EFM32GG290F1024-BGA112 - 32-bit ARM Cortex-M3 MCU, 1MB Flash | Silicon Labs
MPN: EFM32GG290F1024-BGA112 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.92 | $89.20 |
| 100 | $7.45 | $745.00 |
| 500 | $6.3 | $3,150.00 |
| 1,000 | $5.5 | $5,500.00 |
EFM32GG290F1024-BGA112 Overview
An ARM Cortex-M3 microcontroller (MCU) is a 32-bit RISC processor core designed for embedded applications that need deterministic real-time behavior, low power consumption, and a Thumb-2 instruction mix that balances code density with computational throughput. Cortex-M3 cores are widely deployed in IoT, sensor hubs, industrial controllers, and human-interface products, and are positioned hierarchically as: ARM Cortex-M3 -> 32-bit MCU -> microcontroller -> semiconductor. The EFM32 Giant Gecko series extends this architecture with Silicon Labs' proprietary low-energy peripherals, fast wake-up time from sleep states, and a peripheral reflex system that lets timers, ADCs, and GPIO events trigger DMA transfers without CPU intervention.
Key differentiating features include 1 MB of on-chip Flash and 128 kB of SRAM, hardware AES encryption, a 12-bit ADC, multiple USART/UART/SPI/I2C peripherals, and a 4x16-bit timer/counter array. The 90 GPIO count and 112-ball BGA footprint make it a strong fit for industrial gateways and high-pin-count sensor hubs. The Cortex-M3 core also integrates a Memory Protection Unit (MPU) supporting up to 8 segments and a Wake-up Interrupt Controller for handling interrupts from sleep.
Technically, the part operates from a single 1.98 V to 3.8 V supply, is qualified over -40 C to +85 C, and supports an integrated LDO and DC-DC regulator for core power. The energy-friendly design lets the device drop below 1 uA in deep-sleep modes while retaining RTC and interrupt capability, addressing battery-operated applications where both processing power and standby current matter.
Typical applications include industrial IoT gateways, smart metering, home and building automation, asset tracking, wireless sensor nodes, security panels, and connected health devices. The 1 MB Flash tier also serves as a host for larger protocol stacks (Thread, ZigBee, BLE via co-processor) where ample code space is required.
When designing with the EFM32GG290F1024-BGA112, plan PCB escape routing for the 112-ball BGA carefully - the 0.8 mm ball pitch demands 4 or more PCB layers with microvia stack-ups. Decoupling should follow the datasheet's reference layout, and the debug SWD pins (SWDIO/SWCLK) must be brought out to a standard ARM Cortex debug header for programming.
This page synthesizes distributor pricing, drop-in BGA112 alternatives, and practical layout guidance not found in the manufacturer datasheet alone, helping engineers select the right Giant Gecko variant for high-density, low-energy embedded designs.
Drop-in alternatives for EFM32GG290F1024-BGA112 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EFM32GG290F1024-BGA112T
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG290F1024G-E-BGA112
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG990F1024-BGA112
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG290F512-BGA112
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32WG290F64-BGA112
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32LG290F256G-E-BGA112
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG290F1024-BGA112 Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M3 |
| Core Architecture | 32-bit RISC with Thumb-2 instruction set |
| Maximum CPU Frequency | 48 MHz |
| DMIPS Performance | 1.25 DMIPS/MHz |
| Program Memory (Flash) | 1024 kB (1 MB) |
| RAM | 128 kB |
| Digital I/O Pins | 90 |
| Supply Voltage | 1.98 V to 3.8 V |
| Operating Temperature Range | -40 C to +85 C |
| Package | 112-ball BGA (10x10 mm) |
| ADC | 12-bit SAR ADC |
| Timers | 4 x 16-bit timer/counter |
| Hardware Encryption | AES 128/256-bit |
| Memory Protection Unit | Yes, up to 8 segments |
| Mounting Type | Surface Mount |
EFM32GG290F1024-BGA112 112-ball bga (10x10 mm) Pin Configuration Guide
Pin configuration for EFM32GG290F1024-BGA112 (112-ball bga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EFM32GG290F1024-BGA112.
Refer to the datasheet for full pin configuration.
Typical Applications
EFM32GG290F1024-BGA112 is suitable for 7 applications: Industrial IoT Gateways, Smart Energy Meters, Wireless Sensor Nodes, Home and Building Automation Hubs, Connected Health Devices, Asset Tracking and Logistics, Security Panels and Access Control.
Industrial IoT Gateways
The EFM32GG290F1024-BGA112's 1 MB Flash and 128 kB RAM provide ample code space for multi-protocol industrial gateway stacks (Modbus, MQTT, Thread, BLE host). The 90 GPIO count and 112-ball BGA footprint accommodate multiple UART, SPI, and I2C busses needed for sensor aggregation. Operating from 1.98 V to 3.8 V matches 3.3 V industrial rails without external regulation, and sub-microamp EM4 hibernate current supports remote installations with battery or energy-harvesting backup. AES hardware encryption protects data at rest, and the 48 MHz Cortex-M3 core handles protocol parsing, sensor fusion, and secure boot in real time.
Recommended
Smart Energy Meters
The 12-bit ADC on the EFM32GG290F1024-BGA112 enables direct sampling of current shunts and Rogowski sensors in single-phase and three-phase energy meters. The 1024 kB Flash supports DLMS/COSEM or IEC 62056 protocol stacks alongside metering algorithms and tamper detection logic, while 128 kB RAM buffers measurement samples during wireless HAN transmission. The Cortex-M3 at 48 MHz delivers the throughput needed for simultaneous metrology, display driving, and PLC/RF communications. Wide -40 C to +85 C operating range and low-energy sleep modes also benefit battery-backed tamper detection circuits.
Recommended
Wireless Sensor Nodes
The EFM32GG290F1024-BGA112 acts as an application host processor paired with an external radio co-processor (such as an EFR32 sub-GHz or BLE transceiver) in battery-powered wireless sensor nodes. The 1 MB Flash accommodates full Thread, ZigBee, or proprietary RF protocol stacks, while 128 kB RAM buffers sensor telemetry before transmission. EM2 Deep Sleep draws only a few microamps with RTC running, enabling multi-year coin-cell operation when paired with low-power sensors. The 90 GPIO count also supports multi-axis IMU, environmental sensors, and energy harvesting source selection without I/O multiplexing.
Recommended
Home and Building Automation Hubs
The EFM32GG290F1024-BGA112 is well-suited for central HUB controllers that aggregate Z-Wave, ZigBee, BLE, and Wi-Fi sub-systems in residential and commercial buildings. The 1024 kB Flash and 128 kB RAM run multi-stack gateways, while 90 GPIO drives user interfaces including keypads, LCDs, and LED ring controllers. AES hardware acceleration secures KNX, BACnet, and proprietary automation traffic. Single 1.98 V to 3.8 V supply matches PoE-derived 3.3 V rails, and the 48 MHz Cortex-M3 throughput is sufficient for rule engines, scheduling, and cloud-edge bridging in real time.
Recommended
Connected Health Devices
The EFM32GG290F1024-BGA112 powers connected health monitors including blood pressure cuffs, multi-parameter patient monitors, and wearable health trackers. The 1 MB Flash supports FDA Class II firmware with secure boot, while AES secures BLE pairing and cloud transmission of PHI. The 12-bit ADC captures bioimpedance and ECG signals, and the 90 GPIO count supports LCD displays, button matrices, and pump drivers. The -40 C to +85 C range also supports sterilization environments, and EM4 hibernate at sub-microamp current extends battery life during patient standby.
Recommended
Asset Tracking and Logistics
The EFM32GG290F1024-BGA112 forms the processing backbone of multi-mode asset trackers combining GNSS, cellular IoT (LTE-M/NB-IoT), BLE, and Wi-Fi sniffing. The 1024 kB Flash stores location history, geofencing rules, and cellular protocol stacks, while 128 kB RAM buffers GNSS fixes during dead-reckoning periods. AES hardware encryption protects shipment telemetry end-to-end. The 90 GPIO count interfaces to battery fuel gauges, motion sensors, and tamper switches without external I/O expanders, and the Cortex-M3 at 48 MHz runs multi-radio arbitration logic in real time.
Recommended
Security Panels and Access Control
The EFM32GG290F1024-BGA112 is suitable for intrusion detection panels and access control systems that need reliable wired/wireless sensor monitoring. The 1 MB Flash supports zone configuration databases, event logging, and communication stacks (Contact ID, SIA, MQTT), and AES-256 hardware acceleration secures credential transmission and cloud reporting. The 90 GPIO interfaces directly to PIR sensors, reed switches, keypads, and sirens without external I/O expanders. Wide operating temperature and EM4 hibernate at sub-microamp current support 24/7 always-on security installations with battery backup.
Recommended
Recommended Products Summary
Engineering reference data for EFM32GG290F1024-BGA112 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EFM32GG290F1024-BGA112T | EFM32GG290F1024G-E-BGA112 | EFM32GG990F1024-BGA112 | EFM32GG290F512-BGA112 | EFM32WG290F64-BGA112 | EFM32LG290F256G-E-BGA112 |
|---|---|---|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | 112-ball BGA (10x10 mm) | 112-ball BGA (10x10 mm) - same | 112-ball BGA (10x10 mm) - same | 112-ball BGA (10x10 mm) - same | 112-ball BGA (10x10 mm) - same | 112-ball BGA (10x10 mm) - same | 112-ball BGA (10x10 mm) - same |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3/M4 | ARM Cortex-M3 |
| Max CPU Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash Memory | 1024 kB | 1024 kB | 1024 kB | 1024 kB | 512 kB (-50%) | 64 kB (-94%) | 256 kB (-75%) |
| RAM | 128 kB | 128 kB | 128 kB | 128 kB | 128 kB | 32 kB (-75%) | 64 kB (-50%) |
| GPIO Count | 90 | 90 | 90 | 87 | 90 | 90 | 90 |
| AES Hardware Encryption | Yes (128/256-bit) | Yes | Yes | Yes | Yes | Yes | Yes |
| Supply Voltage | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V |
Key Differentiators
- Highest Flash density in the EFM32 Giant Gecko BGA112 family (vs EFM32GG290F512-BGA112)
- Highest GPIO density at 90 pins in BGA112 Giant Gecko line (vs EFM32GG990F1024-BGA112)
- Single same-package SKU alternative on site MPN list (vs EFM32WG290F64-BGA112)
Design Notes
The 112-ball BGA package uses a 0.8 mm ball pitch on a 10x10 mm body, requiring 4 or more PCB layers with microvia-in-pad escape stack-ups for reliable assembly. Route signal traces on inner layers between via fan-outs to break out all 112 balls. Per Silicon Labs reference designs, allocate at least 4 ground vias under the BGA thermal pad for thermal and electrical grounding, and follow the datasheet's recommended decoupling: 1 uF + 100 nF per VDD pin pair, placed within 2 mm of the balls.
At the maximum 48 MHz CPU clock with all peripherals active, the EFM32GG290F1024-BGA112 draws roughly 16 mA from a 3.3 V supply, dissipating approximately 50 mW. The BGA112 package thermal pad connects to the die substrate and must be soldered to a copper pour with thermal vias to maintain junction temperature below 125 C in enclosed industrial enclosures. Estimated: theta_JA is approximately 35 C/W with a 4-layer JEDEC PCB and full thermal pad solder, giving a 65 C ambient + 35 C/W * 0.05 W = 2 C rise, well within limits.
Do not assume the BGA112 package is pin-compatible with QFP100 Giant Gecko variants - the ball map differs and migrating firmware between packages requires board rework. The Cortex-M3 core requires the SWDIO and SWCLK pins to be brought out to a debug header for production programming. Also note that GPIO pins on this part are 5 V tolerant only on specific pins; check the datasheet pinout table before interfacing 5 V logic to avoid latch-up.
Leverage EM2 Deep Sleep and EM4 Hibernate modes to achieve battery lifetimes measured in years on coin cells. EM2 retains RAM and RTC at roughly 1 uA; EM4 with RTC wake-up drops below 1 uA. According to the Silicon Labs EFM32GG290 datasheet, wake-up time from EM2 is approximately 2 us, allowing aggressive duty cycling in sensor applications. Disable unused peripherals in the CMU (Clock Management Unit) to avoid leakage current on unneeded GPIO banks.
Compliance Information
RoHS and lead-free compliant per Silicon Labs product page and Mouser and DigiKey listings. AEC-Q100 not applicable as this is not an automotive-qualified variant. Halogen-free status not stated on verified web data pages reviewed - see manufacturer datasheet for full compliance declaration.
