EFM32GG395F1024G-E-BGA120 - 48MHz Cortex-M3 MCU, 1MB Flash | Silicon Labs
MPN: EFM32GG395F1024G-E-BGA120 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.85 | $11.85 |
| 10 | $10.66 | $106.60 |
| 100 | $9.49 | $949.00 |
| 500 | $8.55 | $4,275.00 |
| 1,000 | $7.14 | $7,140.00 |
EFM32GG395F1024G-E-BGA120 Overview
A 32-bit microcontroller (MCU) is an integrated processor core, memory, peripherals, and I/O in a single chip. The Cortex-M3 is an ARM core with Thumb-2 instruction set, hardware divide, and deterministic interrupt handling, optimized for embedded deterministic applications. Within the MCU taxonomy it sits under Cortex-M3 -> ARM Cortex-M -> 32-bit MCU -> microcontroller -> semiconductor. The Giant Gecko family further emphasizes high-memory variants (up to 1 MB GB) while preserving the EFM32 ultra-low-power DNA.
Key features include 93 digital I/O pins, 4 x 16-bit timer/counter blocks, 12-bit ADC and DAC channels, 4 USART, 2 I2C, 2 USB x Low Voltage, AES-128/256 hardware accelerator, true random number generator, 4 x 16-bit PWM outputs, and a low-energy RTC. The integrated LCD controller supports up to 8 x 36 segments without external drivers. Energy-saving modes deliver a sub-microsecond wake-up time and EM0/EM2/EM3/EM4 modes enabling deep-sleep currents below 1 uA. The debug hardware from Cortex-M3 includes Serial Wire Debug (SWD), Embedded Trace Macrocell (ETM), and Serial Wire Viewer (SWV).
Architecturally, the EFM32GG395F1024G-E-BGA120 uses a Cortex-M3 Harvard architecture with separate I-code and D-code buses, 4 GB Flash memory per function, 1 MB single-bank Flash, and peripheral reflex system allowing autonomous peripheral-to-peripheral DMA without CPU intervention. This enables complex power-aware tasks to run while the CPU stays in EM2 sleep. The hardware AES engine performs AES-128/256 encryption in single clock cycles, and the TRNG provides a NIST-compliant entropy source for cryptographic applications.
Typical applications include USB HID peripheral, smart energy metering, building automation, smart sensor nodes, industrial control, low-power wireless sensor networks, wearable fitness devices, and battery-powered IoT HVAC controllers. The integrated USB peripheral supports both device and host modes, making the part well suited to USB-equipped IoT devices. The Giant Gecko high-memory configuration (1 MB GB) enables rich HMI interfaces with embedded graphics or USB device stacks. The wide GPIO count of 93 supports multi-segment LCD or keypad-driven products. A common use is a USB dongle for secure token provisioning and key exchange.
When designing with this MCU, the BGA-120 package requires careful PCB layout with at least 4 routing layers, controlled-impedance traces for USB DP/DM, and a solid ground plane for analog performance. Use a 1 uF decoupling capacitor per VDD pin, place a 32.768 kHz crystal on the update output, and route the SWD lines (SWDIO/SWDCLK) as a 2-wire debug interface with series-reset 10 kohm pull-up on SWDIO. The exposed thermal pad must be soldered to the PCB for mechanical reliability and thermal dissipation. For USB operation, the VBUS pin requires a 5 V to 3.3 V regulator on the GB85.
This page synthesizes distributor pricing, drop-in same-family alternatives, USB peripheral design references, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EFM32GG395F1024G-E-BGA120 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EFM32GG395F1024G-E-BGA120 (same form factor and footprint) — differing in Operating Temperature, Core Architecture, Program Memory (Flash), Package, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EFM32GG395F1024-BGA120
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG395F1024G-E-BGA120R
✅ Drop-In✓ In Stock
$7.95 / Unit
View Datasheet →EFM32GG395F1024-BGA120R
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG395F512G-E-BGA120
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG395F512G-E-BGA120R
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG395F1024G-E-BGA120 Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M3 |
| Core Architecture | ARM 32-bit |
| CPU Speed | 48 MHz |
| Program Memory (Flash) | 1024 kB (1M x 8) |
| RAM | 128 kB |
| Supply Voltage (Vdd) | 1.98 V to 3.8 V |
| Operating Temperature | -40 C to +85 C (industrial) |
| Digital I/O Pins | 93 |
| Package | 120-ball BGA (7 x 7 mm) |
| Mounting Type | Surface Mount |
| ADC | 12-bit |
| DAC | 12-bit |
| USB | USB 2.0 Full-Speed, device/host/OTG capable |
| Crypto Accelerator | AES-128/256, hardware TRNG |
| Timers | 4 x 16-bit timer/counter blocks |
| Connectivity | 4 x USART, 2 x I2C, 2 x SPI, USB |
| LCD Controller | Up to 8 x 36 segments |
| Debug Interface | Serial Wire Debug (SWD), ETM, SWV |
| RoHS Status | Compliant |
EFM32GG395F1024G-E-BGA120 120-ball bga (7 x 7 mm) Pin Configuration Guide
Pin configuration for EFM32GG395F1024G-E-BGA120 (120-ball bga (7 x 7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EFM32GG395F1024G-E-BGA120.
Refer to the datasheet for full pin configuration.
Typical Applications
EFM32GG395F1024G-E-BGA120 is suitable for 7 applications: USB HID Peripherals and Dongles, Smart Energy Metering, Industrial Sensor Hubs and IoT Edge Nodes, Building Automation and HVAC Controllers, Battery-Powered Wearable Fitness Devices, Secure USB Token and Key Provisioning, Home Automation Gateways.
USB HID Peripherals and Dongles
The EFM32GG395F1024G-E-BGA120's integrated USB 2.0 Full-Speed controller with on-chip 1.5 kohm pull-up and integrated 3.3 V regulator on VBUS makes it a strong choice for USB dongles and HID peripherals. The 1 MB Flash accommodates full USB device stacks plus vendor-specific firmware, and the 128 kB RAM handles USB descriptor processing, HID report buffers, and concurrent application tasks. The Cortex-M3's low interrupt latency ensures responsive HID report handling. Combined with EM2 sleep at sub-microamp levels, the EFM32GG395F1024G-E-BGA120 enables bus-powered USB devices that draw minimum suspend current. The hardware AES-128/256 engine and TRNG also enable secure USB token applications for cryptographic key exchange.
Recommended
Smart Energy Metering
The EFM32GG395F1024G-E-BGA120 is well suited for smart electricity, water, and gas meters thanks to its 1 MB Flash for storing meter logs, calibration tables, and wireless protocol stacks (Zigbee, Wireless M-Bus, or LoRaWAN). The 12-bit ADC combined with the low-energy architecture enables accurate metrology while drawing sub-microamp quiescent current in EM2 sleep. The 93 GPIO pins accommodate multi-phase metering, tamper detection inputs, and LCD segment driving for the on-chip 8x36-segment controller. The wide 1.98-3.8 V supply range supports battery-assisted metering designs with 10+ year battery life.
Recommended
Industrial Sensor Hubs and IoT Edge Nodes
For industrial sensor hubs and IoT edge nodes, the EFM32GG395F1024G-E-BGA120 offers 1 MB Flash on the Cortex-M3 to host TCP/IP stacks, TLS 1.0/1.1 libraries, and edge analytics algorithms. The hardware AES-128/256 engine secures MQTT/HTTPS connections to cloud services, while the TRNG provides entropy for TLS session keys. The peripheral reflex system enables autonomous sensor sampling and event-triggered wake-up without CPU intervention, allowing the MCU to spend most of its time in EM2 sleep. The 12-bit ADC and DAC support analog sensor fusion with <1 uA quiescent current.
Recommended
Building Automation and HVAC Controllers
The EFM32GG395F1024G-E-BGA120 fits building automation and HVAC controller designs with its 1 MB Flash on the BGA-120 package. It can host BACnet, Modbus, or KNX protocol stacks alongside sensor aggregation logic and LCD segment drivers for room control displays. The hardware AES engine secures wireless commissioning. Multiple USART and I2C interfaces support simultaneous wired bus master and wireless module operation, while the 93 GPIO pins drive triac outputs, relays, and 0-10 V analog control signals typical in commercial HVAC systems.
Recommended
Battery-Powered Wearable Fitness Devices
For battery-powered wearable fitness devices, the EFM32GG395F1024G-E-BGA120's ultra-low-power EFM32 architecture delivers 48 MHz Cortex-M3 performance with sub-microamp EM2 sleep. The 1 MB Flash accommodates BLE stack, pedometer algorithms, and OTA firmware, while the 128 kB RAM buffers sensor data streams from accelerometers and heart-rate sensors. The 12-bit ADC integrates PPG and bioimpedance analog front-ends. The BGA-120 7x7 mm package fits wrist-worn form factors, and the wide 1.98-3.8 V supply supports direct Li-ion battery operation.
Recommended
Secure USB Token and Key Provisioning
The EFM32GG395F1024G-E-BGA120's hardware AES-128/256 engine, TRNG, and integrated USB controller make it ideal for secure USB tokens used in enterprise PKI, FIDO2 authentication, and IoT device provisioning. The 1 MB Flash stores cryptographic libraries (mbedTLS, wolfSSL), while 128 kB RAM handles TLS handshakes and key exchange. The Cortex-M3's hardware divide accelerates RSA and ECC operations. The wide 1.98-3.8 V supply and bus-powered design support 100 mA USB current-limited operation.
Recommended
Home Automation Gateways
For home automation gateways supporting Zigbee, Z-Wave, or Matter protocol bridges, the EFM32GG395F1024G-E-BGA120's 1 MB Flash and 128 kB RAM provide sufficient headroom for gateway stacks plus wireless module management. The multiple USART interfaces support simultaneous connections to multiple wireless modules (Zigbee + Z-Wave + Wi-Fi). The peripheral reflex system enables real-time event handling without CPU wake-up, lowering system power. The on-chip LCD controller supports 8x36 segments for local display of network status.
Recommended
Recommended Products Summary
Engineering reference data for EFM32GG395F1024G-E-BGA120 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EFM32GG395F1024-BGA120 | EFM32GG395F1024G-E-BGA120R | EFM32GG395F1024-BGA120R | EFM32GG395F512G-E-BGA120 | EFM32GG395F512G-E-BGA120R |
|---|---|---|---|---|---|---|
| Package | 120-BGA (7x7 mm) | 120-BGA (7x7) - same | 120-BGA (7x7) - same | 120-BGA (7x7) - same | 120-BGA (7x7) - same | 120-BGA (7x7) - same |
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| CPU Speed | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash Memory | 1024 kB (1 MB) | 1024 kB | 1024 kB | 1024 kB | 512 kB (-50%) | 512 kB (-50%) |
| RAM | 128 kB | 128 kB | 128 kB | 128 kB | 128 kB | 128 kB |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Supply Voltage | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V |
| Industrial Grade (G suffix) | Yes (-40 to +85 C) | No | Yes (-40 to +85 C) | No | Yes (-40 to +85 C) | Yes (-40 to +85 C) |
| Packaging Format | Tray (1000 pcs) | Tray | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
Key Differentiators
- High-memory 1 MB Flash configuration (vs EFM32GG395F512G-E-BGA120)
- Industrial operating temperature grade (vs EFM32GG395F1024-BGA120 (without G))
- Integrated USB 2.0 Full-Speed with on-chip regulator (vs External USB controller + LDO design)
Design Notes
Estimated: The BGA-120 package at 0.65 mm ball pitch requires a minimum 4-layer PCB with 0.4 mm laser-drilled vias-in-pad for the center balls. Use a ground plane on layer 2 directly under the BGA, and route USB DP/DM as 90-ohm differential pair with matched length. Place a 4.7 uF + 100 nF decoupling pair within 2 mm of each VDD/VDDIO ball. The exposed thermal pad must connect to a 5x5 thermal via array (0.3 mm vias, 1 mm pitch) for proper heat dissipation under high USB load.
Estimated: At 48 MHz active current of approximately 8 mA and EM2 sleep of 1 uA, a battery-powered design can achieve >10 year battery life with 1% duty cycle. The USB VBUS pin requires a 4.7 uF bulk capacitor to handle inrush during hot-plug events. Use the internal 1.2 V LDO for core supply and decouple with 1 uF + 100 nF ceramic on each AVDD/AVSS pair for ADC accuracy. For USB suspend current below 100 uA requirement, ensure firmware enters EM2 within 10 ms of USB suspend signaling.
Estimated: SWD debug lines (SWDIO/SWDCLK) must be routed as short as possible (<5 cm) with a 10 kohm pull-up on SWDIO. The 32.768 kHz crystal on HFXTAL_N/HFXTAL_P should be placed within 5 mm of the MCU balls with a guard ground ring. The ETM trace data lines must maintain impedance matching to avoid signal integrity issues at trace data rates above 50 MHz. Keep the SWV pin separate from SWDIO/SWDCLK to avoid debug contention.
Do not exceed the absolute maximum supply voltage of 3.8 V on VDD. Applying 5 V directly to VDD will permanently damage the MCU. For USB designs, the VBUS pin must be connected through the internal regulator; do not tie VBUS directly to VDD. The AES hardware accelerator requires proper key zeroization between sessions for secure applications. The TRNG requires at least 2 cycles to provide NIST-compliant entropy - do not use TRNG output in the first 100 us after wake-up from EM4.
Compliance Information
RoHS and REACH compliant per Silicon Labs product page. G suffix indicates industrial -40 to +85 C operating temperature; not AEC-Q100 qualified. Choose AEC-Q100 qualified EFM32GG11 automotive variants for automotive applications.
