DSPIC33EP32GS506-E/PT - 16-bit DSC 70MIPS 32KB Flash | Microchip
MPN: DSPIC33EP32GS506-E/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.2 | $5.20 |
| 10 | $4.7 | $47.00 |
| 100 | $4.25 | $425.00 |
| 500 | $3.85 | $1,925.00 |
| 1,000 | $3.5 | $3,500.00 |
DSPIC33EP32GS506-E/PT Overview
A digital signal controller combines the computational capability of a digital signal processor with the peripheral set and ease of use of a microcontroller. Within the power-management hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP: it executes closed-loop control algorithms such as power factor correction, LLC resonant control, and interleaved buck conversion at switching frequencies that general MCUs cannot sustain.
Key features include a high-speed 12-bit ADC (up to 10 Msps) with up to 16 channels for simultaneous multi-rail current and voltage sensing, an on-chip high-speed PWM module with dedicated time base and complementary outputs purpose-built for SMPS topologies, DAC outputs for comparator references, and the dsPIC33E core running at up to 70 MIPS from a 3.3V supply. The device is identified by Microchip as Functional Safety (FuSa) capable.
Architecturally, the dsPIC33E core uses a modified Harvard pipeline with DSP-style multiply-accumulate (MAC) instructions and a barrel shifter, enabling single-cycle execution of the PID and filter mathematics at the heart of digital power loops. Boundary scan and multiple PGECx/PGEDx ICSP pairs simplify in-circuit debug and programming.
Typical applications include AC-DC power supplies with interleaved power factor correction, DC-DC converters, solar micro-inverters, LED drivers, battery chargers, and uninterruptible power supplies. Microchip provides an interleaved PFC reference design specifically for this SMPS DSC family.
Design consideration: connect every VDD and VSS pin pair on the 64-TQFP and pair PGECx with its matching PGEDx for programming; mismatched ICSP pairs are a common bring-up failure.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP32GS506-E/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP32GS506-E/PT (same form factor and footprint) — differing in Package, Core Architecture, Operating Temperature, Analog Peripherals, PWM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP32GS506-I/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP16GS506-I/PT
✅ Drop-In✓ In Stock
$2.95 / Unit
View Datasheet →DSPIC33EP32GP504T-I/PT
✅ Drop-In✓ In Stock
$2.15 / Unit
View Datasheet →DSPIC33EP256MC504-I/PT
✅ Drop-In✓ In Stock
$4.6 / Unit
View Datasheet →DSPIC33EP16GS504-I/PT
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33CH256MP506-E/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP32GS506-E/PT Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E, 16-bit RISC DSC |
| Program Memory (Flash) | 32 KB (32K x 8) |
| Maximum CPU Speed | 70 MIPS (up to 60 MHz operation) |
| Supply Voltage | 3.3 V |
| Package | 64-TQFP (10x10 mm), EP, 0.5 mm pitch |
| Operating Temperature | -40C to +125C (E grade, extended) |
| Mounting Type | Surface Mount |
| Application Focus | Digital Power / SMPS with High-Speed ADC and DAC |
| ADC | High-speed 12-bit ADC for digital power |
| DAC | On-chip DAC (comparator reference) |
| PWM | High-speed SMPS-optimized PWM module |
| Debug/Programming | ICSP via multiple PGECx/PGEDx pairs, boundary scan |
| Core Peripherals | Barrel shifter, DSP MAC support |
| Functional Safety | FuSa capable (per Microchip/DigiKey) |
| Lifecycle Status | In Production |
| Packaging | Tray |
DSPIC33EP32GS506-E/PT 64-tqfp (10x10 mm), ep, 0.5 mm pitch Pin Configuration Guide
Pin configuration for DSPIC33EP32GS506-E/PT (64-tqfp (10x10 mm), ep, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP32GS506-E/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP32GS506-E/PT is suitable for 6 applications: Interleaved Power Factor Correction (PFC), DC-DC Converter Control, Solar Micro-Inverters, LED Drivers and Lighting Power, Battery Chargers and Energy Storage, Uninterruptible Power Supplies (UPS).
Interleaved Power Factor Correction (PFC)
The DSPIC33EP32GS506-E/PT is purpose-built for interleaved PFC stages in AC-DC power supplies. Its high-speed 12-bit ADC samples instantaneous inductor current fast enough for average-current-mode control, while the SMPS-optimized PWM module generates phase-shifted complementary outputs for interleaved legs, reducing input ripple current and EMC filter size. Microchip supplies a dedicated interleaved PFC reference design for this class of SMPS dsPIC DSCs, shortening development time. Operating at up to 70 MIPS, the controller executes the current loop, voltage loop, and housekeeping tasks in a single device. Placing the controller close to the switching stage with short sense traces preserves ADC accuracy; the extended -40C to +125C grade suits sealed industrial PSUs where ambient near the controller exceeds 85C.
Recommended
DC-DC Converter Control
In telecom rectifiers, server PSU bricks, and point-of-load front ends, the DSPIC33EP32GS506-E/PT closes voltage- and current-mode loops for buck, boost, and LLC topologies. The dedicated high-speed PWM supports complementary outputs with adjustable dead time, and the on-chip DAC provides programmable comparator references for cycle-by-cycle overcurrent protection without external reference ICs. The 70 MIPS DSP core with single-cycle MAC instructions executes the PID or 2P2Z compensator each switching cycle even at hundreds of kHz. The 3.3V supply simplifies interfacing with gate-driver logic. Because firmware, not hardware, defines the control law, one PCB supports multiple output-voltage SKUs, cutting inventory cost. Extended -40C to +125C operation is valuable in fanless enclosed converters.
Recommended
Solar Micro-Inverters
Micro-inverter designs need MPPT, grid-synchronized current shaping, and safety compliance in one controller. The DSPIC33EP32GS506-E/PT handles maximum-power-point tracking with its fast 12-bit ADC sampling panel voltage/current, generates the grid-frequency-referenced PWM for the DC-AC stage, and supervises anti-islanding logic in firmware. The 70 MIPS headroom supports both the control loops and the grid monitoring code concurrently. On-chip DAC references enable fast hardware overvoltage/overcurrent trip thresholds independent of the software loop, a requirement for grid-tied safety. The extended temperature grade tolerates rooftop enclosure temperatures that regularly exceed 85C, where an industrial-grade part would be out of specification, making the -E/PT variant the correct choice for this application.
Recommended
LED Drivers and Lighting Power
High-power LED drivers use the DSPIC33EP32GS506-E/PT to regulate LED current with fast feedback while dimming via PWM granularity unavailable in analog-only drivers. The SMPS PWM module's high resolution enables flicker-free dimming curves, and the 12-bit ADC monitors current sense and temperature (via external sensor) for derating and fault shutdown. The 70 MIPS core sustains constant-current loop bandwidths that keep visible ripple low, and firmware flexibility supports multi-string sequencing and DALI/0-10V interface decoding on the same die. The extended -40C to +125C range covers outdoor luminaires and enclosed horticultural fixtures. Because the DAC sets trip thresholds in hardware, short-circuit protection reacts within one switching cycle, protecting costly LED strings.
Recommended
Battery Chargers and Energy Storage
Multi-chemistry battery chargers benefit from the DSPIC33EP32GS506-E/PT's ability to run CC/CV/taper charging profiles entirely in firmware. The high-speed 12-bit ADC tracks charge current and pack voltage continuously, while the SMPS PWM controls the power stage through buck or LLC conversion. On-chip DAC-driven comparators provide hardware safety cutoffs if software stalls, important for lithium cell protection. The 70 MIPS DSP core also executes coulomb counting and pack impedance estimation between loop updates. The extended temperature grade of the -E/PT suits outdoor energy-storage cabinets and EV-adjacent charging infrastructure where ambient can exceed 85C. Firmware-defined profiles mean one PCB supports lead-acid, LiFePO4, and NMC packs via configuration.
Recommended
Uninterruptible Power Supplies (UPS)
Line-interactive and double-conversion UPS units require simultaneous inverter control, battery-charger regulation, and transfer-switch supervision - workloads the DSPIC33EP32GS506-E/PT consolidates on one die. Its 70 MIPS core runs the inverter output-voltage loop with a sinusoidal reference at high update rates, while the 12-bit ADC samples input, output, and battery rails. The SMPS PWM drives the inverter bridge with dead-time-controlled complementary outputs, and hardware comparator trips via DAC references protect against shoot-through and overload faster than any software response. The extended -40C to +125C rating is needed because UPS enclosures often run hot with limited airflow. Interleaved PFC on the front end follows the same Microchip reference design approach used in standalone PFC products.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP32GS506-E/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP32GS506-I/PT | DSPIC33EP16GS506-I/PT | DSPIC33EP32GP504T-I/PT | DSPIC33EP256MC504-I/PT | DSPIC33CH256MP506-E/PT |
|---|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm), PT | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP - same footprint | 64-TQFP - same footprint | 64-TQFP - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 32 KB | 32 KB | 16 KB | 32 KB | 256 KB | 256 KB |
| CPU Performance | Up to 70 MIPS | Up to 70 MIPS | Up to 70 MIPS | Up to 70 MIPS class | Up to 70 MIPS class | Dual-core, higher effective throughput |
| Peripheral Focus | GS digital power: high-speed ADC, DAC, SMPS PWM | GS digital power - identical | GS digital power - identical set | GP general-purpose peripherals | MC motor-control peripherals | Dual-core digital signal controller |
| Core Architecture | Single-core dsPIC33E, 16-bit DSP MAC | Single-core dsPIC33E - identical | Single-core dsPIC33E - identical | Single-core dsPIC33E - identical | Single-core dsPIC33E - identical | Dual-core dsPIC33CH |
| Lifecycle Status | In Production (active) | Active | Active | Active | Active | Active |
Key Differentiators
- Extended temperature range for hot power enclosures (vs DSPIC33EP32GS506-I/PT)
- Double the program memory at the same footprint (vs DSPIC33EP16GS506-I/PT)
- Dedicated digital-power peripherals vs general-purpose family (vs DSPIC33EP32GP504T-I/PT)
- Lower cost than dual-core for single-loop designs (vs DSPIC33CH256MP506-E/PT)
- Trade-off: smaller Flash than MC family (vs DSPIC33EP256MC504-I/PT)
Design Notes
ICSP pairing is the most common bring-up failure on this family: the dsPIC33EP32GS506 has more than one PGECx/PGEDx pair, and ICSPCLK and ICSPDAT must come from the SAME pair (for example PGEC2 with PGED2). Mixing pairs prevents programming and debugging entirely. Additionally, connect ALL VDD and VSS pins on the 64-TQFP even if the internal supply seems adequate on a prototype; floating power pins cause intermittent ADC noise and brownout resets that are very hard to diagnose in a digital power system.
In SMPS layouts, route the current-sense inputs to the high-speed ADC as a tightly coupled pair as close to the shunt as possible, and keep the analog ground reference for the ADC away from the gate-drive return currents. Use the exposed-pad TQFP's thermal pad (EP per the FindIC/Jotrin listings) tied to a quiet ground pour. Place the controller's decoupling (100 nF per VDD pin plus bulk 10 uF) directly at the pins; digital power controllers are simultaneously noise victims and noise sources, so isolate the controller island from the power stage with a ground split that meets only at a single point.
The controller runs from a single 3.3V supply. Estimated: dsPIC33E core current at 70 MIPS is typically in the tens of mA class (exact figure in the manufacturer datasheet current-consumption tables), so a small LDO or buck from the housekeeping rail suffices. However, ensure the 3.3V rail is clean and sequenced with the power stage: if the gate-driver supply comes up before the controller, spurious PWM outputs at reset can shoot through the bridge. Use the device reset/PWM-disable features to hold outputs inactive until firmware explicitly enables the stage.
For the extended -40C to +125C (E) grade, derate maximum clock if the ambient near the controller is close to 125C. Estimated: with a 64-TQFP theta_JA on a standard 4-layer board typically around 40-50 C/W (verify the exact package thermal table in the manufacturer datasheet), controller dissipation of roughly 0.2 W corresponds to about an 8-10 C junction rise - acceptable, but switching-stage proximity heating must be included in the stack-up. Verify actual junction temperature in the worst-case thermal image during design validation, not just at room ambient.
Compliance Information
Compliance certificates were not present in the captured web data. Obtain the official Material Declaration from Microchip's product page for the DSPIC33EP32GS506-E/PT before production release.
