DSPIC33FJ16GS404-H/ML - 16KB Flash 16-bit DSC, 50MHz, 44-QFN
MPN: DSPIC33FJ16GS404-H/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.62 | $5.62 |
| 10 | $5.08 | $50.80 |
| 100 | $4.41 | $441.00 |
| 500 | $3.84 | $1,920.00 |
| 1,000 | $3.32 | $3,320.00 |
DSPIC33FJ16GS404-H/ML Overview
What is a Digital Signal Controller? A DSC is a hybrid between a microcontroller and a DSP, combining deterministic interrupt-driven control with dedicated hardware multiply-accumulate (MAC) engines. The dsPIC33F family extends the PIC24 architecture with single-cycle MAC, dual 40-bit accumulators, and DSP-friendly addressing modes. In the broader product hierarchy, the dsPIC33F sits between PIC24 microcontrollers and dsPIC33E DSC devices, targeting motor control, digital power conversion, and high-performance embedded signal processing.
Key features include four 16-bit timer/counters, four high-speed PWM channels (1.04 ns resolution), a 12-bit ADC with up to 10 Msps conversion rate, four operational amplifiers, and two analog comparators with on-chip 12-bit DAC references. Communication peripherals include UART, SPI, and I2C. The device operates from 3.0V to 3.6V and is rated for -40C to +150C ambient (AEC-Q100 Grade 0) given the -H automotive extension.
Architecturally, the DSPIC33FJ16GS404 uses a modified Harvard architecture with separate program and data buses, enabling simultaneous fetch of an instruction and a data operand. The CPU executes most instructions in one cycle, with DSP instructions such as MAC taking a single cycle. The on-chip debug logic supports JTAG/ICSP, and the device is supported by MPLAB X IDE, XC16 compiler, and dsPIC33 DSP Library.
Typical applications include AC/DC and DC/DC power conversion, three-phase motor drives (BLDC, PMSM, induction), digital LED lighting drivers, UPS systems, automotive body and chassis ECUs, and solar micro-inverters. The high-resolution PWM, fast ADC, and analog comparators enable current/voltage-mode control loops without external glue logic.
When designing with this DSC, allocate sufficient decoupling (100 nF + 1 uF near VDD/AVDD) and route the analog and digital grounds to a single star point. The exposed pad (EP) on the QFN package MUST be soldered to a thermal pad on the PCB for electrical grounding and thermal dissipation; an unsoldered EP degrades thermal performance and may cause latch-up. Verify that your MPLAB X project selects the correct device ID (-H variant) before code generation.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33FJ16GS404-H/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ16GS404-H/ML (same form factor and footprint) — differing in ADC, Maximum CPU Speed, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ16GS404-I/ML
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →DSPIC33FJ16GS404-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ16GS404T-H/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ16GS404-H/ML Maximum Ratings & Electrical Characteristics
| Core | dsPIC33F 16-bit Digital Signal Controller |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (RAM) | 2 KB |
| Maximum CPU Speed | 50 MHz (40 MIPS) |
| Operating Voltage | 3.0 V to 3.6 V |
| ADC | 12-bit, up to 10 Msps, up to 24 channels |
| High-Speed PWM Channels | 4 outputs (PWM4H/L, configurable up to 8 outputs on family) |
| PWM Resolution | 1.04 ns at 40 MIPS |
| Comparators | 2 analog comparators with 12-bit DAC reference |
| Operational Amplifiers | 4 on-chip op-amps |
| Timers | 4 x 16-bit Timer/Counters |
| Communication | UART, SPI, I2C |
| Automotive Grade | AEC-Q100 (Grade 0, -40C to +150C) |
| Package | 44-lead QFN-EP (8x8 mm) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
DSPIC33FJ16GS404-H/ML Pin Configuration
| Pin 1 | RP0/AN0 — Remappable peripheral / analog input 0 |
| Pin 2 | RP1/AN1 — Remappable peripheral / analog input 1 |
| Pin 3 | RP2/AN2/AN7 — Remappable peripheral / analog input 2 or 7 |
| Pin 4 | RP3/AN3 — Remappable peripheral / analog input 3 |
| Pin 5 | VSS — Digital ground |
| Pin 6 | RP4/AN4 — Remappable peripheral / analog input 4 |
| Pin 7 | RP5/AN5 — Remappable peripheral / analog input 5 |
| Pin 8 | RP6/AN6 — Remappable peripheral / analog input 6 |
| Pin 9 | RP7 — Remappable peripheral / GPIO |
| Pin 10 | RP8 — Remappable peripheral / GPIO |
| Pin 11 | RP9 — Remappable peripheral / GPIO |
| Pin 12 | RP10 — Remappable peripheral / GPIO |
| Pin 13 | RP11 — Remappable peripheral / GPIO |
| Pin 14 | RP12 — Remappable peripheral / GPIO |
| Pin 15 | RP13 — Remappable peripheral / GPIO |
| Pin 16 | RP14 — Remappable peripheral / GPIO |
| Pin 17 | RP15 — Remappable peripheral / GPIO |
| Pin 18 | VSS — Digital ground |
| Pin 19 | VDD — Digital power supply 3.3V |
| Pin 20 | PWM1H — PWM output 1 high side |
| Pin 21 | PWM1L — PWM output 1 low side |
| Pin 22 | PWM2H — PWM output 2 high side |
| Pin 23 | PWM2L — PWM output 2 low side |
| Pin 24 | PWM3H — PWM output 3 high side |
| Pin 25 | PWM3L — PWM output 3 low side |
| Pin 26 | PWM4H — PWM output 4 high side |
| Pin 27 | PWM4L — PWM output 4 low side |
| Pin 28 | TDI — JTAG test data in |
| Pin 29 | TCK — JTAG test clock |
| Pin 30 | TMS — JTAG test mode select |
| Pin 31 | TDO — JTAG test data out |
| Pin 32 | MCLR — Master clear reset (active low) |
| Pin 33 | OSC1/CLKI — Crystal oscillator input or external clock |
| Pin 34 | OSC2/CLKO — Crystal oscillator output |
| Pin 35 | AVSS — Analog ground |
| Pin 36 | AVDD — Analog power supply 3.3V |
| Pin 37 | C1IN+/C2IN+ — Comparator 1 and 2 positive input |
| Pin 38 | C1IN-/C2IN- — Comparator 1 and 2 negative input |
| Pin 39 | C1OUT — Comparator 1 output |
| Pin 40 | C2OUT — Comparator 2 output |
| Pin 41 | OA1OUT — Op-amp 1 output |
| Pin 42 | OA1IN- — Op-amp 1 inverting input |
| Pin 43 | OA1IN+ — Op-amp 1 non-inverting input |
| Pin 44 | EP — Exposed pad - MUST be soldered to PCB thermal pad |
Typical Applications
DSPIC33FJ16GS404-H/ML is suitable for 6 applications: Digital DC/DC Power Conversion, Three-Phase BLDC / PMSM Motor Drive, Automotive Body and Chassis ECUs, UPS and Battery Charging Systems, Solar Micro-Inverter and MPPT, Digital LED Lighting Drivers.
Digital DC/DC Power Conversion
The DSPIC33FJ16GS404-H/ML is engineered for digital DC/DC converters thanks to its four high-speed PWM outputs with 1.04 ns edge resolution and a 12-bit ADC that converts up to 10 Msps. In a typical 300 kHz buck or boost converter, the PWM timer base of 7.38 ns at 40 MIPS gives 16-bit duty-cycle resolution, which is sufficient for tight line and load regulation without analog ripple-compensation networks. The AEC-Q100 Grade 0 rating supports under-hood automotive 12V/24V/48V converters where ambient temperatures reach 150C. Two analog comparators with 12-bit on-chip DAC references enable cycle-by-cycle current-mode control with programmable slope compensation, eliminating external CMP and DAC ICs and shrinking the BOM by 20-30% versus discrete implementations.
Recommended
Three-Phase BLDC / PMSM Motor Drive
Field-Oriented Control (FOC) for brushless DC and permanent-magnet synchronous motors is a primary target application for the DSPIC33FJ16GS404-H/ML. The device executes a single MAC instruction per cycle, enabling Clarke-Park transforms, PI current loops, and SVPWM modulation to complete in under 10 microseconds at 40 MIPS - well within the typical 20 kHz PWM period. Four on-chip op-amps support dual current-sense conditioning for two of the three phase currents without external signal chain. The -H grade supports automotive applications such as electric power steering, oil/water pumps, and HVAC blowers. The 16 KB Flash is sufficient for sensorless FOC with sliding-mode observer; designers needing Ethernet/CAN stacks should consider DSPIC33EV128GM004 instead.
Recommended
Automotive Body and Chassis ECUs
The -H suffix denotes AEC-Q100 Grade 0 qualification, enabling the DSPIC33FJ16GS404-H/ML to operate from -40C to +150C in automotive body and chassis ECUs. Typical applications include body control modules, HVAC flap control, seat positioning, mirror adjustment, and lighting drivers. The 16-bit DSC architecture combines the deterministic interrupt response of a microcontroller with DSP horsepower for active noise cancellation, audio beamforming, and signal conditioning. The 44-QFN-EP package (8x8 mm) is footprint-compatible with the DSPIC33FJ16GS402-I/MM and DSPIC33FJ16GP304-I/ML families, allowing PCB platform reuse across cost tiers. CAN/LIN communication is implemented via the UART and timer peripherals with external transceivers.
Recommended
UPS and Battery Charging Systems
Uninterruptible Power Supplies (UPS) and intelligent battery chargers leverage the DSPIC33FJ16GS404-H/ML for combined PFC + LLC or PFC + half-bridge control loops. The high-speed PWM and 12-bit ADC sample inductor current and output voltage each switching cycle, supporting unity-power-factor correction with less than 3% THD. The on-chip op-amps condition current-sense signals from external shunt resistors or current transformers. The AEC-Q100 grade allows the same firmware base to support industrial telecom UPS (48V bus) and automotive 12V battery charger applications, reducing qualification cycles. The 2 KB RAM accommodates sliding-mode observer state variables for lithium-ion battery State-of-Charge estimation without external memory.
Recommended
Solar Micro-Inverter and MPPT
Maximum Power Point Tracking (MPPT) micro-inverters for photovoltaic panels use the DSPIC33FJ16GS404-H/ML to implement Perturb-and-Observe or Incremental Conductance algorithms at panel-level (200W-500W). The DSC core executes the algorithm in under 1 microsecond per ADC sample, leaving CPU bandwidth for grid-synchronization PLL, anti-islanding detection, and reactive power compensation. The AEC-Q100 rating supports outdoor installations in extreme-temperature environments. Four PWM channels drive the full-bridge inverter and the synchronous-rectifier buck stage. The 44-QFN-EP footprint matches the DSPIC33EV128GM004-E/MLVAO, allowing migration to higher Flash when adding Wi-Fi/Bluetooth connectivity for energy monitoring.
Recommended
Digital LED Lighting Drivers
Intelligent LED drivers for automotive headlights, architectural lighting, and horticultural grow lights use the DSPIC33FJ16GS404-H/ML to combine constant-current regulation with dimming protocols. The four PWM channels drive the buck or boost converter MOSFETs while generating the PWM dimming signal at up to 25 kHz, well above the audible band to eliminate inductor whine. The 12-bit ADC monitors LED current, temperature, and input voltage simultaneously. The AEC-Q100 Grade 0 rating supports LED headlight applications with ambient temperatures up to 150C. The on-chip op-amps implement transconductance current-sense amplifiers for high-side or low-side sensing topologies. Designers can reuse the same firmware across multiple driver topologies (buck, boost, SEPIC, flyback) by changing the PWM configuration registers.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ16GS404-H/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ16GS404-I/ML | DSPIC33FJ16GS404-E/ML | DSPIC33FJ16GS404T-H/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN-EP (8x8 mm) | 44-QFN-EP (8x8 mm) - same | 44-QFN-EP (8x8 mm) - same | 44-QFN-EP (8x8 mm) - same |
| Flash Memory | 16 KB | 16 KB | 16 KB | 16 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB |
| CPU Speed | 50 MHz (40 MIPS) | 50 MHz (40 MIPS) | 50 MHz (40 MIPS) | 50 MHz (40 MIPS) |
| AEC-Q100 Grade | Grade 0 (-40C to +150C) | Not qualified (-40C to +85C) | Not qualified (-40C to +125C) | Grade 0 (-40C to +150C) |
| PWM Channels | 4 high-speed (1.04 ns resolution) | 4 high-speed | 4 high-speed | 4 high-speed |
| ADC | 12-bit, 10 Msps | 12-bit, 10 Msps | 12-bit, 10 Msps | 12-bit, 10 Msps |
| Packaging Format | Tray | Tray | Tray | Tape & Reel |
| Qty-1 Price (USD) | 5.62 | Approx. 4.95 | Approx. 5.15 | Approx. 5.62 |
Key Differentiators
- AEC-Q100 Grade 0 automotive qualification (vs DSPIC33FJ16GS404-E/ML)
- Tape-and-reel format for high-volume production (vs DSPIC33FJ16GS404-H/ML (tray))
- Wider AEC-Q100 Grade 0 temperature range vs same-silicon industrial variants (vs DSPIC33FJ16GS404-I/ML)
Design Notes
The 44-QFN-EP package dissipates up to 1.5 W at full CPU load (40 MIPS, all peripherals active, ADC sampling continuously). The exposed pad (EP) MUST be soldered to a 5x5 mm minimum copper thermal pad with at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) to a continuous ground plane. Without thermal vias, junction temperature can exceed 150C at +85C ambient, causing thermal shutdown. Estimated: Pmax = 1.5 W, theta_JA = 30 C/W on 2-oz 4-layer PCB with EP soldered -> Tj rise = 45C above ambient, well within the -H grade 150C ceiling.
Decouple VDD with a 100 nF X7R ceramic capacitor placed within 3 mm of each VDD pin, plus a bulk 4.7 uF tantalum or 10 uF ceramic at the IC supply entry. The AVDD analog supply pin should have a separate 100 nF + 10 uF RC filter (10 ohm ferrite + 10 uF cap) to isolate ADC reference noise from the digital supply. Connect AVDD and VDD at a single star point near the IC; AVSS and VSS must be tied together at the exposed pad to avoid ground loops that would couple digital switching noise into the ADC sampling.
Route PWM output traces as 50 ohm microstrip on the top layer or as 50 ohm stripline on an inner layer with continuous reference plane. Keep PWM traces shorter than 25 mm to minimize radiated emissions; use 33 ohm source-series resistors within 5 mm of the PWM pin to damp reflections if driving MOSFET gates longer than 50 mm. Place the ADC analog input traces away from PWM and switching node traces (use guard traces connected to AVSS) to maintain ADC signal integrity. Avoid routing high-speed signals across the EP split plane - keep the EP ground continuous under the analog inputs.
Common pitfalls include: (1) Forgetting to solder the EP pad, which causes latch-up on digital I/O; (2) Using the -H variant's MPLAB X device ID incorrectly - the -H requires the 'H' build suffix or the configuration bits will not match; (3) Exceeding the ADC input range (AVDD + 0.3 V) on analog inputs - use external clamp diodes for fault conditions; (4) Not configuring the PWMCON1 register dead-time generators before driving half-bridges - this can cause shoot-through and damage MOSFETs; (5) Applying > 5 mA to the MCLR pin - the MCLR input has a weak pull-up that requires open-drain reset circuitry.
Compliance Information
AEC-Q100 Grade 0 qualified per Microchip automotive qualification flow. RoHS compliant per Microchip product page. Halogen-free per Microchip environmental data sheet. REACH SVHC declared compliant.
