A3P250-2FGG144 - ProASIC3 Flash FPGA 250K Gates | Microchip
MPN: A3P250-2FGG144 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $34.1 | $3,410.00 |
| 500 | $30.6 | $15,300.00 |
| 1,000 | $27.8 | $27,800.00 |
A3P250-2FGG144 Overview
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than an external configuration ROM. Within the digital logic hierarchy, it sits as a programmable logic device -> FPGA -> programmable SoC platform component. Because the configuration is retained in flash, ProASIC3 devices power up instantly with no external boot device, are inherently single-chip solutions, and are resistant to configuration corruption from radiation or power glitches.
Key features of the A3P250-2FGG144 include its 130 nm flash process technology for low static power, speed grade -2 performance up to 310 MHz for system-level timing closure, 97 user I/Os supporting common single-ended standards, and reprogrammability that eliminates obsolete-configuration risk in fielded systems. Microchip also lists low total cost of ownership and optional soft ARM support for the ProASIC3 family.
Architecturally, ProASIC3 combines versatile fabric tiles with flash-based switching and logic elements, delivering deterministic routing and secure, live-at-power-up operation. The absence of a configuration bitstream load time improves system availability, and on-chip flash enables secure field upgrades without an external flash memory on the PCB.
Typical applications include industrial control and automation, bridging and glue logic consolidation, portable and space-constrained instrumentation, and secure boot or configuration-management functions where instant-on operation is mandatory.
Design consideration: the 1.5 V core requires a clean, low-noise core rail with proper decoupling, and the FBGA-144 land pattern demands careful BGA rework capability; confirm bank I/O voltage assignments early in pin planning.
This page synthesizes distributor pricing and stock signals, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for A3P250-2FGG144 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with A3P250-2FGG144 (same form factor and footprint) — differing in Package, System Gates, Process Technology, RoHS Status, Configuration Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P250-FGG144I
✅ Drop-In✓ In Stock
$14.06 / Unit
View Datasheet →A3P250-1FGG144T
✅ Drop-In✓ In Stock
$19.2 / Unit
View Datasheet →A3P250-1FG144T
✅ Drop-In✓ In Stock
$28.9 / Unit
View Datasheet →A3P250-FG144T
✅ Drop-In✓ In Stock
$28.6 / Unit
View Datasheet →A3P060-2FGG144
✅ Drop-In✓ In Stock
$5.62 / Unit
View Datasheet →A3P600-2FGG144
✅ Drop-In✓ In Stock
$30.4 / Unit
View Datasheet →A3P250-2FGG144 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 Flash FPGA |
| System Gates | 250K |
| User I/Os | 97 |
| Configuration Memory | 36864 (on-chip flash) |
| Speed Grade | -2 |
| Maximum System Performance | 310 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Package | 144-LBGA (FBGA-144) |
| Mounting Style | SMD/SMT |
| Operating Temperature (Min) | 0 C |
| Operating Temperature (Max) | +70 C |
| Packaging | Tray |
| Soft ARM Support | Yes (optional, ProASIC3 family) |
| Configuration Type | Flash (single-chip, live at power-up) |
| Reprogrammability | Yes (in-system reprogrammable) |
A3P250-2FGG144 144-lbga (fbga-144) Pin Configuration Guide
Pin configuration for A3P250-2FGG144 (144-lbga (fbga-144) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P250-2FGG144.
Refer to the datasheet for full pin configuration.
Typical Applications
A3P250-2FGG144 is suitable for 6 applications: Industrial Control and Automation, Bridge and Glue Logic Consolidation, Secure Boot and Configuration Management, Portable and Battery-Powered Instrumentation, Test and Measurement Equipment, Aerospace-Adjacent and High-Reliability Prototyping.
Industrial Control and Automation
The A3P250-2FGG144 fits industrial control applications because its 250K gates and 97 user I/Os consolidate PLC I/O interfaces, sequencers, and glue logic that would otherwise span multiple discrete devices, while the 310 MHz speed grade -2 fabric comfortably meets typical industrial control-plane timing. Its on-chip flash configuration is a decisive advantage in electrically noisy factory environments: the FPGA is live at power-up with no external configuration flash that could be corrupted by brownouts or EMI events. Used as a single-chip control hub between sensors, motor drivers, and a host CPU, it reduces BOM count and configuration-management burden, though designers must respect the commercial 0 C to +70 C operating range or select the industrial-suffix A3P250-FGG144I instead.
Recommended
Bridge and Glue Logic Consolidation
The A3P250-2FGG144 excels at bridging incompatible interfaces - legacy buses to modern processors, parallel to serial transitions, and voltage-domain crossings - because its 97 user I/Os are organized in banks that support common single-ended standards on the 130 nm flash platform. At speed grade -2 with 310 MHz-class fabric performance, it closes timing on typical bridge pipelines with margin. Unlike SRAM FPGAs, its flash configuration means the bridge is functional within milliseconds of power application, eliminating boot-order dependencies between the two domains being bridged. The trade-off is capacity: 250K gates is ample for protocol adaptation but not for heavy DSP; designs exceeding roughly 60-70% utilization in Libero SoC should step up to the pin-compatible A3P600-2FGG144 on the same FBGA-144 footprint.
Recommended
Secure Boot and Configuration Management
Because the A3P250-2FGG144 stores its bitstream in on-chip flash, it is inherently suited to secure and tamper-resistant designs: there is no external configuration read-out during boot, and Microchip's flash FPGA architecture resists configuration sniffing that afflicts SRAM-based devices which load bitstreams from external SPI flash. In a secure boot chain, this FPGA can act as the root-of-trust sequencer, gating power or holding subordinate processors in reset until integrity checks pass. The 250K-gate fabric implements hash engines and simple state machines with room to spare, and the 1.5 V core with 130 nm flash technology keeps static power low for always-on monitoring. Designers should still verify compliance documentation by date code on the Microchip compliance portal.
Recommended
Portable and Battery-Powered Instrumentation
The A3P250-2FGG144 suits portable instrumentation because 130 nm flash technology yields very low static current on the 1.5 V core rail - a key advantage over SRAM FPGAs that require constant configuration retention power. The FBGA-144 package occupies a small footprint for space-constrained boards, and the single-chip design removes the external configuration flash that adds height and BOM cost to handheld assemblies. Its 97 I/Os directly interface LCD segments, keypads, and sensor arrays without additional glue logic. The main design constraint is thermal and supply budgeting: dynamic switching current in the 250K-gate fabric should be estimated in Libero SmartPower, and the commercial 0 C to +70 C range must match the product's environmental specification.
Recommended
Test and Measurement Equipment
In test and measurement hardware, the A3P250-2FGG144 provides deterministic, instantly-available control fabric for trigger logic, counter/timer arrays, and front-panel interfacing. The 310 MHz speed-grade -2 fabric handles high-frequency counter and event-capture paths, while 97 user I/Os connect ADCs, comparators, and display subsystems. Flash configuration means the instrument is ready the moment power is applied - important for bench instruments expected to boot instantly and for production fixtures cycled thousands of times per day. The 250K-gate capacity is appropriate for control and capture logic; signal-processing-heavy designs should pair the FPGA with a dedicated DSP such as the TMS320F28027PTT rather than trying to implement DSP in the A3P250 fabric.
Recommended
Aerospace-Adjacent and High-Reliability Prototyping
Flash-based ProASIC3 devices are widely used in high-reliability system prototyping because on-chip flash configuration is inherently more tolerant of radiation-induced configuration upsets than SRAM configuration memory, and no external bitstream load window exists during which the device is vulnerable. While the commercial-grade A3P250-2FGG144 itself is rated 0 C to +70 C and is intended for prototyping and ground equipment rather than flight hardware, it lets teams validate logic that will later be mapped to higher-grade family members with the same toolchain (Microchip Libero SoC). The 250K gates, 97 I/Os, and 310 MHz fabric performance cover typical telemetry formatting, sequencing, and interface emulation tasks encountered in early-phase avionics development programs.
Recommended
Recommended Products Summary
Engineering reference data for A3P250-2FGG144 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P250-FGG144I | A3P250-1FGG144T | A3P060-2FGG144 | A3P600-2FGG144 |
|---|---|---|---|---|---|
| Package | FBGA-144 | FBGA-144 - same | FBGA-144 - same | FBGA-144 - same | FBGA-144 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250K | 250K | 250K | 60K | 600K |
| Speed Grade | -2 | Standard / -2 class | -1 | -2 | -2 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to +70 C | Industrial (-40 C to +100 C) | 0 C to +70 C (T-grade commercial) | Commercial | Commercial |
| Configuration Memory | On-chip flash, 36864 | On-chip flash, same | On-chip flash, same | On-chip flash (smaller) | On-chip flash (larger) |
Key Differentiators
- Commercial-grade -2 speed at lowest family cost (vs A3P250-FGG144I)
- One timing grade faster than -1 variants (vs A3P250-1FGG144T)
- Right-sized 250K-gate capacity (vs A3P600-2FGG144)
- Single-chip live-at-power-up configuration (vs SRAM-based FPGAs)
Design Notes
The A3P250-2FGG144 requires a regulated 1.5 V core rail. Estimate dynamic current with Microchip Libero SmartPower after place-and-route; static current of the 130 nm flash fabric is very low, so dynamic switching dominates. Decouple each FBGA power ball field with multiple 100 nF X7R ceramics plus at least one 10 uF bulk capacitor per rail. Ensure the core rail powers up monotonically before or together with I/O bank rails to avoid latch-up or I/O contention during configuration, which is held in on-chip flash.
The FBGA-144 land pattern follows the ProASIC3 family datasheet package drawing; use non-solder-mask-defined (NSMD) pads and verify ball pitch against the datasheet before fab. Via-in-pad or dog-bone escape is required for inner balls - plan at least one signal layer dedicated to BGA escape. Because this is a flash FPGA, reserve JTAG access on the PCB for in-system programming; do not share the JTAG chain with unpowered domains that could clamp TCK/TMS levels during board bring-up.
Three frequent mistakes with this part: (1) ignoring the commercial 0 C to +70 C range in outdoor or enclosure designs - specify A3P250-FGG144I instead if ambient can exceed 70 C; (2) underestimating timing closure margin when substituting speed grade -1 parts (A3P250-1FGG144T) for the -2 device - always re-run static timing in Libero SoC; (3) planning the FBGA-144 for a design that exceeds ~70% fabric utilization, leaving no routing slack - migrate to the pin-compatible A3P600-2FGG144 early rather than late.
Assign I/O banks early in Libero SoC against the physical FBGA-144 ball map so that voltage-referenced standards are grouped correctly; mixing incompatible standards in one bank is the most common cause of respins. Keep configuration/JTAG balls routed short and away from switching regulator nodes, and provide test points on VCCA and VCCI rails for production current profiling.
Compliance Information
Suffix-specific RoHS/REACH status must be confirmed on the Microchip product compliance portal by date code; the provided web data does not include explicit compliance statements for this MPN.
