5CSXFC5C6U23C8N - Cyclone V SX SoC FPGA 85K LE 600MHz | Intel
MPN: 5CSXFC5C6U23C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $128.25 | $1,282.50 |
| 100 | $115.8 | $11,580.00 |
| 500 | $104.2 | $52,100.00 |
| 1,000 | $96.75 | $96,750.00 |
Drop-in alternatives for 5CSXFC5C6U23C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSXFC5C6U23C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX |
| Device Variant | 5CSXFC5 (5CSXC5 logic density) |
| Logic Elements | 85,000 |
| Logic Array Blocks (LABs) | 3,207 |
| Maximum User I/O Pins | 145 |
| HPS Processor Cores | Dual ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | 600 MHz |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| Operating Temperature | 0 C to +85 C (commercial) |
| Package | 672-pin UBGAFBGA (23x23 mm) |
| Integrated Transceivers | 3.125 Gbps |
| Hard Memory Controller | DDR3 (HPS side) |
| Speed Grade | C8 |
| Lead-Free / RoHS | Yes |
5CSXFC5C6U23C8N 672-pin ubgafbga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC5C6U23C8N (672-pin ubgafbga (23x23 mm) package) with 145 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC5C6U23C8N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 145 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC5C6U23C8N is suitable for 6 applications: Industrial Machine Vision Systems, Motor Control and Industrial Automation, Video Surveillance and Image Processing, Automotive ADAS Prototyping, Medical Imaging Pre-Processing, Software-Defined Radio and Communication Baseband.
Industrial Machine Vision Systems
The 5CSXFC5C6U23C8N's 85K logic elements and dual ARM Cortex-A9 HPS at 600 MHz make it well-suited for industrial machine vision where high-throughput image processing meets deterministic low-latency control. The integrated HPS runs Linux/Qt for camera configuration, HMI rendering, and Ethernet protocols, while the FPGA fabric accelerates Bayer-to-RGB demosaicing, edge detection, and object classification at line-rate. The 3.125 Gbps transceivers accept GigE Vision or CoaXPress data directly, and the DDR3 controller inside the HPS provides a high-bandwidth frame buffer. Designers should leverage the hard ARM cores to offload command handling from the FPGA fabric, reserving logic resources for pixel pipeline parallelism.
Recommended
Motor Control and Industrial Automation
In motor control applications the 5CSXFC5C6U23C8N combines ARM Cortex-A9 software for higher-level PLC logic and fieldbus protocols (EtherCAT, PROFINET) with FPGA fabric implementing deterministic PWM generation, encoder decoding, and field-oriented control (FOC) loops at sub-microsecond latency. The 145 user I/O pins accommodate multiple encoder interfaces, current-sense ADCs, and gate-driver signals. Industrial temperature variants (5CSXFC5C6U23I7N) extend operation to -40 C to +100 C for factory-floor deployment. Compared with discrete MCU+ASIC designs, the SoC FPGA collapses the BOM and allows firmware updates without spinning new hardware.
Recommended
Video Surveillance and Image Processing
The 5CSXFC5C6U23C8N supports multi-channel HD video pipelines by combining FPGA-side variable-precision DSP blocks for H.264 compression, motion detection, and deinterlacing with the HPS running network stacks and analytics software. Its 3.125 Gbps transceivers interface to MIPI-CSI, HDMI receivers, or Ethernet PHYs; the DDR3 hard controller provides a frame buffer up to 4 Gbit external. At 600 MHz the Cortex-A9 cores handle metadata, ONVIF streaming, and storage management. The UBGAFBGA-672 footprint supports the higher I/O count needed for parallel video buses and SDI serializers.
Recommended
Automotive ADAS Prototyping
The Cyclone V SX family including 5CSXFC5C6U23C8N is widely used in pre-production automotive driver-assistance system (ADAS) prototyping where the dual ARM Cortex-A9 runs sensor-fusion software and the FPGA fabric implements camera/LiDAR pre-processing, sensor timestamping, and low-latency CAN-FD bridging. The integrated 3.125 Gbps transceivers handle automotive Ethernet (100BASE-T1 / 1000BASE-T1) and serializer-deserializer links to remote radar modules. Note: for production AEC-Q100 qualified designs, designers must migrate to the A7 speed grade (5CSXFC5C6U23A7N); the C8 commercial grade is for development and proof-of-concept only.
Recommended
Medical Imaging Pre-Processing
In ultrasound, endoscopy, and patient-monitoring equipment, the 5CSXFC5C6U23C8N delivers deterministic hardware acceleration for beamforming, FFT-based spectral analysis, and noise filtering while the ARM cores handle DICOM packaging, touchscreen UI, and USB/Ethernet connectivity. The FPGA fabric's variable-precision DSP blocks enable single-cycle multiply-accumulate for FIR/IIR filter chains, and the HPS DDR3 controller buffers raw RF data streams at gigabytes per second. Compared with DSP-only or MCU-only designs, the SoC FPGA reduces latency between beamformer and display, which is critical in real-time ultrasound. Commercial-grade (C8) suits bedside cart equipment; the I7 variant is needed for unattended or sterilizable enclosures.
Recommended
Software-Defined Radio and Communication Baseband
The 5CSXFC5C6U23C8N is widely deployed in small-cell, femtocell, and private-LTE baseband prototyping because its 3.125 Gbps transceivers digitize RF I/Q streams from front-end converters, while the FPGA fabric implements channel coding (Turbo, LDPC), FFT/IFFT for OFDM, and crest-factor-reduction filters at line rate. The dual ARM Cortex-A9 host the L2/L3 stack, MAC scheduler, and OAM agent, connected to the FPGA via AXI bridges with multi-gigabyte-per-second throughput. Compared with discrete ASIC + NPU designs, the SoC FPGA allows late-binding standard updates (e.g., 5G NR features) without silicon respin, critical for private-network rollouts.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC5C6U23C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC5C6U23C7N | 5CSXFC5C6U23C6N | 5CSXFC5C6U23I7N | 5CSXFC4C6U23C8N | 5CSXFC5C6U23A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGAFBGA (U23, 23x23 mm) | 672-UBGAFBGA (U23, 23x23 mm) - same | 672-UBGAFBGA (U23, 23x23 mm) - same | 672-UBGAFBGA (U23, 23x23 mm) - same | 672-UBGAFBGA (U23, 23x23 mm) - same | 672-UBGAFBGA (U23, 23x23 mm) - same |
| Logic Elements | 85,000 | 85,000 | 85,000 | 85,000 | ~65,000 (-24%) | 85,000 |
| HPS Processor Cores | Dual ARM Cortex-A9 600 MHz | Dual ARM Cortex-A9 ~925 MHz device perf | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | C8 (commercial) | C7 (faster) | C6 (slower, lower cost) | I7 (industrial -40C to +100C) | C8 (commercial) | A7 (automotive AEC-Q100) |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | -40 C to +125 C (automotive) |
| Process Technology | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power | 28 nm TSMC low-power |
| Transceivers (max) | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| RoHS / Lead-Free | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature option in same package (vs 5CSXFC5C6U23C8N (commercial) vs 5CSXFC5C6U23I7N (industrial))
- Drop-in C7 speed grade upgrade path (vs 5CSXFC5C6U23C8N vs 5CSXFC5C6U23C7N)
- Automotive-grade variant available (vs 5CSXFC5C6U23C8N (commercial) vs 5CSXFC5C6U23A7N (AEC-Q100))
Design Notes
The 672-ball UBGAFBGA at 23x23 mm requires a high-density PCB stack-up. Use at least 8 layers with 1.0-1.5 mm pitch microvia stack-ups (laser-drilled vias with sequential lamination). Assign a solid ground plane directly beneath the BGA and stitch ground vias around the perimeter to provide a low-impedance return path for transceivers and DDR3 signals. Matched-length routing within +/-25 mils is required for DDR3 byte lanes; use the Quartus Prime pin planner early to constrain I/O bank placement.
Estimated: at full HPS + 70% FPGA utilization, the 5CSXFC5C6U23C8N dissipates approximately 3-5 W total. With theta_JA around 15-20 C/W for the UBGAFBGA-672 package (depends on PCB copper area), junction temperature rise above ambient is roughly 50-90 C. For commercial (C8) at 85 C ambient this leaves little margin; for industrial (I7) at 100 C ambient, add a small heatsink or thermal via array under the package thermal pad. Use the Quartus Prime PowerPlay early estimator for accurate budgeting.
Do not confuse the '5CSXFC5' device variant with the '5CSEBA5' (Cyclone V SE SoC) - both have HPS but the SX family has integrated transceivers while the SE family has more logic and DSP. Verify your design needs SX transceivers before selecting. Also, the C8 speed grade is commercial only - for production hardware with industrial temperature requirements, switch to I7 or I8 before PCB fab; C8 parts will fail screening at temperature extremes.
Compliance Information
The C8 speed grade is commercial grade and not AEC-Q100 qualified; migrate to the A7 variant (5CSXFC5C6U23A7N) for automotive production. RoHS/REACH/halogen-free status per Intel material declaration. CMRT available from Intel Product Compliance portal.
