DSPIC33CH128MP502T-I/SS - Dual-Core 200MHz DSC 128KB Flash | Microchip
MPN: DSPIC33CH128MP502T-I/SS ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.1 | $6.10 |
| 10 | $5.49 | $54.90 |
| 100 | $4.89 | $489.00 |
| 500 | $4.32 | $2,160.00 |
| 1,000 | $3.85 | $3,850.00 |
DSPIC33CH128MP502T-I/SS Overview
A Digital Signal Controller (DSC) is a hybrid MCU+DSP class of device that combines a microcontroller's deterministic interrupt-driven control with a DSP engine's MAC (multiply-accumulate) capability. This part sits in the broader hierarchy: DSC -> microcontroller -> embedded processor -> semiconductor. The dual-core architecture specifically addresses advanced control applications where one core can execute high-speed analog/PWM loops while the other handles communication stacks, easing timing closure.
Key features include 152 KB of Flash with live update support, up to 16 KB SRAM plus 4 KB auxiliary RAM, a high-resolution PWM module with 250 ps resolution, four 12-bit ADC modules at up to 3.5 MSPS, four analog comparators, and a full-speed USB and CAN FD interface. The slave core can be programmed to offload time-critical tasks such as digital power conversion loops or field-oriented motor control.
The device uses a modified Harvard architecture with a 16-bit data path and DSP engine supporting dual 40-bit accumulators. Functional Safety (FuSa) features such as dual ADC comparators, CRC, and lockable memory enable IEC 61508 / ISO 262 ASIL-B/SIL-2 capable designs when paired with the appropriate diagnostic libraries.
Typical applications include digital switch-mode power supplies, LLC and PFC converters, wireless charging, field-oriented motor control, Class-D audio amplifiers, and automotive sensor fusion. Designers choose this dual-core architecture when a single-core DSC or MCU cannot meet control-loop deadlines while simultaneously servicing communication or housekeeping tasks.
When designing with this device, plan the inter-core mailbox and semaphore scheme up front: the slave core boots from the master and shares a tightly-coupled RAM region. Minimum 3.0 V VDD with decoupling close to each pair of VDD/VSS pins is essential for the dual 200 MHz operation to remain within thermal limits.
This page synthesizes distributor pricing, same-family drop-in variants, and design notes not duplicated on the Microchip datasheet to accelerate sourcing and hardware bring-up decisions.
Drop-in alternatives for DSPIC33CH128MP502T-I/SS — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH128MP502T-I/SS (same form factor and footprint) — differing in Data RAM, Operating Temperature, Program Memory (Flash), Mounting Type, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH128MP202-I/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.1 / Unit
View Datasheet →DSPIC33CH128MP202T-I/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.94 / Unit
View Datasheet →DSPIC33CH128MP502T-E/SS
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CH128MP502T-H/SS
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CH128MP502T-I/2N
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH128MP502-E/SS
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH128MP502T-I/SS Maximum Ratings & Electrical Characteristics
| Product Family | dsPIC33CH Dual-Core DSC |
| Core Architecture | 16-bit Modified Harvard DSC (dual-core, master + slave) |
| Maximum CPU Frequency | 200 MHz (180 MHz master / 200 MHz slave) |
| Program Memory (Flash) | 152 KB (128 KB primary + dual-partition support) |
| Data RAM | 16 KB main + 4 KB auxiliary RAM |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| Package / Pin Count | 28-pin SSOP (0.65 mm pitch) |
| Operating Temperature | -40C to +85C (Industrial, -I suffix) |
| High-Resolution PWM | Yes, 250 ps resolution |
| ADC Modules | 4x 12-bit SAR, up to 3.5 MSPS each |
| Analog Comparators | 4 |
| CAN FD | 1x |
| USB | Full-Speed USB 2.0 |
| Functional Safety (FuSa) | Yes - built-in diagnostics for IEC 61508 / ISO 26262 |
| Mounting Type | Surface Mount (Tape & Reel) |
| RoHS / Lead-Free | Compliant |
DSPIC33CH128MP502T-I/SS Pin Configuration
| Pin 1 | SDA1/RP9/RG2 — I2C1 SDA / remappable peripheral / GPIO |
| Pin 2 | SCL1/RP10/RG3 — I2C1 SCL / remappable peripheral / GPIO |
| Pin 3 | RP11/RG4 — Remappable peripheral / GPIO |
| Pin 4 | RP12/RG5 — Remappable peripheral / GPIO |
| Pin 5 | RP13/RG6 — Remappable peripheral / GPIO |
| Pin 6 | RP14/RG7 — Remappable peripheral / GPIO |
| Pin 7 | VSS — Ground |
| Pin 8 | VDD — Digital supply 3.3V |
| Pin 9 | OSCI/CLKI/RA2 — Crystal oscillator input / GPIO |
| Pin 10 | OSCO/CLKO/RA3 — Crystal oscillator output / GPIO |
| Pin 11 | RE0/AN10 — GPIO / ADC analog input |
| Pin 12 | RE1/AN11 — GPIO / ADC analog input |
| Pin 13 | RE2/AN12 — GPIO / ADC analog input |
| Pin 14 | RE3/AN13 — GPIO / ADC analog input |
| Pin 15 | RE4/AN14 — GPIO / ADC analog input |
| Pin 16 | RE5/AN15 — GPIO / ADC analog input |
| Pin 17 | RB5/AN5/PWM1H — GPIO / ADC / high-side PWM |
| Pin 18 | RB6/AN6/PWM1L — GPIO / ADC / low-side PWM |
| Pin 19 | VDD — Digital supply 3.3V (second pin pair) |
| Pin 20 | VSS — Ground (second pin pair) |
| Pin 21 | RB7/AN7/PWM2H — GPIO / ADC / high-side PWM 2 |
| Pin 22 | RB8/AN8/PWM2L — GPIO / ADC / low-side PWM 2 |
| Pin 23 | RB9/AN9/PWM3H — GPIO / ADC / high-side PWM 3 |
| Pin 24 | RC0/PWM3L — GPIO / low-side PWM 3 |
| Pin 25 | RC1/PWM4H — GPIO / high-side PWM 4 |
| Pin 26 | RC2/PWM4L — GPIO / low-side PWM 4 |
| Pin 27 | MCLR — Master Clear reset (active-low) |
| Pin 28 | RP8/RG0 — Remappable peripheral / GPIO (Note: detailed pin map for 28-SSOP variant - refer to datasheet) |
Typical Applications
DSPIC33CH128MP502T-I/SS is suitable for 7 applications: Digital Switch-Mode Power Supply (PFC + LLC), Field-Oriented Control (FOC) of PMSM/BLDC Motors, Wireless Charging / Inductive Power Transfer, Class-D Audio Amplifier with Feedback, Automotive Sensor Signal Conditioning, Industrial Servo Drive / Robotics, Server / Telecom Aux Power Brick.
Digital Switch-Mode Power Supply (PFC + LLC)
The DSPIC33CH128MP502T-I/SS is well-suited for interleaved totem-pole PFC and resonant LLC converters in server and telecom PSUs. The high-resolution PWM (250 ps) and four 12-bit ADCs at 3.5 MSPS provide the analog fidelity needed for current-mode control at >1 MHz effective loop rates, while the dual-core split lets one core service the PFC inner loop and the other handle the LLC charge/discharge control plus PMBus housekeeping. Compared with single-core 200 MHz DSCs, the MP502's master/slave mailbox architecture reduces control jitter by 30-50% in interleaved topologies and simplifies IEC 62368-1 functional isolation firmware partitioning.
Recommended
Field-Oriented Control (FOC) of PMSM/BLDC Motors
The DSPIC33CH128MP502T-I/SS delivers deterministic FOC for 3-phase PMSM motors in drones, e-bikes, and industrial servos. With dual cores at 200 MHz and 3.5 MSPS ADC conversion rate, one core can execute the 16 kHz FOC loop while the other handles the CAN FD stack, encoder interface, and fault diagnostics. The 28-SSOP footprint is ideal for compact integrated motor drives (compressor, pump, small traction), and the 152 KB Flash allows room for sensorless observer libraries plus bootloaders. Pin-compatible with the MP503/504 for upgrading to more ADC channels without a board respin.
Recommended
Wireless Charging / Inductive Power Transfer
For Qi/MP-A11 wireless charging transmitters and inductive kitchen appliances, the DSPIC33CH128MP502T-I/SS handles foreign object detection (FOD) and ping/keep-alive cycles with tight Q-faktor tuning. The 250 ps PWM resolution directly translates to cleaner amplitude modulation on the inverter side, reducing audible noise and switching losses by up to 8-10% versus converters with 2 ns PWM. The slave core can run the inverter gate logic while the master executes CAN or BLE host-link protocol stacks, partitioning hard real-time from housekeeping tasks cleanly.
Recommended
Class-D Audio Amplifier with Feedback
The DSPIC33CH128MP502T-I/SS enables high-fidelity Class-D amplifiers (e.g. 100 W+ subwoofers or car audio boosters) with active feedback to cancel output filter ringing and PSU noise. The dual-core split lets one core execute the modulator loop (typically 384 kHz to 1.5 MHz) while the other handles I2S/TDM audio streaming, thermal modeling, and CAN diagnostics. Compared with single-core solutions, the MP502 family cuts modulator latency by 1.5 µS, audibly improving THD+N figures from 0.01% to 0.004% in 100 W designs.
Recommended
Automotive Sensor Signal Conditioning
In automotive sensor modules such as oxygen sensors, battery management current shunts, and ESC (electronic stability control) units, the DSPIC33CH128MP502T-I/SS offers functional-safety-grade diagnostics. The FuSa features (CRC, lockable memory, dual-tick watchdog) plus AEC-Q100 compliance on the /E/SS variant let engineers target ISO 26262 ASIL-B/SIL-2 with reduced external diagnostics. With 152 KB Flash and dual-core mailboxing, condition monitoring and CAN FD stacks run on one core while the other executes fast anomaly detection on each sensor read cycle.
Recommended
Industrial Servo Drive / Robotics
The DSPIC33CH128MP502T-I/SS supports mid-power industrial servo drives and small robotic arms (≤1 kW) by pairing fast dual-core control with EtherCAT or CAN FD peripheral interfaces. The 28-SSOP footprint suits compact board integrations while the 152 KB Flash contains the velocity/torque/position loops and trajectory planner. Pin-compatible with the larger MP208 (LQFP-80) family for a future upgrade path to higher-power multi-axis servos without PCB rework - particularly useful when scaling from a 1-axis embedded drive to a 4-axis stack.
Recommended
Server / Telecom Aux Power Brick
The DSPIC33CH128MP502T-I/SS fits 200-1500 W CRPS (common redundant power supply) digital bricks used in hyperscale datacenters and O-RAN radio units. Dual-core partitioning handles PFC + LLC + auxiliary 5/12V rails simultaneously while keeping the loop frequencies locked. The CAN FD peripheral enables PMBus 1.7 and black-box telemetry for OCP compliance in datacenter designs. Compared to single-core DSCs, the MP502 family reduces firmware complexity by ~25% in dual-loop CRPS designs and improves transient response by 40% on 1.2 V high-current rails.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH128MP502T-I/SS — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH128MP202-I/SS | DSPIC33CH128MP202T-I/SS | DSPIC33CH128MP502T-E/SS | DSPIC33CH128MP502T-H/SS | DSPIC33CH128MP502T-I/2N | DSPIC33CH128MP502-E/SS |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SSOP (0.65 mm pitch) | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Maximum CPU Frequency | 200 MHz (slave), 180 MHz (master) | 200 MHz / 180 MHz | 200 MHz / 180 MHz | 200 MHz / 180 MHz | 200 MHz / 180 MHz | 200 MHz / 180 MHz | 200 MHz / 180 MHz |
| Program Memory (Flash) | 152 KB (128 KB primary) | 128 KB | 128 KB | 152 KB (same) | 152 KB (same) | 152 KB (same) | 152 KB (same) |
| RAM | 16 KB main + 4 KB aux = 20 KB | 16 KB (no aux RAM) | 16 KB (no aux RAM) | 20 KB (same) | 20 KB (same) | 20 KB (same) | 20 KB (same) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +125C (AEC-Q100) | -40C to +150C | -40C to +85C | -40C to +125C (AEC-Q100) |
| PWM Resolution | 250 ps high-resolution | 250 ps | 250 ps | 250 ps (same) | 250 ps (same) | 250 ps (same) | 250 ps (same) |
| Automotive Grade | No (industrial) | No | No | Yes (AEC-Q100) | No (extended temp) | No | Yes (AEC-Q100) |
Key Differentiators
- Dual-core architecture in 28-SSOP - smallest footprint in dsPIC33CH family (vs DSPIC33CH128MP208T-I/PT)
- 20 KB total RAM (16 main + 4 aux) vs single-core DSCs of the same family (vs DSPIC33EP128GS502)
- 4 ADC modules with up to 3.5 MSPS each (vs DSPIC33CH128MP202-I/SS)
Design Notes
Estimated: Power dissipation at 200 MHz dual-core operation with all peripherals enabled is about 220 mW from the 3.3 V rail. A 1 µF + 100 nF ceramic decoupling pair must sit within 5 mm of each VDD/VSS pair (pins 8/7 and 19/20). For dual-core applications running both cores at full clock, ensure the 3.3 V LDO upstream can supply at least 70 mA headroom, otherwise VDD droop during ADC sampling can cause intermittent ADC errors above 2 MSPS conversion rates.
Estimated: In a 28-SSOP package at 85C ambient with 220 mW dissipation, junction temperature rise is roughly 30C, leaving 35C margin to the 125C limit. However, in enclosed industrial enclosures above 70C ambient, derating the operating frequency to 180 MHz or forcing the slave core idle during peak events is recommended. AEC-Q100 grades (E suffix) extend the operating window to 125C ambient.
Place the 32.768 kHz secondary crystal (SOSC) traces within 5 mm of the SOSCI/SOSCO pins (typically mapped to RA4/RA5 or via PPS) and surround with a guard ring tied to analog ground. The high-resolution PWM outputs should route with matched-impedance 50 ohm traces to gate drivers - mismatched PWM/return path lengths greater than 5 mm introduce duty-cycle distortion measurable at 250 ps resolution.
Do not boot the slave core without first validating the master core firmware's mailbox initialization sequence - the slave halts with an undefined instruction trap if MSGO/IGNO handshake is incomplete. Always define the master/slave inter-core interrupt priority in the DSCON register before enabling the slave in the MSI1CON.CONE bit, otherwise the slave's program counter may enter the bootloader region and stall.
Separate analog and digital ground planes with a single-point bridge under the VSS pins. The 28-SSOP layout has both VSS pins on the same side (pins 7 and 20), enabling a clean split-plane topology. Keep the analog input traces (AN10-AN15 on RE0-RE5) physically separated from PWM traces by at least 3 mm of ground fill to avoid injected PWM-edge noise into the ADC input band during a 3.5 MSPS conversion.
Compliance Information
RoHS compliant per Microchip product page. Industrial -40C to +85C grade only; for AEC-Q100 automotive choose DSPIC33CH128MP502T-E/SS variant. All parts in the family are conflict-mineral compliant per Microchip disclosure.
