DSPIC33EP64MC504-I/TL - 16-bit DSC, 70 MIPS, 64KB Flash | Microchip
MPN: DSPIC33EP64MC504-I/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.62 | $5.62 |
| 10 | $5.06 | $50.60 |
| 100 | $4.44 | $444.00 |
| 500 | $3.94 | $1,970.00 |
| 1,000 | $3.52 | $3,520.00 |
DSPIC33EP64MC504-I/TL Overview
A digital signal controller combines the computational architecture of a microcontroller with the math-acceleration hardware of a digital signal processor. In the product hierarchy, the dsPIC33EP family sits between general-purpose 16-bit MCUs (such as the PIC24) and dedicated DSPs, making it a preferred choice for closed-loop control systems that need fast multiply-accumulate operations, deterministic interrupt latency, and rich on-chip peripherals in a single-voltage 3.0 V to 3.6 V device.
Key features of the DSPIC33EP64MC504-I/TL include the 16-bit dsPIC DSC core with DSP engine supporting 70 MIPS operation, 64 KB of self-programmable flash for code storage, connectivity peripherals including CAN, I2C, SPI, UART/USART, IrDA, LINbus, and QEI (quadrature encoder interface), plus a high-speed PWM module targeted at precision motor control. The digchip listing documents 51 general-purpose I/O available in the 44-pin QFNL package and multiple general-purpose timers, including nine 16-bit timers.
Architecturally, the dsPIC33EP core integrates a dedicated DSP multiply-accumulate unit, hardware division support, and zero-overhead looping, which allows control loops such as field-oriented motor control to execute predictably at multi-kHz rates. The enhanced peripherals are tightly coupled to the core so that PWM updates, ADC sampling, and interrupt handling occur with minimal software overhead.
Typical applications include brushless DC and permanent-magnet synchronous motor drives, digital power supplies and PFC stages, and industrial sensing and actuation nodes where the QEI input directly interfaces with rotary encoders. The CAN interface makes the part suitable for automotive-adjacent and industrial fieldbus nodes.
When designing with this device, pay attention to the exposed thermal pad on the VQFN-44 (TL) package: it must be soldered to a ground plane both for mechanical reliability and thermal dissipation, and ICSP programming requires matching PGECx/PGEDx pin pairs.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP64MC504-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64MC504-I/TL (same form factor and footprint) — differing in Package, Core, Operating Temperature, Qualification, Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64MC504-E/TL
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →DSPIC33EP64MC503-E/TL
✅ Drop-In✓ In Stock
$3.55 / Unit
View Datasheet →DSPIC33EP64MC204T-E/TL
✅ Drop-In✓ In Stock
$3.55 / Unit
View Datasheet →DSPIC33EP64GP503-I/TL
✅ Drop-In✓ In Stock
$3.51 / Unit
View Datasheet →DSPIC33EP64GP503T-I/TL
✅ Drop-In✓ In Stock
$3.9 / Unit
View Datasheet →DSPIC33EP64MC504-I/TL Maximum Ratings & Electrical Characteristics
| Core | 16-bit dsPIC DSC |
| Maximum MIPS | 70 MIPS |
| Program Memory | 64 KB Flash |
| Data SRAM | 16 KB |
| Supply Voltage | 3 V to 3.6 V |
| Operating Temperature | -40C to +85C (I grade) |
| Package | 44-pin VQFN (TL), 9 x 9 mm, 0.90 mm height, exposed pad |
| I/O Ports | 51 |
| General Purpose Timers | 9 x 16-bit |
| Connectivity Peripherals | CAN, I2C, SPI, UART/USART, IrDA, LINbus, QEI |
| Special Peripherals | High-Speed PWM |
| Mounting Type | Surface Mount |
| Lifecycle Status | Active |
| Programming Interface | ICSP (PGECx/PGEDx pin pairs) |
DSPIC33EP64MC504-I/TL 44-pin vqfn (tl), 9 x 9 mm, 0.90 mm height, exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP64MC504-I/TL (44-pin vqfn (tl), 9 x 9 mm, 0.90 mm height, exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64MC504-I/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64MC504-I/TL is suitable for 6 applications: Brushless DC / PMSM Motor Drives, Digital Power Supplies and PFC, Industrial CAN Fieldbus Nodes, Motion and Encoder-Based Position Sensing, Embedded Sensing and Data Acquisition, Automotive-Adjacent and LIN Systems.
Brushless DC / PMSM Motor Drives
The DSPIC33EP64MC504-I/TL fits precision motor control because its 70 MIPS DSP-enhanced core executes field-oriented control (FOC) loops at deterministic multi-kHz rates, while the high-speed PWM module generates complementary PWM outputs with dead-time control for three-phase inverters. The QEI peripheral directly decodes quadrature encoder feedback, and fast interrupt response keeps current-loop sample timing within microseconds. In a typical topology, the DSC reads phase currents via its ADC, computes dq-axis transformations using the DSP multiply-accumulate engine, and updates PWM duty cycles each cycle. Because all control peripherals are on-chip, no external coprocessor is needed; the main trade-off versus a general-purpose MCU is the 3.0 V to 3.6 V supply domain, which requires gate-driver level translation on 5 V or higher bus systems.
Recommended
Digital Power Supplies and PFC
For digital power conversion, the DSPIC33EP64MC504-I/TL's combination of high-speed PWM with fine duty-cycle resolution and a 70 MIPS core makes it well suited to implementing voltage-mode and current-mode control laws for buck, boost, and PFC stages. The DSP engine computes compensator equations every switching cycle, and the high-speed PWM supports phase-shifted and complementary topologies needed in LLC and interleaved designs. On-chip analog (ADC sampling synchronized to the PWM period) closes the feedback loop without external controllers. A quantified benefit is deterministic loop latency: control code executes in a fixed number of instruction cycles at 70 MIPS, simplifying stability analysis. The design trade-off is that the 3.3 V logic supply means ADC input conditioning must scale down sensing signals from high-voltage rails via isolated or resistive dividers.
Recommended
Industrial CAN Fieldbus Nodes
The on-chip CAN controller of the DSPIC33EP64MC504-I/TL makes it a compact CANopen/DeviceNet-style node processor for factory automation. According to the Microchip USA listing, connectivity includes CAN, I2C, SPI, UART/USART, IrDA, and LINbus, so a single device can bridge a CAN backbone to local I2C sensors and UART field devices while the nine 16-bit timers handle task scheduling and measurement capture. With 51 I/O documented for the QFNL package and 64 KB flash, there is headroom for protocol stacks plus application logic. Using the DSC's DSP capability, on-node signal filtering (for example, FIR filtering of noisy sensor data) runs without host intervention. The practical consideration is bus fault protection: external CAN transceivers and ESD protection are required since the CAN peripheral is logic-level only.
Recommended
Motion and Encoder-Based Position Sensing
Quadrature encoder interfacing is a native capability of the DSPIC33EP64MC504-I/TL via its QEI peripheral, which counts encoder A/B channels in hardware with 4x decoding, eliminating software latency and lost-count issues at high pulse rates. Combined with the timer system and 70 MIPS core, the device can compute velocity, direction, and position in closed-loop servo applications such as CNC axes, robotics joints, and conveyor synchronization. The 51 available I/O allow direct interface to limit switches and safety interlocks alongside the encoder channels. A typical design reads the QEI counter in a fixed-rate interrupt and runs a PID position loop; the DSP engine accelerates the multiply-accumulate terms of the controller. Designers should verify encoder signal levels against the 3.0 V to 3.6 V supply domain and add RC filtering for noisy industrial encoder lines.
Recommended
Embedded Sensing and Data Acquisition
With its on-chip ADC, multiple communication interfaces, and DSP capability, the DSPIC33EP64MC504-I/TL serves as a compact acquisition front-end for industrial and medical sensing equipment. Sensor data from I2C or SPI devices (or the on-chip analog inputs) can be filtered using the DSP engine's multiply-accumulate throughput, then transmitted over UART, CAN, or SPI to a host. The nine 16-bit timers support precise sample scheduling, and 64 KB flash accommodates calibration routines and protocol handling. The extended -40C to +85C industrial grade (or the -E/TL variant to +125C) suits harsh environments. Quantitatively, a 70 MIPS core sustains tens of thousands of filter taps per millisecond, far beyond a typical 8-bit MCU, while still consuming single-digit idle power. The main layout consideration is keeping analog routing away from the high-speed PWM and clock lines.
Recommended
Automotive-Adjacent and LIN Systems
Although the -I/TL part is an industrial-temperature grade, its peripheral set - CAN, LINbus, UART, and IrDA per the Microchip USA listing - maps directly to body-electronics and auxiliary control units used in commercial and off-highway vehicles. The DSPIC33EP64MC504-I/TL can run LIN slave/master stacks over UART while simultaneously managing motor or actuator PWM control with the high-speed PWM module, all on one 3.3 V device. The 44-pin VQFN (9 x 9 mm) keeps board area small for control modules mounted near actuators. For designs that must survive the under-hood ambient, the same-footprint DSPIC33EP64MC504-E/TL extends the rated range to +125C as a drop-in swap. Designers should pair the CAN/LIN peripherals with appropriate transceivers and transient protection, and confirm load-dump survivability at the board level since the controller itself is a 3.0 V to 3.6 V device.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64MC504-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64MC504-E/TL | DSPIC33EP64MC503-E/TL | DSPIC33EP64MC204T-E/TL | DSPIC33EP64GP503-I/TL |
|---|---|---|---|---|---|
| Package | 44-pin VQFN (TL), 9 x 9 mm | 44-pin VQFN (TL) - same | 44-pin VQFN (TL) - same | 44-pin VQFN (TL) - same | 44-pin VQFN (TL) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Program Flash | 64 KB | 64 KB | 64 KB | 16 KB class (smaller option) | 64 KB |
| Operating Temperature | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) |
| Peripheral Family | MC (motor control, high-speed PWM) | MC (identical) | MC (reduced I/O/peripherals) | MC (reduced memory/peripherals) | GP (general purpose set) |
| Lifecycle Status | Active | Active | Active | Active | Active |
Key Differentiators
- Extended-temperature drop-in availability (vs DSPIC33EP64MC504-E/TL)
- Full 64 KB flash and 51 I/O in motor-control (MC) peripheral set (vs DSPIC33EP64MC204T-E/TL)
- Dedicated motor-control peripherals (high-speed PWM, QEI) (vs DSPIC33EP64GP503-I/TL)
Design Notes
The 44-pin VQFN (TL) package has an exposed thermal pad on the underside that must be soldered to the PCB ground plane. Design the land pattern with an array of thermal vias under the pad connecting to internal ground layers - this is required both for mechanical solder-joint reliability and for heat spreading. For hand assembly and rework, note that the peripheral QFN pads are recessed under the body, so use sufficient solder paste volume and verify with X-ray or visual inspection of the pad fillets.
The device operates from a single 3.0 V to 3.6 V supply. Place a 100 nF ceramic decoupling capacitor at every VDD pin pair, as close to the pin as possible, plus one bulk 4.7 uF to 10 uF capacitor per supply domain. The digchip listing documents 51 I/O ports on the QFNL package; simultaneous switching of many outputs at high speed can cause ground bounce, so use a solid ground return via the exposed pad and consider slew-rate control configuration on non-critical outputs.
ICSP programming requires matched PGECx/PGEDx pairs: if PGEC2 is used for ICSPCLK, ICSPDAT must go to PGED2 - mixing pairs from different channels is a common bring-up failure, per NSDSP documentation for this device. Additionally, all VSS and VDD pins must be connected for programming and debugging. When migrating code from dsPIC33F to dsPIC33EP, note the EP family has a different oscillator and configuration-word scheme; do not reuse F-family configuration bits directly.
Compliance Information
Compliance data not present in the provided web results; verify on the Microchip product page or distributor environmental data sheets.
