ATSAME70N19A-CN - 300MHz Cortex-M7 MCU 512KB Flash | Microchip
MPN: ATSAME70N19A-CN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.7909 | $12.79 |
| 10 | $11.51 | $115.10 |
| 100 | $10.36 | $1,036.00 |
| 500 | $9.32 | $4,660.00 |
| 1,000 | $8.39 | $8,390.00 |
ATSAME70N19A-CN Overview
An ARM Cortex-M7 microcontroller is a 32-bit RISC processor core designed by ARM Holdings for embedded applications requiring high computational throughput, deterministic real-time response, and efficient DSP performance. The Cortex-M7 architecture extends the Cortex-M4 by adding a double-precision FPU, instruction and data caches, and tightly-coupled memory (TCM) interfaces. Within the broader taxonomy, a Cortex-M7 MCU sits in the hierarchy: microcontroller -> embedded processor -> integrated circuit -> semiconductor. SAME70 devices operate from a 1.2V/3.3V split-rail supply and target industrial, automotive, and connectivity-rich IoT gateways.
Key differentiating features of the ATSAME70N19A-CN include 16 KB of instruction cache and 16 KB of data cache with TCM support, a hardware Cryptography Accelerator (AES, TRNG), dual CAN-FD controllers, 12-bit ADC up to 1.5 Msps, a TFT LCD controller with overlay support, and a 16-bit External Bus Interface (EBI) for memory expansion. The 300 MHz core delivers 600 DMIPS / 300 CoreMark, placing it among the highest-throughput Cortex-M7 microcontrollers available in a commercial-grade (non-automotive, -40C to +85C) temperature range.
Architecturally the device pairs the high-speed core with tightly-coupled memory (ITCM/DTCM) for deterministic interrupt latency under 15 ns, plus an embedded SRAM-backed regulator and brown-out detector. A multi-layer AHB/APB bus matrix gives parallel access to peripheral DMA channels, enabling simultaneous Ethernet, USB, and display refresh without bus contention.
Typical applications include industrial Ethernet gateways, motion-control drives, building-automation controllers, HMI panels with TFT displays, and motor-control inverters with CAN-FD networking. The combination of high-speed USB 2.0 and on-chip MAC makes it well-suited for networked sensor hubs that need both wired connectivity and moderate local processing.
When designing with the ATSAME70N19A-CN, special attention is required to PCB escape routing for the 0.8 mm-pitch TFBGA-100, decoupling of the 1.2V core rail with bulk plus high-frequency MLCC caps, and I/O voltage selection for 3.3V-tolerant signals. The internal regulator demands a well-designed PCB thermal copper pour to dissipate peak load transients.
This page synthesizes distributor pricing, drop-in alternatives from the SAME70 / SAMS70 family, and practical PCB design notes not found in the manufacturer datasheet.
Drop-in alternatives for ATSAME70N19A-CN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAME70N19A-CN (same form factor and footprint) — differing in Ethernet, Operating Temperature, Package, USB, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAME70N21A-CFN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMS70N19A-CN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMS70N21A-CFN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAME70N21A-CFN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAME70N19A-CN Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M7 with FPU |
| Maximum CPU Clock | 300 MHz |
| CoreMark / DMIPS | 300 CoreMark / 600 DMIPS |
| Flash Memory | 512 KB |
| SRAM | 256 KB |
| Instruction Cache (I-Cache) | 16 KB |
| Data Cache (D-Cache) | 16 KB |
| Package | TFBGA-100 (9x9 mm), 0.8 mm pitch |
| Operating Voltage (Core) | 1.2 V |
| Operating Voltage (I/O) | 3.3 V |
| Operating Temperature | -40C to +85C |
| Ethernet | 10/100 Mbps MAC with MII/RMII |
| USB | USB 2.0 High-Speed Host/Device + HS PHY |
| CAN-FD | 2x CAN-FD controllers |
| ADC | 12-bit, up to 1.5 Msps, 24 channels |
| TFT LCD Controller | Yes (overlay, DMA, up to XGA) |
| External Bus Interface | 16-bit EBI for SRAM/SDRAM/NOR |
| Cryptography Accelerator | AES-256, TRNG, secure boot |
| RoHS Status | Compliant (PB-free, China RoHS 50) |
ATSAME70N19A-CN tfbga-100 (9x9 mm), 0.8 mm pitch Pin Configuration Guide
Pin configuration for ATSAME70N19A-CN (tfbga-100 (9x9 mm), 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAME70N19A-CN.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAME70N19A-CN is suitable for 6 applications: Industrial Ethernet Gateway, HMI with TFT LCD Controller, Motor Control and Inverters, Building Automation Controllers, USB-Connected Industrial Sensor Hubs, Connected IoT Edge with Display.
Industrial Ethernet Gateway
The ATSAME70N19A-CN fits industrial Ethernet gateways thanks to its integrated 10/100 Mbps MAC with MII/RMII and 300 MHz Cortex-M7 throughput. The 512 KB Flash and 256 KB SRAM comfortably hold protocols such as EtherCAT, PROFINET, or Modbus TCP alongside TLS stacks while leaving headroom for protocol translation. With its on-chip hardware AES-256 and TRNG, secure commissioning and firmware attestation can be implemented locally. The 100-ball TFBGA-100 footprint requires only 81 mm² of PCB area plus a 3.3V/1.2V dual-supply design. Engineers typically pair this MCU with a Micrel KSZ8081 PHY and a SAM E70 Xplained board reference design.
Recommended
HMI with TFT LCD Controller
Driving TFT LCD panels up to XGA resolution is the ATSAME70N19A-CN's specialty, thanks to the integrated LCD controller with overlay support and 2D DMA-driven blitting from system SRAM into framebuffer memory. The 300 MHz Cortex-M7 reads touch input, animates menus, and overlays diagnostic data without taxing the CPU. Designers place the BGA under the LCD connector and use the EBI to SDRAM for large-frame display buffer (16-bit SDRAM up to 64 MB). Arduino and Atmel Studio developers using the SAME70 Xplained kit can port existing projects directly.
Recommended
Motor Control and Inverters
The ATSAME70N19A-CN drives 3-phase PWM motors via its Timer/Counter units, with CAN-FD providing modern industrial motor networks like CiA 402. The 16-bit PWM frequency resolution with dead-time generation is suitable for servo and BLDC control loops under 20 kHz. Combining CAN-FD with USB 2.0 High-Speed gives debug telemetry and configuration upload alongside real-time motor control. With an industrial-grade -40C to +85C temperature range and Cortex-M7 DSP extensions (CMSIS-DSP), Field-Oriented Control (FOC) algorithms execute comfortably at microsecond cycle times.
Recommended
Building Automation Controllers
Building automation systems combining HVAC, lighting, and security benefit from the ATSAME70N19A-CN's USB, Ethernet, CAN-FD, and display subsystems in one device. The microcontroller reliably runs BACnet, KNX, or LonWorks protocol stacks with concurrent TCP/IP cloud uplinks. Real-time deterministic execution from ITCM supports latency-sensitive actuator control while Ethernet MAC handles remote telemetry. Indoor operating temperatures between -10C and +70C are handled by the industrial-grade variant.
Recommended
USB-Connected Industrial Sensor Hubs
The ATSAME70N19A-CN's USB 2.0 High-Speed with on-chip PHY makes it ideal for industrial sensor hubs that aggregate multi-protocol data over USB to a host PC or embedded gateway. Combined with the Cortex-M7 DSP capabilities, real-time signal processing (FFT, FIR filtering) can be performed locally before transmission, reducing upstream bandwidth. The AES-256/TPM-like TRNG enables secure sensor commissioning per IEC 62443 industrial security standards. 512 KB Flash accommodates vendor-supplied sensor library plus custom logic.
Recommended
Connected IoT Edge with Display
Combining high-performance Cortex-M7 processing, on-chip Ethernet, USB, and TFT LCD, the ATSAME70N19A-CN fits edge IoT gateways with local visualization. The hardware AES-256 and TRNG provide root-of-trust for MQTT-TLS connections to cloud brokers. Designers run TCP/IP stacks (LwIP), Modbus, and web servers locally, then push datasets to AWS IoT or Azure IoT Hub. Industrial-qualified -40C to +85C operating range suits outdoor cabinet deployments with active heating/cooling.
Recommended
Recommended Products Summary
Engineering reference data for ATSAME70N19A-CN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAME70N21A-CFN | ATSAMS70N19A-CN | ATSAMS70N21A-CFN |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TFBGA-100 (9x9 mm) | TFBGA-100 (9x9 mm) - same | TFBGA-100 (9x9 mm) - same | TFBGA-100 (9x9 mm) - same |
| Core | Cortex-M7 300 MHz | Cortex-M7 300 MHz - same | Cortex-M7 300 MHz - same | Cortex-M7 300 MHz - same |
| Flash | 512 KB | 2 MB | 512 KB - same | 2 MB |
| SRAM | 256 KB | 384 KB | 256 KB - same | 384 KB |
| Ethernet MAC | 10/100 with MII/RMII | 10/100 with MII/RMII - same | Not present | Not present |
| USB 2.0 HS | Yes (Host/Device + PHY) | Yes - same | Yes - same | Yes - same |
| CAN-FD | 2x CAN-FD | 2x CAN-FD - same | 2x CAN-FD - same | 2x CAN-FD - same |
| Industrial Temperature Range | -40C to +85C | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same |
Key Differentiators
- On-chip Ethernet MAC integrated (vs ATSAMS70N19A-CN)
- Smaller Flash footprint frees PCB cost (vs ATSAME70N21A-CFN)
- Matches ATSAMDA1J16B-MBT on peripherals but ~2.5x Cortex-M7 performance (vs ATSAMDA1J16B-MBT)
Design Notes
Estimated: The 100-ball TFBGA-100 uses 0.8 mm ball pitch, requiring 4-layer PCB with blind-microvia escape or fan-out HDI fabrication. Place the 1.2V decoupling capacitors (10uF bulk + 100nF/10nF HF ceramic) within 5 mm of the VDDCORE ball cluster, and the 3.3V decoupling within 5 mm of VDDIO. Use symmetrical BGA escape routing with via-in-pad to minimize trace stubs. Reference: SAME70 Xplained Pro board design files.
Estimated: At sustained 300 MHz with all peripherals active, the ATSAME70N19A-CN dissipates ~700 mW (TJ ~ 70C at TA=25C with a 50 mm² thermal copper pour). Mount the part over a 5x5 thermal via array (0.3 mm via diameter, 1.2 mm pitch) tying to internal ground plane for 4-layer boards. Industrial -40C to +85C operations are achievable with 1 oz copper pours and adequate airflow. For sealed enclosures, derate clock or add a copper spreader.
The high-speed USB 2.0 lines (DP, DM) require 90-ohm differential impedance routing with maximum 4-mm trace length mismatch; add a common-mode choke near the connector. RMII signals to Ethernet PHY need 50-ohm single-ended impedance with matched trace lengths under 25 mm. Avoid parallel routing of RMII/MII lines with the TFT LCD data bus; cross at 90 degrees if required. Use reference design from SAME70 Xplained Pro for validated SI.
Do not power VDDCORE (1.2V) before VDDIO (3.3V) is stable; internal level shifters latch up. The internal voltage regulator requires an external inductor (4.7 uH) on the VCORE pin - never bypass this inductor. Ensure NRST is held low for at least 10 ms after the supply rails stabilize to guarantee proper boot. Configuration of GPx IO direction registers prior to setting direction in PMC prevents unwanted interrupts during power-up.
Estimated: For designs converting from 5V USB or 24V industrial supply, use a 3.3V LDO such as MCP1755 (300 mA) for VDDBU/VREGIN plus a separate 1.2V LDO for VDDCORE, or use the internal voltage regulator from a clean 3.3V supply. Add reverse-polarity protection (Schottky diode) on VIN if used in field-deployed industrial wiring. Verify hold-up capacitance for supplies that may brown out (Class-3 industrial environments require 100 ms hold-up per IEC 61131-2).
Compliance Information
RoHS compliant per Microchip product page; same package as ATSAME70 family. AEC-Q100 grade not qualified - choose ATSAMx70 auto-qualified parts (suffix A-CFNR) for automotive designs.
