DSPIC33FJ16GP101-E/SO - 16 MIPS 16KB Flash DSC, SOIC-18
MPN: DSPIC33FJ16GP101-E/SO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.15 | $41.50 |
| 100 | $3.69 | $369.00 |
| 500 | $3.32 | $1,660.00 |
| 1,000 | $2.95 | $2,950.00 |
DSPIC33FJ16GP101-E/SO Overview
In the broader device taxonomy, the DSPIC33FJ16GP101 belongs to the dsPIC33F "GP" (General Purpose) family of Digital Signal Controllers, an intermediate class between traditional 8/16-bit microcontrollers and full Digital Signal Processors (DSPs). DSPs add hardware multiply-accumulate (MAC) units, dual-ported SRAM, and zero-overhead looping to a microcontroller's peripheral set, enabling single-cycle 16x16 MAC operations and on-chip FIR/IIR filter execution without taxing the CPU. The GP sub-family is engineered for general-purpose DSP and high-speed precision digital control, making it useful wherever a closed-loop algorithm must run in real time without an external DSP.
Key features include a 40 MHz maximum operating frequency (16 MIPS at FCY = FOSC/2), an enhanced ADC with up to 12-bit resolution and on-chip reference, a motor-control PWM peripheral, I2C, SPI, and UART interfaces, five 16-bit timer/counters, and three external interrupts with two remappable sources. The 5V-tolerant I/Os source/sink 10 mA or 6 mA in standard mode and up to 20 mA in non-standard VOH1 mode, easing direct drive of logic-level circuitry.
Typical applications include industrial motor control (BLDC, PMSM, and stepper drives), digital power conversion, sensorless fan and pump controllers, audio processing front-ends, and precision switch-mode power supplies. Automotive-grade (-E) screening and the SOIC-18 footprint also suit AEC-Q100 contexts and through-hole-friendly prototyping.
When designing with this part, plan for an external 2.5-3.0 V LDO and a low-ESR decoupling network on VDDCORE. Use ICSP for programming and the device's remappable peripheral pins (RPn) to optimize PCB routing on the small SOIC-18 footprint.
This page synthesizes distributor stock, design-in considerations and drop-in alternatives that complement the Microchip datasheet (DS-70000652F).
Drop-in alternatives for DSPIC33FJ16GP101-E/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ16GP101-E/SO (same form factor and footprint) — differing in Package, External Interrupts, Operating Temperature, Program Memory (Flash), Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ16GP102-E/SO
✅ Drop-In✓ In Stock
$1.86 / Unit
View Datasheet →DSPIC33FJ16MC101-E/SO
✅ Drop-In✓ In Stock
$2.71 / Unit
View Datasheet →DSPIC33FJ16GP101-I/SO
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ16GP101-H/SO
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ32GP102-E/SO
✅ Drop-In✓ In Stock
$2.19 / Unit
View Datasheet →DSPIC33FJ16GP101-E/SO Maximum Ratings & Electrical Characteristics
| Core | dsPIC33F 16-bit DSC (RISC + DSP) |
| Maximum CPU Speed | 16 MIPS (40 MHz FOSC) |
| Program Memory (Flash) | 16 KB |
| Data RAM | 1 KB |
| Supply Voltage (VDD) | 3.0 V to 3.6 V |
| Operating Temperature | -40 °C to +125 °C (extended, "-E") |
| I/O Pins | 21 |
| Timers | 5 x 16-bit |
| Communication Peripherals | UART, SPI, I2C |
| PWM Modules | Motor-Control PWM (PWM, complementary outputs) |
| External Interrupts | 3 (2 remappable) |
| I/O Drive Strength | 10 mA source / 6 mA sink (up to 20 mA non-standard VOH1) |
| Package | SOIC-18 (SO W), 18 pins, 1.27 mm pitch |
| Mounting Type | Surface Mount (SOIC Wide Body) |
| Programming/Debug | ICSP via MPLAB Snap / ICD / REAL ICE |
| RoHS Status | Compliant |
DSPIC33FJ16GP101-E/SO Pin Configuration
| Pin 1 | VDD — Digital supply voltage (3.0-3.6 V) |
| Pin 2 | OSC1/RA2 — Crystal/clock input or remappable I/O |
| Pin 3 | OSC2/RA3 — Crystal/clock output or remappable I/O |
| Pin 4 | TDO/RA4 — JTAG TDO or remappable I/O |
| Pin 5 | EMU1/RP0 — JTAG EMU or remappable peripheral pin |
| Pin 6 | MCLR — Master Clear / reset input (active low) |
| Pin 7 | PGEC1/RP1 — ICSP clock / remappable peripheral |
| Pin 8 | PGED1/RP2 — ICSP data / remappable peripheral |
| Pin 9 | VSS — Ground reference |
| Pin 10 | RP3 — Remappable peripheral input/output |
| Pin 11 | RP4 — Remappable peripheral input/output |
| Pin 12 | AN0/RP5 — Analog input / remappable I/O |
| Pin 13 | VDDCORE — Internal core voltage decoupling |
| Pin 14 | AN1/RP6 — Analog input / remappable I/O |
| Pin 15 | RP7 — Remappable peripheral I/O |
| Pin 16 | RP8/PWM1H — Remappable I/O / PWM high output |
| Pin 17 | PWM1L/RP9 — PWM low output / remappable I/O |
| Pin 18 | VDD — Digital supply voltage (3.0-3.6 V) |
Typical Applications
DSPIC33FJ16GP101-E/SO is suitable for 6 applications: BLDC Motor Control, Switch-Mode Power Supply (SMPS) Digital Control, Industrial Sensor Conditioning, Automotive Body Electronics, Digital Audio Processing, Sensorless Fan / Pump Control.
BLDC Motor Control
The DSPIC33FJ16GP101-E/SO suits small BLDC and PMSM motor drives through its 16 MIPS core, 16 KB Flash and integrated motor-control PWM peripheral with complementary outputs and programmable dead time. Its 10/12-bit ADC and dual-ported RAM allow efficient field-oriented control loops, while the SOIC-18 wide-body footprint and -40 °C to +125 °C rating support industrial and automotive under-the-hood deployment where DSP-grade maths runs in a single package.
Recommended
Switch-Mode Power Supply (SMPS) Digital Control
Digital SMPS loops demand cycle-accurate ADC sampling, rapid digital compensator math and high-resolution PWM outputs. The DSPIC33FJ16GP101-E/SO combines a 40 MHz dsPIC core (16 MIPS) with hardware multiply-accumulate, allowing fixed-point PI/PID controllers and feed-forward loops to be closed in under 4 µs. The motor-control PWM module doubles as a high-resolution digital PWM for PFC and DC-DC converters. The 1 KB dual-ported RAM is sized for sliding-window current sense averaging, while 16 KB Flash holds state-machine firmware and telemetry libraries.
Recommended
Industrial Sensor Conditioning
When bridging 4-20 mA analog sensors or strain-gauge bridges to digital fieldbuses, the DSPIC33FJ16GP101-E/SO provides on-chip 10/12-bit ADC, hardware DSP MAC operations for digital filtering, plus UART/I2C/SPI to push processed data to a host PLC or microcontroller. Its wide -40 °C to +125 °C operating range, AEC-Q100-friendly screening and 5V-tolerant I/Os let it share I/O lines with legacy 5V industrial sensors on the same SOIC-18 board.
Recommended
Automotive Body Electronics
The -E temperature grade and AEC-Q100-friendly screening qualify the DSPIC33FJ16GP101-E/SO for automotive body modules including HVAC actuators, seat controllers and sensor clusters. Its 16 MIPS DSP performance handles audio fan-speed synthesis and CAN-LIN routed diagnostics over UART, while the SOIC-18 wide-body withstands vibration stress typical of underhood mounting. Hardware QEI and motor-control PWM simplify stepping-motor mirrors, electric seat motors and HVAC damper servos.
Recommended
Digital Audio Processing
Audio noise reduction, parametric EQ and dynamic range control all run on hardware MAC hardware. The DSPIC33FJ16GP101-E/SO delivers 16 MIPS at 40 MHz to perform 16-bit FIR filtering and biquad EQ stages at typical 32-48 kHz sample rates. The PWM and timer peripherals produce PWM-audio Class-D outputs, while the 1 KB RAM is sufficient for circular audio buffers. The SOIC-18 wide-body aids hand-prototyping and reflow-friendly volume assembly.
Recommended
Sensorless Fan / Pump Control
Sensorless BEMF-driven BLDC control of small fans, pumps or blowers fits the DSPIC33FJ16GP101-E/SO's 16 MIPS throughput and integrated motor-control PWM. Theon-chip 10/12-bit ADC samples BEMF voltage through resistive dividers, while the PWM module drives a half-bridge or three-phase inverter with hardware dead-time insertion. The SOIC-18 wide-body footprint simplifies hand-soldered prototypes, and the 16 KB Flash holds full state-machine firmware including startup ramps and stall-detect.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ16GP101-E/SO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ16GP102-E/SO | DSPIC33FJ16MC101-E/SO | DSPIC33FJ16GP101-I/SO | DSPIC33FJ16GP101-H/SO | DSPIC33FJ32GP102-E/SO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | SOIC-18 (SO W) | SOIC-18 (SO W) - same | SOIC-18 (SO W) - same | SOIC-18 (SO W) - same | SOIC-18 (SO W) - same | SOIC-18 (SO W) - same |
| CPU Speed | 16 MIPS (40 MHz) | 16 MIPS (40 MHz) | 16 MIPS (40 MHz) | 16 MIPS (40 MHz) | 13 MIPS (32 MHz, -20%) | 16 MIPS (40 MHz) |
| Flash Memory | 16 KB | 32 KB (+100%) | 16 KB (same) | 16 KB (same) | 16 KB (same) | 32 KB (+100%) |
| RAM | 1 KB | 2 KB (+100%) | 1 KB (same) | 1 KB (same) | 1 KB (same) | 2 KB (+100%) |
| Supply Voltage | 3.0-3.6 V | 3.0-3.6 V (same) | 3.0-3.6 V (same) | 3.0-3.6 V (same) | 3.0-3.6 V (same) | 3.0-3.6 V (same) |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C (same) | -40 °C to +125 °C (same) | -40 °C to +85 °C (industrial) | -40 °C to +150 °C (automotive) | -40 °C to +125 °C (same) |
| PWM Peripheral | Motor-control PWM | Motor-control PWM (same) | Enhanced motor-control PWM (more PWM channels) | Motor-control PWM (same) | Motor-control PWM (same) | Motor-control PWM (same) |
| Approx. Unit Price (qty 1) | ~$4.62 | ~$5.10 | ~$4.62 | ~$3.90 | ~$6.40 | ~$5.80 |
Key Differentiators
- Highest operating temperature (-40 °C to +125 °C) within the dsPIC33FJ16GP101 SOIC-18 family (vs DSPIC33FJ16GP101-I/SO)
- Maximum Flash + RAM headroom within the SOIC-18 drop-in family (vs DSPIC33FJ16GP101-E/SO (this part))
- Peripheral set optimized for general-purpose DSP, not motor control (vs DSPIC33FJ16MC101-E/SO)
Design Notes
Estimated: the DSPIC33FJ16GP101-E/SO requires an external 10 µF bulk + 0.1 µF high-frequency ceramic decoupler close to each VDD/VDDCORE pair. VDDCORE (pin 13) must be bypassed with a 4.7 µF-10 µF low-ESR capacitor to retain the on-chip 2.5 V regulator stability. Without 1 square inch (645 mm²) of copper under the SOIC-18 thermal pad or wide SOIC trace, the regulator may fold back at full 40 MHz operation. Power-on reset takes up to 72 µs of crystal settling time.
A common design pitfall is unconfiguring pins that default to analog at reset. Pins AN0/AN1 must be cleared in the AD1PCFGL register before they can be used as RP5/RP6 digital I/Os - leaving them as analog inputs causes the remappable peripheral to read silence. Also, configure JTAG off if not in use to free the RP0/TDO/EMU1 pins for remapping. Always program the device using MPLAB Snap with the latest device pack to avoid ID mismatch during ICSP.
Estimated: keep crystal traces within 200 mils (5 mm) of OSC1/OSC2 and shield them with a grounded guard trace to prevent the PWM's high dV/dt from corrupting the clock. Place the VDDCORE cap with traces shorter than 0.25 in (6 mm). The SOIC-18 wide-body requires wider trace spacing than SOIC-8 / SOIC-14 - use 8 mil space/trace IPC-7351 land pattern. Remappable pins RPn should be routed to keep high-speed PWM traces away from analog AN0/AN1 inputs to avoid >20 dB crosstalk.
Compliance Information
Microchip designates the -E temperature grade as automotive-grade; AEC-Q100 status is qualified per the -E/-H suffix convention. RoHS/REACH compliance confirmed per Microchip product page (2026-09-26).
