10AX090S2F45I2SG - Arria 10 GX FPGA, 900K LE, F45 BGA | Intel
MPN: 10AX090S2F45I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4610 | $46,100.00 |
| 100 | $4280 | $428,000.00 |
| 500 | $3995 | $1,997,500.00 |
| 1,000 | $3750 | $3,750,000.00 |
Drop-in alternatives for 10AX090S2F45I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX090S2F45I2LG
✅ Drop-In✓ In Stock
$3800 / Unit
View Datasheet →10AX090S2F45I1SG
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$3620 / Unit
View Datasheet →10AX090S2F45E2SG
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$2050 / Unit
View Datasheet →10AX090S2F45E2LG
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$3750 / Unit
View Datasheet →10AX090S2F45E1SG
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$4890 / Unit
View Datasheet →10AX090S1F45I1SG
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$3890 / Unit
View Datasheet →10AX090S2F45I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory Bits | 59,234,304 |
| User I/O Pins | 624 |
| Package | 1932-ball FCBGA (F45) |
| Transceiver Speed | Up to 12.5 Gbps |
| Hard Memory Controller | Yes (DDR4/DDR3/QDRIV) |
| PCI Express Hard IP | Gen3 |
| DSP Blocks | Variable-precision |
| PLLs | 24 fractional |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Node | 20 nm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10AX090S2F45I2SG 1932-ball fcbga (f45) Pin Configuration Guide
Complete pinout information for 10AX090S2F45I2SG (1932-ball fcbga (f45) package) with 624 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090S2F45I2SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 624 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090S2F45I2SG is suitable for 6 applications: 10 Gigabit Ethernet Network Interface, Wireless Baseband Signal Processing, Radar Signal Processing, ASIC Prototyping Platform, Medical Imaging Accelerator, Broadcast Video Processing.
10 Gigabit Ethernet Network Interface
The 10AX090S2F45I2SG's 12.5 Gbps transceivers and hard PCIe Gen3 IP make it ideal for 10 Gigabit Ethernet NIC implementations. The 900K logic elements provide sufficient fabric for MAC, PTP timestamping, and packet processing while transceivers handle SFP+ connectivity directly. Hard PCIe Gen3 x8 endpoints enable 64 Gbps host interconnect typical for HPC and data center offload cards. Designers benefit from hardened IP blocks that reduce soft logic utilization by 30-40% compared to fully soft implementations. The industrial temperature grade supports edge networking equipment deployments where thermal headroom may be limited in sealed enclosures. The device operates at 1.2V core with multiple auxiliary rails requiring careful power sequence design, and the high-density FCBGA package requires multi-layer PCB with microvia technology for escape routing.
Recommended
Wireless Baseband Signal Processing
The Arria 10 GX 10AX090S2F45I2SG is well-suited for LTE and 5G NR baseband processing due to its variable-precision DSP blocks supporting both fixed-point and floating-point operations. The 12.5 Gbps transceivers enable CPRI and eCPRI fronthaul interfaces for connecting to remote radio units, while 900K logic elements accommodate multi-antenna processing for 4x4 MIMO configurations. Hard memory controllers support DDR4 interfaces for high-bandwidth sample buffering required in OFDM demodulation pipelines. Industrial temperature grade enables outdoor small-cell deployments in controlled enclosures. The 20nm process delivers performance-per-watt suitable for macro base stations where power consumption directly affects operating costs. Engineers can leverage Intel DSP Builder and OpenCL SDK for algorithm acceleration without writing RTL.
Recommended
Radar Signal Processing
Radar systems benefit from the 10AX090S2F45I2SG's high DSP throughput and 12.5 Gbps transceiver bandwidth for ADC/DAC interfacing. The variable-precision DSP blocks accelerate FFT operations critical for pulse-Doppler processing, while 59 Mbits embedded memory provides sample buffering between ADC capture and processing stages. JESD204B interfaces connect to high-speed ADCs commonly used in phased array radar front-ends. Industrial temperature grade supports defense and weather radar installations operating in uncontrolled environments. The 900K logic elements accommodate beamforming algorithms for active electronically scanned arrays (AESA) with 64+ elements. Hard PCIe Gen3 enables high-bandwidth data export to host processors for display and recording subsystems.
Recommended
ASIC Prototyping Platform
The 10AX090S2F45I2SG serves as a high-capacity ASIC prototyping vehicle with 900K logic elements sufficient for partition-based prototyping of mid-complexity ASIC designs. Hard memory controllers and PCIe Gen3 IP allow prototype validation of ASIC subsystems in realistic I/O scenarios. Multiple FPGAs can be ganged for larger ASIC prototypes using the 12.5 Gbps transceivers for inter-FPGA interconnect. Industrial temperature grade supports validation under environmental stress conditions required for aerospace and automotive ASIC qualification. The 20nm process node provides timing characteristics representative of many contemporary ASIC technologies, improving prototype-to-silicon correlation. Quartus Prime software supports industry-standard synthesis flows and ASIC prototyping methodologies.
Recommended
Medical Imaging Accelerator
Medical imaging systems leverage the 10AX090S2F45I2SG's parallel DSP architecture for real-time CT, MRI, and ultrasound image reconstruction algorithms. The 900K logic elements and 59 Mbits embedded memory support cone-beam back-projection, iterative reconstruction, and beamforming pipelines. PCIe Gen3 x8 enables 64 Gbps host throughput for continuous image data streaming from detector arrays. 12.5 Gbps transceivers connect to high-speed digitizers and display subsystems. Industrial temperature grade supports integration in medical cart and fixed installation environments. The variable-precision DSP blocks accelerate floating-point reconstruction algorithms with reduced power consumption compared to GPU-based solutions. IEC 62304 compliance support is available through Intel documentation for medical device developers.
Recommended
Broadcast Video Processing
Broadcast video infrastructure benefits from the 10AX090S2F45I2SG's high-speed transceivers for SDI, HDMI, and DisplayPort interfacing, plus DSP blocks for real-time video codec and format conversion. The 900K logic elements support multi-channel 4K processing with HDR metadata handling and color space conversion. Hard PCIe Gen3 enables integration with broadcast servers and IP-based production workflows using SMPTE ST 2110 standards. 12.5 Gbps transceivers support 12G-SDI for uncompressed 4K video transport. Industrial temperature grade ensures reliability in studio and outside broadcast vehicle environments. The 59 Mbits embedded memory provides frame buffering for deinterlacing, scaling, and overlay operations without external memory pressure.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090S2F45I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090S2F45I2LG | 10AX090S2F45I1SG | 10AX090S2F45E2SG | 10AX090S2F45E2LG | 10AX090S2F45E1SG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | -2 | -2L (lower power) | -1 (slower) | -2 | -2L | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended | Extended | Extended |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
| User I/O Pins | 624 | 624 | 624 | 624 | 624 | 624 |
| Transceiver Speed | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| Approximate Price (qty 1) | $4,850 | $4,650 | $4,420 | $5,100 | $4,890 | $4,650 |
Key Differentiators
- Hardened PCIe Gen3 IP blocks save 30-40% logic utilization (vs 10AX090S2F45I1SG)
- Industrial temperature range for harsh environments (vs 10AX090S2F45E2SG)
- Highest speed grade -2 in Arria 10 GX 900K family (vs 10AX090S2F45I2LG)
- Full 12.5 Gbps transceiver capability (vs Lower density Arria 10 (10AX048))
Design Notes
The 1932-ball FCBGA F45 package requires a substrate with high-density ball fanout, typically using 12-16 layer PCB with microvia technology. Junction temperature monitoring via the built-in temperature-sensing diode (TSENSE) is mandatory for industrial applications. At full utilization with 900K LE and active transceivers, power dissipation can exceed 25W, requiring thermal vias, copper heat spreaders, or active heatsinking. Thermal design should target junction temperature below 100C for industrial grade operation with adequate margin. PCB design guidelines from Intel specify 6 thermal vias minimum under the center thermal balls.
Power delivery for the 10AX090S2F45I2SG requires multiple regulated rails: 1.2V core (VCC, VCCP), 0.9V transceiver supply, 1.8V/2.5V/3.0V auxiliary voltages, and dedicated PLL analog supplies. Each rail must have bulk decoupling plus high-frequency ceramic capacitors placed close to the BGA balls. Power sequencing must follow Intel Arria 10 PowerPlay guidelines to prevent latch-up during startup. Estimate: at typical operating conditions (60% utilization, 8 active transceivers), total power is approximately 18-22W. Voltage regulators must supply transient currents exceeding 20A on the 1.2V core rail with adequate headroom.
PCB design for the F45 1932-ball BGA requires escape routing for 1.0mm pitch BGA using microvia (HDI) technology. Layer stackup should provide minimum 4 routing layers with dedicated ground and power planes. Differential pairs for transceivers must maintain 100 ohm differential impedance with matched lengths within 150 mil. Configuration pins require external pull-up/pull-down resistors per Intel pin connection guidelines. JTAG chain integration must include TCK, TMS, TDI, TDO, and TRST signals with proper buffering for multi-device chains. Recommended: 14-layer stackup with 2 signal layers above core, 4 below, and dedicated reference planes for transceiver signals.
Transceiver channel performance at 12.5 Gbps requires strict signal integrity discipline. Loss budget for PCB traces must not exceed 6 dB at 6.25 GHz Nyquist frequency. Use Megtron 6 or similar low-loss PCB material for long transceiver routes (>5 inches). Pre-emphasis and equalization settings in the Arria 10 GX transceiver toolkit must be tuned per channel using IBIS-AMI models. Reference clock distribution requires low-jitter oscillator (<100 fs RMS) with proper impedance-controlled routing to dedicated clock input pins. DC-blocking capacitors on transceiver channels must be 0402 size with broadband performance (100nF X7R minimum).
Common pitfalls when designing with the 10AX090S2F45I2SG include: (1) Using wrong configuration mode - must use MSEL pins correctly for AS (Active Serial) or JTAG; (2) Failing to implement proper reset sequencing - nCONFIG, nSTATUS, and CONF_DONE require specific timing; (3) Inadequate decoupling - bulk capacitors must be within 100 mil of corresponding power balls; (4) Thermal runaway - junction temperature must be monitored via TSENSE ADC; (5) Transceiver reference clock issues - improper clock distribution causes bit errors. Always consult Intel Arria 10 documentation for full design checklist before tape-out.
Compliance Information
RoHS compliant per manufacturer datasheet. Industrial temperature grade supports -40C to +100C operation. AEC-Q100 qualification not applicable for FPGAs; for automotive applications consult Intel automotive-grade product portfolio.
