altera thermal models; without airflow, junction-to-ambient thermal resistance reaches 15-20 C/W depending on PCB copper. For sustained >5 W operation, attach a heatsink via thermal interface material to the package top, or use a 4 oz copper innerlayer with thermal via array under the BGA thermal balls.
The HPS boot configuration must be set up in Quartus Prime Platform Designer before bitstream generation - failing to lock pin mux assignments (NAND/NOR/SD/eMMC, USB PHY modes, Ethernet PHY interface) results in HPS boot failure that mimics silicon damage. The 5CSXFC6C6U23I7LN requires separate power sequencing: 3.3V must ramp before 2.5V, which must ramp before 1.1V, which must ramp before 0.85V - a violation triggers inrush currents that can collapse the HPS core supply. Use the Altera Enpirion power solution reference designs to avoid sequencing violations.
Compliance Information
RoHS compliant per Altera product page (LN suffix indicates lead-free finish). Not AEC-Q100 qualified - for automotive production, use the 5CSXFC6C6U23A7N which carries AEC-Q100. Halogen-free status not stated in the verified data.