10AX090S4F45I3SG - Arria 10 GX FPGA 900K LE, 1932-FCBGA
MPN: 10AX090S4F45I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5906.32 | $5,906.32 |
| 10 | $5650 | $56,500.00 |
| 50 | $5300 | $265,000.00 |
| 100 | $4980 | $498,000.00 |
| 500 | $4520 | $2,260,000.00 |
Drop-in alternatives for 10AX090S4F45I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090S4F45I3LG
✅ Drop-In✓ In Stock
$6050 / Unit
View Datasheet →10AX090S4F45E3LG
✅ Drop-In✓ In Stock
$4582.63 / Unit
View Datasheet →10AX090S3F45I2SG
✅ Drop-In✓ In Stock
$4563.74 / Unit
View Datasheet →10AX090S3F45I2LG
✅ Drop-In✓ In Stock
$4050 / Unit
View Datasheet →10AX090S2F45I2SG
✅ Drop-In✓ In Stock
$3750 / Unit
View Datasheet →10AX090S2F45E2SG
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →10AX090S4F45I3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| Maximum User I/O | 624 |
| Process Technology | TSMC 20nm Tri-Gate |
| Hard Processor System (HPS) | Integrated (dual-core ARM Cortex-A9 MPCore) |
| Memory Controllers | Hardened DDR4/DDR3/QDR-IV controllers |
| Package | 1932-ball FCBGA, F45 (45mm) |
| Speed Grade | -3 (commercial fast / industrial fast) |
| Temperature Grade | Industrial (-40C to +100C junction) |
| Configuration | Active serial (AS) / passive serial (PS) / JTAG |
| Mounting Type | Surface Mount (HDI required) |
| RoHS Status | Compliant |
| REACH Status | Compliant |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| Design Tool | Intel Quartus Prime |
10AX090S4F45I3SG 1932-ball fcbga, f45 (45mm) Pin Configuration Guide
Complete pinout information for 10AX090S4F45I3SG (1932-ball fcbga, f45 (45mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090S4F45I3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090S4F45I3SG is suitable for 6 applications: Wireless Baseband Processing, 10G/40G Ethernet Aggregation, Military Secure Communications, High-Performance Computing Acceleration, Video Broadcast and Studio Infrastructure, Industrial Automation and Machine Vision.
Wireless Baseband Processing
The 10AX090S4F45I3SG fits wireless baseband processing because its 900K logic elements and high-speed transceivers (up to 12.5 Gbps per channel) can handle multiple CPRI/OBSAI links simultaneously alongside baseband DSP functions. In typical LTE or 5G NR base station designs, the device performs FFT/iFFT, channel coding/decoding, and digital up/down-conversion. The industrial temperature range supports outdoor radio units mounted on cell towers. Compared to ASICs, the FPGA design flexibility allows late-stage algorithm updates for evolving 3GPP standards.
Recommended
10G/40G Ethernet Aggregation
The 10AX090S4F45I3SG serves as a network aggregator or smart-NIC because it combines multiple 10G Ethernet MACs with custom packet-processing pipelines in a single device. The integrated transceivers handle 10G BASE-R PHY interfaces without external gear, while the 900K logic elements provide headroom for protocol offloads (e.g., VxLAN, Geneve, IPSec). Industrial temperature allows deployment in carrier-grade equipment rooms. Quartus Prime includes MAC, PCS, and Interlaken IP cores that accelerate design-in for network OEMs.
Recommended
Military Secure Communications
The 10AX090S4F45I3SG fits military secure radio systems where high DSP throughput, encryption acceleration, and extended operating temperature are required simultaneously. The integrated transceivers support tactical radio waveforms including wideband HF/VHF/UHF links, while the 59 Mbits of embedded memory hold pre-computed crypto tables and waveform samples. Industrial temperature grade handles the -40C to +100C envelope typical of vehicle-mounted and dismounted radio platforms. FPGA-based designs allow for SUO/SUA modifications throughout the platform lifecycle.
Recommended
High-Performance Computing Acceleration
The 10AX090S4F45I3SG is well suited as an OpenCL/CUDA-style compute accelerator for HPC workloads because it offers 900K logic elements plus 288 DSP blocks (Arria 10 typical for 090 family) that can execute parallel arithmetic. Industrial temperature makes it viable for lab and datacenter-adjacent HPC clusters. Compared to GPU acceleration, the FPGA approach provides deterministic latency and lower per-watt performance for streaming workloads such as financial Monte Carlo simulation or genomic sequence alignment.
Recommended
Video Broadcast and Studio Infrastructure
The 10AX090S4F45I3SG handles uncompressed video processing for broadcast and studio applications because its transceiver bandwidth and DSP resources can sustain 4K/8K video pipelines at 60 fps. Typical use cases include SDI-to-IP gateways (SMPTE ST 2110), video walls, and HDR/WCG color-space converters. Industrial temperature supports broadcast equipment rooms with variable HVAC conditions. Quartus Prime's video and image processing IP suite (VIP) provides ready-made scalers, deinterlacers, and color converters.
Recommended
Industrial Automation and Machine Vision
The 10AX090S4F45I3SG drives multi-camera machine vision inspection systems because its 900K LE provide ample parallelism for image preprocessing, defect detection, and conveyor line synchronization. Integrated transceivers support CoaXPress, Camera Link, and GigE Vision aggregation. Industrial temperature allows deployment on factory floors where ambient temperature may swing with production cycles. The FPGA approach enables rapid iteration on proprietary vision algorithms without expensive ASIC NRE.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090S4F45I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090S4F45I3LG | 10AX090S4F45E3LG | 10AX090S3F45I2SG | 10AX090S2F45I2SG |
|---|---|---|---|---|---|
| Package | 1932-ball FCBGA F45 | 1932-ball FCBGA F45 - same | 1932-ball FCBGA F45 - same | 1932-ball FCBGA F45 - same | 1932-ball FCBGA F45 - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | -3 | -3 | -3 | -2 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| Maximum User I/O | 624 | 624 | 624 | 624 | 624 |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature grade at fastest speed bin (vs 10AX090S4F45E3LG)
- Highest speed grade option in Arria 10 family (vs 10AX090S3F45I2SG)
- Lead-free shipping designation compatibility (vs 10AX090S4F45I3SG vs LG variant)
Design Notes
The 1932-ball FCBGA F45 package has a 1.0mm ball pitch and requires a high-density interconnect (HDI) PCB stack-up with microvias or laser-drilled vias to fan out from the inner balls. Use a 1-2-1 or 2-4-2 HDI stack-up with at least 4 build-up layers. Outer-layer pad diameter and via-in-pad designs must follow Intel's recommended land patterns in the Arria 10 package documentation. Failure to use HDI will result in breakout routing errors and signal integrity degradation.
Estimated: at typical operation (50% logic utilization, mid transceivers), the 10AX090S4F45I3SG consumes ~25-35W. The device requires a multi-rail power delivery network: 0.9V core (SmartVID), 1.2V/1.5V/2.5V/3.3V I/O banks, separate analog rails for transceivers (1.0V, 1.5V), and an auxiliary rail. Use Intel's PowerPlay Early Power Estimator (EPE) spreadsheet for board-level power budget. Decoupling capacitors must be placed as close as possible to the BGA balls with short, wide traces.
Industrial-grade Arria 10 FPGAs support up to +100C junction temperature but require careful thermal management above 20W total power dissipation. The 1932-ball FCBGA package relies on a heat spreader attached via thermal interface material (TIM). For high-power designs, integrate a heatsink or active cooling. Estimated junction-to-ambient thermal resistance for a typical 4-layer board with heat spreader is 1.5-2.5 C/W; verify with the Arria 10 thermal characterization data before finalizing cooling design.
Do not assume generic BGA layout rules apply - the Arria 10 F45 pinout has signal integrity constraints for transceiver channels, including length matching within a transceiver bank and impedance-controlled routing for high-speed serial links. Mis-mating transceiver pin pairs will cause bit error rates at 10 Gbps+ that are very difficult to debug post-layout. Use Quartus Prime pin planner to validate all assignments before generating the bitstream. Configuration mode pins (MSEL) must be set correctly or the device will not boot.
Compliance Information
RoHS and REACH compliance confirmed by lead-free 'G' suffix in MPN. AEC-Q100 not applicable for FPGAs (different qualification standard applies). Intel publishes full material declaration (FMD) documents for this family upon customer request.
