DSPIC33EP128MC502-E/MM - 60 MIPS 16-bit DSC 128KB | Microchip
MPN: DSPIC33EP128MC502-E/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.12 | $6.12 |
| 10 | $5.58 | $55.80 |
| 100 | $5.04 | $504.00 |
| 500 | $4.62 | $2,310.00 |
| 1,000 | $4.2 | $4,200.00 |
DSPIC33EP128MC502-E/MM Overview
A digital signal controller combines the computational architecture of a microcontroller with DSP-engine features such as single-cycle MAC, multiply, and divide instructions, dual source operands, and modulo and bit-reversed addressing modes. Within the power-management hierarchy, a DSC such as this sits between general-purpose MCUs and full DSPs, offering deterministic control-loop execution for precision motor control and digital power conversion.
Key features include the 16-bit dsPIC33E core running up to 60 MIPS, high-speed 3-channel 16-bit PWM modules with complementary outputs, dead-time insertion and fault protection, a 10-bit, 1.1 Msps ADC, multiple UART, SPI and I2C serial ports, and an internal fast RC oscillator with PLL. These peripherals directly target field-oriented control (FOC) of BLDC and PMSM motors and switch-mode power supplies.
Architecturally, the dsPIC33EP core uses an enhanced Harvard bus structure with separate program and data paths, hardware DSP support, and 24-bit instruction words. Flash self-programming allows field firmware updates, while code guarding and boot security protect intellectual property.
Typical applications include brushless and permanent-magnet motor drives, automotive auxiliary motor control, digital lighting ballasts and LED drivers, UPS and solar inverter power stages, and embedded industrial control requiring deterministic 16-bit control loops.
When designing the 6x6 QFN package, the exposed die pad must be soldered to a solid ground plane for thermal and electrical performance; the -E grade should be derated for junction temperature in enclosed automotive assemblies.
This page synthesizes distributor pricing, drop-in family alternatives, pinout guidance, and design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP128MC502-E/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128MC502-E/MM (same form factor and footprint) — differing in Timers, Operating Temperature, Package, Core, Flash Program Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP128MC502-I/MM
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128MC202T-E/MM
✅ Drop-In✓ In Stock
$3.41 / Unit
View Datasheet →DSPIC33EP64MC502-E/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.05 / Unit
View Datasheet →DSPIC33EP256MC502-E/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.95 / Unit
View Datasheet →DSPIC33EP128MC502-E/MM Maximum Ratings & Electrical Characteristics
| Core | 16-bit dsPIC33EP DSC |
| Core Speed | 60 MIPs |
| Flash Program Memory | 128 KB (43K x 24) |
| RAM | 16 KB |
| Supply Voltage | 3.3 V |
| Package | 28-QFN-S (6x6 mm), exposed pad (MM) |
| Operating Temperature | -40C to +125C (E grade) |
| Qualification | Automotive, AEC-Q100 |
| ADC | 10-bit, 1.1 Msps |
| PWM | High-speed 16-bit PWM, motor control (MC) family |
| Communication Interfaces | UART, SPI, I2C |
| Timers | 16-bit timers with input capture / output compare |
| Mounting Type | Surface Mount |
| Instruction Set | 24-bit instruction word with DSP instructions |
| Oscillator | Internal FRC with PLL, external XT crystal option |
| RoHS Status | Compliant |
| Programming Interface | ICSP/ICD via PGECx/PGEDx pairs |
DSPIC33EP128MC502-E/MM Pin Configuration
| Pin 1 | MCLR — Master clear (reset) input, active low / programming voltage |
| Pin 2 | AN0/RB0 — Analog input 0 / digital I/O |
| Pin 3 | AN1/RB1 — Analog input 1 / digital I/O |
| Pin 4 | AN2/RB2 — Analog input 2 / digital I/O |
| Pin 5 | AN3/RB3 — Analog input 3 / digital I/O |
| Pin 6 | AN4/RB4 — Analog input 4 / digital I/O |
| Pin 7 | VDD — Power supply (3.3 V) |
| Pin 8 | VSS — Ground reference |
| Pin 9 | OSC1/CLKI — Crystal oscillator input / external clock input |
| Pin 10 | OSC2/CLKO — Crystal oscillator output / clock output |
| Pin 11 | AN5/RB5 — Analog input 5 / digital I/O |
| Pin 12 | VSS — Ground reference |
| Pin 13 | PGED2/AN8/RB8 — ICSP data 2 / analog input 8 / digital I/O |
| Pin 14 | VDD — Power supply (3.3 V) |
| Pin 15 | PGEC2/AN9/RB9 — ICSP clock 2 / analog input 9 / digital I/O |
| Pin 16 | TCK/RP1/AN10/RB10 — Test clock / remappable I/O / analog input 10 |
| Pin 17 | TDI/RP2/AN11/RB11 — Test data in / remappable I/O / analog input 11 |
| Pin 18 | TMS/RP3/AN12/RB12 — Test mode select / remappable I/O / analog input 12 |
| Pin 19 | TDO/RP4/AN13/RB13 — Test data out / remappable I/O / analog input 13 |
| Pin 20 | RP5/AN14/RB14 — Remappable I/O / analog input 14 |
| Pin 21 | RP6/AN15/RB15 — Remappable I/O / analog input 15 |
| Pin 22 | AVSS — Analog ground reference |
| Pin 23 | AVDD — Analog power supply (3.3 V) |
| Pin 24 | RP7/RB7 — Remappable I/O / digital I/O |
| Pin 25 | RP8/RB6 — Remappable I/O / digital I/O |
| Pin 26 | PGED1/RP9 — ICSP data 1 / remappable I/O |
| Pin 27 | PGEC1/RP10 — ICSP clock 1 / remappable I/O |
| Pin 28 | VSS/EP — Ground reference / exposed pad - solder to ground plane |
Typical Applications
DSPIC33EP128MC502-E/MM is suitable for 6 applications: BLDC / PMSM Motor Control, Digital Power Conversion, Automotive Body and Auxiliary Electronics, Industrial Embedded Control, LED Lighting and Electronic Ballasts, Embedded Sensing and IoT Nodes.
BLDC / PMSM Motor Control
The DSPIC33EP128MC502-E/MM is purpose-built for field-oriented control (FOC) of brushless DC and permanent-magnet synchronous motors. Its 60 MIPs 16-bit core executes Clarke/Park transformations and PI current loops deterministically, while the high-speed 16-bit PWM module provides complementary outputs with dead-time insertion and cycle-by-cycle fault current limiting. The 10-bit, 1.1 Msps ADC synchronizes with the PWM period to sample phase currents at zero-vector points, minimizing switching noise in the readings. In automotive auxiliary drives the -E grade's -40C to +125C range and AEC-Q100 qualification allow mounting near the actuator. Placing the MCU close to the gate drivers with 0.1uF bypassing on each VDD pin keeps the control loop jitter low; the 128KB Flash comfortably holds FOC firmware plus CAN/UART communication stacks.
Recommended
Digital Power Conversion
Switch-mode power supplies, UPS stages, and solar micro-inverters benefit from this DSC's deterministic PWM plus fast ADC combination. The high-speed PWM supports frequency, duty-cycle, and phase-shift modulation with hardware dead time, while the 1.1 Msps ADC closes voltage and current loops within a single switching period. Digital compensators replace analog error amplifiers, enabling adaptive control across load transients and programmable protection thresholds. The 128KB Flash leaves headroom for multiple converter profiles selected at runtime, and the extended -40C to +125C rating suits outdoor and telecom rectifier environments. Designers should budget the ADC sampling instant to avoid SW_NODE switching edges, and use the exposed QFN pad soldered to a clean analog ground island to keep converter noise out of the ADC front end.
Recommended
Automotive Body and Auxiliary Electronics
With AEC-Q100 qualification and a -40C to +125C temperature grade, the DSPIC33EP128MC502-E/MM fits automotive modules such as electronic throttle bodies, fuel-pump controllers, HVAC damper drives, and lighting ballasts. Its remappable RPn I/O pins let one layout serve multiple harness variants, and the 16KB RAM plus 128KB Flash host UDS/KWP2000 diagnostic stacks alongside control firmware. The internal FRC oscillator with PLL allows cost-optimized designs without an external crystal where tolerance permits. Designers must account for ISO 7637 load-dump transients with upstream TVS protection and use the MCU's brown-out and watchdog modules for safe state recovery. The 6x6 QFN exposed pad provides the thermal path needed inside sealed underdash modules with limited airflow.
Recommended
Industrial Embedded Control
Factory automation nodes, pump controllers, and HVAC equipment use this DSC where a 16-bit core with DSP capability processes sensor data and runs PID loops faster than a general-purpose MCU. Multiple UART, SPI, and I2C ports connect Modbus RTU interfaces, external memory, and display drivers concurrently, while input capture peripherals measure encoder or flow-pulse timing with hardware precision. The 60 MIPs core executes floating-point-emulated control algorithms fast enough for multi-kHz loop rates, and the ICSP interface permits field firmware updates over the production programming connector. Because several PGECx/PGEDx pin pairs exist, designers should reserve one pair and route it to a programming header for in-service diagnostics, keeping the remaining pairs available as general-purpose I/O in the final design.
Recommended
LED Lighting and Electronic Ballasts
High-brightness LED drivers and HID ballasts require precise current regulation with fast fault response. The DSPIC33EP128MC502-E/MM generates phase-shifted or complementary PWM for buck, boost, or half-bridge LED topologies, with hardware dead time that removes software latency from the critical turn-off path. The 1.1 Msps ADC samples LED current each cycle for average-current-mode control, and the fault inputs force the PWM to a safe state within one clock cycle on overcurrent events. The extended temperature range suits enclosed luminaires where ambient temperatures exceed +85C. Using the 128KB Flash, a single firmware image can serve multiple product SKUs with programmable dimming curves, thermal foldback limits, and DMX or DALI communication implemented in software on the UART ports.
Recommended
Embedded Sensing and IoT Nodes
In sensor-intensive nodes, the dsPIC33EP128MC502's DSP instructions perform digital filtering and FFT analysis on the same chip that manages communications, eliminating a separate DSP. The 15-channel analog inputs with the 10-bit, 1.1 Msps ADC handle multi-sensor scanning, while hardware input capture timestamps external events precisely. The 16KB RAM buffers waveform windows for on-device analytics before transmission over UART or SPI to a wireless module, and 128KB Flash stores calibration tables and logging data. Operation from a 3.3V rail simplifies integration with common sensor front ends. For battery-backed designs, the extended-temp -E grade tolerates outdoor enclosures; sleep modes and selective peripheral gating keep average current low between periodic measurement bursts triggered by a timer or external interrupt.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128MC502-E/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP128MC502-I/MM | DSPIC33EP128MC202T-E/MM | DSPIC33EP64MC502-E/MM | DSPIC33EP256MC502-E/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm, MM) | 28-QFN-S (6x6 mm, MM) - same | 28-QFN-S (6x6 mm, MM) - same | 28-QFN-S (6x6 mm, MM) - same | 28-QFN-S (6x6 mm, MM) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPs | 60 MIPs | 60 MIPs | 60 MIPs | 60 MIPs |
| Flash Memory | 128 KB | 128 KB | 64 KB | 64 KB | 256 KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- Extended -40C to +125C automotive grade (vs DSPIC33EP128MC502-I/MM)
- Twice the Flash of the entry 28-QFN variant (vs DSPIC33EP128MC202T-E/MM)
- Cost-optimized memory option on the same footprint (vs DSPIC33EP256MC502-E/MM)
Design Notes
The -E grade permits -40C to +125C ambient operation, but junction temperature, not ambient, limits reliability. In a 6x6 QFN the exposed die pad is the dominant heat path: solder it to a minimum 4x4 grid of thermal vias (0.3 mm drill, filled or plated) connecting to an internal ground plane. Estimated: at 60 MIPs active current in the 60-80 mA range on 3.3 V (about 0.26 W), junction rise above ambient is typically under 20C with a well-grounded pad, leaving margin inside sealed enclosures; verify against the datasheet theta-JA table for your exact stackup.
Place 0.1 uF ceramic decoupling capacitors at every VDD pin (pins 7 and 14) and 0.1 uF on AVDD (pin 23), within 2 mm of the pin, plus one 10 uF bulk capacitor near the part. Keep AVSS (pin 22) tied to a quiet analog ground island and connect the analog island to digital ground at a single point under the QFN exposed pad to prevent switching PWM noise from corrupting ADC readings. Remappable RPn pins let you route peripherals away from noisy PWM traces in final layout revisions without respinning the MCU netlist.
ICSP programming requires a matched PGECx/PGEDx pair: if PGEC2 (pin 15) carries ICSPCLK, ICSPDAT must connect to PGED2 (pin 13); mixing pairs across different pairs will fail programming. Reserve one pair for the production programming header. Also, MCLR (pin 1) needs a pull-up resistor (4.7k-10k typical) and should not be left floating in noisy motor-drive environments, or spurious resets will occur near switching events.
Compliance Information
Automotive, AEC-Q100 qualification stated in DigiKey and Hotenda listings. RoHS/lead-free status per standard Microchip commercial-grade product offering; REACH and halogen-free status not explicitly stated in provided data.
