EP1M120F484C7ES - 120K LE Mercury FPGA, 484-FBGA | Intel
MPN: EP1M120F484C7ES ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $258.5 | $2,585.00 |
| 100 | $232.75 | $23,275.00 |
| 500 | $209.4 | $104,700.00 |
| 1,000 | $189 | $189,000.00 |
Drop-in alternatives for EP1M120F484C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1M120F484C7
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View Datasheet →EP1M120F484C7ES Maximum Ratings & Electrical Characteristics
| Family | Mercury (EP1M) |
| Logic Elements | 120,000 |
| Logic Cells / LABs | 49,152 logic cells / 4,800 LABs |
| User I/O Pins | 303 |
| Package | 484-ball FCBGA / FineLine BGA |
| Mounting Type | Surface Mount (BGA) |
| Speed Grade | C7 |
| Operating Temperature Grade | ES (engineering sample / extended screen) |
| Integrated Transceivers | Yes - high-speed differential with CDR |
| Configuration Method | SRAM-based, volatile (requires config device) |
| On-chip Memory | Block RAM + distributed RAM (consult Mercury datasheet for total bits) |
| DSP Blocks | Hardware multiplier/accumulator blocks (consult Mercury datasheet for count) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP1M120F484C7ES 484-ball fcbga / fineline bga Pin Configuration Guide
Complete pinout information for EP1M120F484C7ES (484-ball fcbga / fineline bga package) with 303 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1M120F484C7ES.
Refer to the datasheet for full pin configuration.
Estimated pin count: 303 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1M120F484C7ES is suitable for 6 applications: Telecom Line-Card Aggregation, Baseband Signal Processing, Serial Backplane Bridging, Industrial Imaging and Video Processing, Test and Measurement Front-End, ASIC Prototyping.
Telecom Line-Card Aggregation
The EP1M120F484C7ES is a strong fit for telecom line cards that aggregate multiple serial links into a higher-speed uplink. Its 120K logic elements handle packet classification and traffic-shaping state machines, while the integrated multi-gigabit transceivers with embedded CDR accept backplane serial streams directly without external SERDES parts. With 303 user I/O, the FPGA can drive parallel datapath interfaces to network processors and fabric switches simultaneously. In a typical line-card design, the EP1M120F484C7ES sits between the optical modules and the framer, performing aggregation, encapsulation, and OAM processing. Designers should allocate at least 4 transceiver channels per serial direction and budget PCB stack-up for the differential pair loss budget before committing layout.
Recommended
Baseband Signal Processing
Baseband processing in wireless infrastructure requires DSP throughput plus flexible channelisation. The EP1M120F484C7ES pairs its on-chip hardware multiplier/accumulator blocks with 120K logic elements, supporting channel filters, FFT/iFFT engines, and digital up/down-conversion stages in a single device. The integrated transceivers accept ADC/DAC sampled data streams directly, removing external SERDES glue. Use Quartus Prime DSP Builder to map floating-point algorithms to the DSP blocks and reserve at least 20% logic headroom for control-plane glue logic. The 484-ball FCBGA package supports the high IO count needed to fan out to multiple radio chains without external muxing.
Recommended
Serial Backplane Bridging
For backplane bridging applications, the EP1M120F484C7ES consolidates multiple low-speed serial lanes into a higher-speed uplink using its embedded CDR-equipped transceivers. The 303 user IO support sideband management interfaces (I2C, MDIO, GPIO), while 120K logic elements implement protocol converters, scramblers, and CRC engines. A typical bridge design aggregates 8-12 lanes of 1-3 Gbps traffic into 2-3 lanes of 6+ Gbps uplink. Designers should use Mercury transceiver reference designs from the Intel/Altera application notes for channel-loss budgeting and pre-emphasis tap selection.
Recommended
Industrial Imaging and Video Processing
Industrial imaging systems (machine vision, medical imaging, broadcast video) demand high-throughput pixel pipelines plus flexible processing. The EP1M120F484C7ES drives Camera Link, CoaXPress, or LVDS sensor interfaces through 303 user IO while its 120K logic elements implement Bayer demosaicing, color correction, and compression pipelines in real time. The integrated transceivers accept CoaXPress uplinks directly. Place the EP1M120F484C7ES between the image sensor front-end and the host processor/display, using external DDR memory for line buffering. The FCBGA package supports the high pin density required for parallel sensor buses plus serial control channels.
Recommended
Test and Measurement Front-End
Test and measurement instruments (oscilloscopes, logic analysers, protocol analysers) require flexible high-speed IO plus DSP for trigger and decoding logic. The EP1M120F484C7ES fits as the central FPGA in mixed-signal instruments: transceivers accept probe-digitised serial streams, while 120K logic elements implement state-machine-based decoders for protocols like PCIe, USB, SATA, and Ethernet. The 303 user IO connect to ADC/DAC and front-panel controls. Quartus Prime Signal Tap logic analyser provides on-chip debug visibility. Use the Mercury transceiver reference design for channel-loss budgeting at the probe interface.
Recommended
ASIC Prototyping
ASIC prototyping platforms map RTL designs to FPGAs for pre-silicon validation. The EP1M120F484C7ES supports ASIC prototypes up to ~5-10 million ASIC gates, with the 120K logic elements accommodating partitioned ASIC blocks plus test infrastructure. The integrated transceivers accept high-speed ASIC interfaces directly. Designers should budget ~3x area overhead when mapping ASIC to FPGA and use multi-FPGA partitioning for larger ASICs. The 484-ball FCBGA package supports the high IO count needed for full ASIC pin-out exposure.
Recommended
Recommended Products Summary
Engineering reference data for EP1M120F484C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M120F484C7 | EP1M120F484C7AES | EP1M120F484C7A | EP1M120F484C6N | EP1M120F484C6M | EP1M120F484C6ES |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FCBGA | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same |
| Family | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) |
| Logic Elements | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 |
| User I/O | 303 | 303 | 303 | 303 | 303 | 303 | 303 |
| Speed Grade | C7 (ES screen) | C7 | C7 | C7 | C6 | C6 | C6 |
| Integrated Transceivers | Yes (with CDR) | Yes (with CDR) | Yes (with CDR) | Yes (with CDR) | Yes (with CDR) | Yes (with CDR) | Yes (with CDR) |
| Temperature Screen | ES (extended) | Standard | AES (enhanced) | A-grade | Standard | M-grade (industrial) | ES (extended) |
| Approx. Unit Price (USD, qty 1) | 285.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- ES (engineering-sample / extended) screening over standard C7 grade (vs EP1M120F484C7)
- Faster speed grade (C7) for tighter transceiver/IO timing margins (vs EP1M120F484C6N / EP1M120F484C6M / EP1M120F484C6ES)
- Highest screen level within same-package Mercury 120K family (vs EP1M120F484C7A / EP1M120F484C7AES)
Design Notes
Estimated: The 484-ball FCBGA package requires a high-density multilayer PCB with microvia stack-ups (typically 6-10 layers). Use 0.4mm or 0.5mm pitch BGA escape routing rules and matched-length differential pairs for all Mercury transceiver channels. Place decoupling capacitors on the bottom side directly beneath the BGA, with vias-in-pad recommended for the smallest case sizes. Maintain solid ground planes under the entire BGA footprint to control impedance and reduce EMI. Manufacturer reference: Mercury device handbook, pin connection guidelines.
Estimated: Mercury FPGAs require multi-rail power - typically VCCINT (core), VCCIO (bank IO), VCCA (transceiver analog), VCCP (PLL), and a separate transceiver digital rail. Plan a power-sequencing circuit that meets the Mercury datasheet sequencing requirements (typically VCCINT before VCCIO). Use a dedicated LDO per analog/PLL rail and a high-current buck for core. Estimate core current from the Mercury PowerPlay early-power estimator in Quartus before committing the power tree.
Use Mercury transceiver reference designs from the Intel/Altera application notes to set pre-emphasis, equalisation, and VOD settings for your specific channel. Perform 3D EM simulation on critical transceiver channels to validate loss budget and crosstalk. For parallel LVDS interfaces, maintain 100-ohm differential impedance with intra-pair skew under 5 ps and pair-to-pair skew per the IO timing specification. Reference: Mercury device handbook chapter on high-speed IO.
Estimated: At full fabric utilisation with all transceivers active, the EP1M120F484C7ES can dissipate 5-10W depending on clock rate and toggle activity. The 484-ball FCBGA has a theta-JA of roughly 10-15 C/W with proper thermal via array under the package centre balls; design the PCB with a thermal via farm (0.3mm drill, 1.0mm pitch) under the central BGA balls and consider a heatsink for production builds. Reference: Mercury thermal management application note.
Configuration: Mercury is SRAM-based and volatile - a configuration flash (EPCS or compatible) is mandatory at power-up. If you bypass JTAG configuration in production, leave the JTAG pins accessible via test pads for factory programming. Also verify the I/O bank voltage matches your memory/peripheral interface (Mercury supports 1.5V, 1.8V, 2.5V, 3.3V LVCMOS/LVTTL per bank). Mixing bank voltages incorrectly is a common prototype-killer.
Compliance Information
RoHS compliance confirmed by multiple distributor listings (PNEDA, IC Components, Hotenda, TrustedParts). REACH and conflict-minerals status to be confirmed per shipment with manufacturer declaration. AEC-Q100 is not applicable because this is an FPGA, not an automotive-grade IC.
