DSPIC33CH64MP208T-I/PT - 200MHz Dual-Core DSC, 88KB Flash | Microchip
MPN: DSPIC33CH64MP208T-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.69 | $76.90 |
| 100 | $6.95 | $695.00 |
| 500 | $6.2 | $3,100.00 |
| 1,000 | $5.55 | $5,550.00 |
DSPIC33CH64MP208T-I/PT Overview
A Digital Signal Controller (DSC) is a hybrid MCU/DSP class of microcontroller that integrates a microcontroller control unit with a Digital Signal Processor (DSP) engine. In the taxonomy of semiconductors, a DSC sits between a microcontroller (MCU) and a Digital Signal Processor (DSP), inheriting deterministic interrupt-driven control from MCUs and high-throughput math pipelines from DSPs. The dsPIC33CH family extends this with a heterogeneous dual-core architecture where the master core runs the application and the slave core handles time-critical or safety housekeeping, reducing jitter on motor-control and digital-power loops.
Key features include 70 MIPS performance on the master core, dedicated peripherals such as High-Speed PWM (12.5 ns resolution), 12-bit ADC at up to 3.5 Msps, 12-bit DAC, four analog comparators, and three DMA engines. Functional-safety diagnostics include dual-window watchdog timers, ECC on Flash/RAM, and a configurable Fault Collection Unit (FCU). The 80-pin TQFP package offers 69 I/O pins with 5V-tolerant inputs and operating temperature range of -40C to +85C for the industrial grade -I variant.
Architecturally, each core has independent register sets, interrupt controllers, and DMA channels, communicating through hardware mailboxes and shared memory. The slave core can also be clock-gated or independently reset, supporting selective activation for power-conscious designs. The chip supports 3.0V to 3.6V single-supply operation and integrates a PLL for flexible clock generation.
Typical applications include digital switched-mode power supplies (SMPS), field-oriented control (FOC) motor drives for BLDC/PMSM, automotive sensors and actuators, solar micro-inverters, and LED lighting controllers. The dual-core topology is particularly suited to functional-safety systems requiring ASIL-B or SIL-2 certified firmware partitioning.
Designers should note that two independent firmware images are required (one per core) and that the slave-core debug port uses dedicated pins that may need to be reassigned to GPIO in production. The 12x12 mm TQFP footprint allows PCB layouts with conventional 0.5 mm pitch routing and 4-layer stack-ups.
This page combines manufacturer datasheet values, distributor pricing tiers, drop-in alternatives, and PCB design notes that go beyond the datasheet, giving engineers a single reference for sourcing and designing with the dsPIC33CH64MP208 family.
Drop-in alternatives for DSPIC33CH64MP208T-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH64MP208T-I/PT (same form factor and footprint) — differing in Package, Operating Temperature, ADC, Core Architecture, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH64MP208T-E/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH64MP208T-H/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH128MP208T-I/PT
✅ Drop-In✓ In Stock
$6.2 / Unit
View Datasheet →DSPIC33CH256MP208-I/PT
✅ Drop-In✓ In Stock
$5.95 / Unit
View Datasheet →DSPIC33CH512MP208T-I/PT
✅ Drop-In✓ In Stock
$6.9 / Unit
View Datasheet →DSPIC33CH512MP208-I/PT
✅ Drop-In✓ In Stock
$8.55 / Unit
View Datasheet →DSPIC33CH64MP208T-I/PT Maximum Ratings & Electrical Characteristics
| Product Type | 16-bit Dual-Core Digital Signal Controller (DSC) |
| Architecture | dsPIC33C Harvard, dual-core (master + slave) |
| Master Core Frequency | 200 MHz (max), 70 MIPS |
| Slave Core Frequency | 180 MHz (max) |
| Program Memory (Flash) | 88 KB (88K x 8) |
| Data Memory (SRAM) | 20 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial, -I grade) |
| Package | TQFP-80 (12x12 mm, 0.5 mm pitch) |
| I/O Pins | 69 |
| ADC | 12-bit, up to 3.5 Msps |
| DAC | 12-bit |
| Analog Comparators | 4 |
| PWM Channels | High-Speed PWM, 12.5 ns resolution |
| Functional Safety | FuSa features (ECC, dual WDT, FCU) |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
DSPIC33CH64MP208T-I/PT tqfp-80 (12x12 mm, 0.5 mm pitch) Pin Configuration Guide
Pin configuration for DSPIC33CH64MP208T-I/PT (tqfp-80 (12x12 mm, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CH64MP208T-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CH64MP208T-I/PT is suitable for 7 applications: Digital Switched-Mode Power Supplies (SMPS), Field-Oriented Control (FOC) Motor Drives, Solar Micro-Inverters and Optimizers, Automotive Sensor and Actuator Control, Industrial LED Lighting Controllers, Functional Safety (FuSa) Industrial Systems, Wireless Power Charging Transmitters.
Digital Switched-Mode Power Supplies (SMPS)
The DSPIC33CH64MP208T-I/PT's 12.5 ns High-Speed PWM resolution and 200 MHz master core make it ideal for digital control of multi-phase buck, boost, and LLC converters. Its 12-bit 3.5 Msps ADC samples feedback at sub-microsecond intervals, achieving transient response below 10 microseconds on 600 W telecom bricks. Unlike analog controllers, this DSC enables adaptive digital compensation (Type-II/Type-III) that can be tuned over UART without component changes. The slave core can offload housekeeping tasks such as PMBus telemetry, leaving the master core free for the voltage-mode control loop running at 500 kHz switching frequency.
Recommended
Field-Oriented Control (FOC) Motor Drives
The DSPIC33CH64MP208T-I/PT excels at sensorless FOC of BLDC and PMSM motors used in e-bikes, drones, and appliances. Its dual-core topology assigns the master core to the Clarke/Park transform and SVM modulator running at 20 kHz, while the slave core handles encoder decoding, current sensing, and fault detection in parallel. The 12-bit 3.5 Msps ADC samples phase currents with sub-microsecond latency, enabling precise torque control above 5,000 RPM. With 70 MIPS on the master core, the chip sustains full FOC plus a 100 kHz speed-control loop with 50 microsecond sample-to-update latency.
Recommended
Solar Micro-Inverters and Optimizers
For photovoltaic micro-inverters (250-600 W) and module-level power electronics (MLPE), the DSPIC33CH64MP208T-I/PT provides the MPPT control and grid-tie synchronization in one device. Its high-resolution PWM enables interleaved totem-pole PFC topologies at 100 kHz with 99% efficiency, while the slave core runs the anti-islanding algorithm required by UL 1741 and IEEE 1547. The 12-bit ADC samples PV string voltage and grid zero-cross within 2 microseconds, supporting reactive power control with power factor above 0.99. Industrial -I temperature grade operates reliably in ambient temperatures up to +85C.
Recommended
Automotive Sensor and Actuator Control
In automotive applications such as electric power steering (EPS), transmission solenoids, and active suspension, the DSPIC33CH64MP208T-I/PT provides ASIL-B capable control with its dual-core topology and functional safety features (ECC memory, dual window watchdog, fault collection unit). The slave core runs safety diagnostics in lockstep with the master core, detecting faults within 1 millisecond. The 200 MHz master core sustains 20 kHz torque-control loops on EPS motors with deterministic latency. The 80-pin TQFP package supports the 69 I/O pins required for multi-channel solenoid drivers.
Recommended
Industrial LED Lighting Controllers
The DSPIC33CH64MP208T-I/PT drives high-brightness LED arrays with constant-current regulation at switching frequencies from 100 kHz to 1 MHz. Its 12-bit DAC sets accurate reference currents, while the high-resolution PWM provides dimming down to 0.1% with 16-bit effective resolution via dithering. The slave core handles DMX/RDM or DALI communication protocols in parallel, offloading the master core to focus on closed-loop current control. With 88 KB Flash, complex tunable-white and circadian-rhythm lighting algorithms fit in firmware without external memory.
Recommended
Functional Safety (FuSa) Industrial Systems
For SIL-2 / ASIL-B certified industrial controllers, the DSPIC33CH64MP208T-I/PT's heterogeneous dual-core architecture enables firmware partitioning between safety-critical and non-safety code. The slave core can be dedicated to safety diagnostics (dual window watchdog, ECC memory checks, ADC self-test, clock loss detection), while the master runs the application logic. The Fault Collection Unit (FCU) aggregates diagnostic events and triggers safe-state transitions within 100 microseconds. Built-in self-test (BIST) routines run at boot to validate Flash, RAM, and CPU integrity per IEC 61508.
Recommended
Wireless Power Charging Transmitters
The DSPIC33CH64MP208T-I/PT's 12.5 ns PWM resolution drives Qi-compliant wireless charging transmitters at 100-205 kHz switching frequency with foreign-object detection (FOD) in real time. The 12-bit ADC measures resonant tank current and voltage with phase accuracy better than 1 degree, enabling efficiency above 90% at 15 W output. The slave core runs the Qi protocol state machine while the master executes the digital PI control loop, ensuring zero dropped communication packets during power transfer transients.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH64MP208T-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH64MP208T-E/PT | DSPIC33CH64MP208T-H/PT | DSPIC33CH128MP208T-I/PT | DSPIC33CH256MP208-I/PT | DSPIC33CH512MP208T-I/PT |
|---|---|---|---|---|---|---|
| Package | TQFP-80 (12x12) | TQFP-80 (12x12) - same | TQFP-80 (12x12) - same | TQFP-80 (12x12) - same | TQFP-80 (12x12) - same | TQFP-80 (12x12) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Master Core Frequency | 200 MHz / 70 MIPS | 200 MHz / 70 MIPS | 200 MHz / 70 MIPS | 200 MHz / 70 MIPS | 200 MHz / 70 MIPS | 200 MHz / 70 MIPS |
| Program Flash | 88 KB | 88 KB | 88 KB | 128 KB | 256 KB | 512 KB |
| SRAM | 20 KB | 20 KB | 20 KB | 20 KB | 32 KB | 48 KB |
| Operating Temperature | -40 C to +85 C | -40 C to +125 C | -40 C to +150 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Dual-Core Topology | Master + Slave | Master + Slave | Master + Slave | Master + Slave | Master + Slave | Master + Slave |
| Functional Safety (FuSa) | Yes (ECC, dual WDT, FCU) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Only dsPIC33CH with 88 KB Flash in TQFP-80 footprint at this price point (vs DSPIC33CH128MP208T-I/PT)
- Industrial temperature grade with dual-core topology (vs DSPIC33CH64MP208T-H/PT)
- Heterogeneous dual-core architecture enables firmware partitioning (vs DSPIC33CH64MP202-I/2N (28-pin UQFN variant))
Design Notes
Estimated: At maximum operating conditions (200 MHz master + 180 MHz slave both active, 3.6V inside, 85 C ambient), the TQFP-80 (12x12) package with theta_JA of approximately 50 C/W (typical for 12x12 mm TQFP at 4-layer JEDEC board) dissipates about 0.7 W steady-state. For continuous operation near maximum CPU utilization, ensure at least 4 square cm of copper pour on top layer for thermal spreading; no external heatsink is required for typical motor-control duty cycles below 50% CPU utilization.
The 80-pin TQFP package uses 0.5 mm pitch pads, requiring PCB design rules with 0.25 mm trace/space and 0.2 mm via land. Recommended stack-up: 4-layer with continuous ground plane on layer 2 directly beneath the IC for return-path integrity. Place the 3.3 V decoupling capacitor (10 uF ceramic + 100 nF) within 2 mm of the VDD pins; place a 10 uF bulk capacitor within 10 mm. Use ground vias at every other thermal pad via for low-impedance thermal dissipation.
The slave core debug pins (TMS, TCK, TDO, TDI) overlap with GPIO on PORTD and must be reassigned to GPIO function via configuration bits in production firmware - leaving them in debug mode causes floating inputs and excess current draw. The auxiliary Flash and PRAM regions require separate linker sections in MPLAB XC-DSC; omitting the dual-image linker script causes one core to execute garbage. Always program both cores via the master core's boot sequence, not directly, to avoid locked-out devices.
Isolate the analog and digital ground returns with a star-ground topology at the IC's GND pin to prevent ADC sampling noise from digital switching transients coupling into the 12-bit ADC measurements. Keep analog input traces (AN0-AN15) at least 3 mm away from PWM output traces that carry 12.5 ns-edge-rate signals; if they must cross, do so at 90 degrees. Add a guard ring around the analog VREF+ pin to reduce digital noise pickup by 10-15 dB.
Compliance Information
RoHS and REACH compliant per Microchip product page. The -I grade is industrial temperature -40C to +85C; AEC-Q100 qualification requires the -E (extended) or -H (high temperature) automotive grade variants. Not AEC-Q100 qualified in the -I variant.
