EP1S10B672C7N - Stratix FPGA 10,570 LE BGA-672 | Intel
MPN: EP1S10B672C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $84.2 | $842.00 |
| 100 | $76.8 | $7,680.00 |
| 500 | $71.4 | $35,700.00 |
| 1,000 | $67.9 | $67,900.00 |
Drop-in alternatives for EP1S10B672C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10B672C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$140 / Unit
View Datasheet →EP1S10B672C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$185 / Unit
View Datasheet →EP1S10B672C6N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S10B672I7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S10B672I7
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S10B672C7N Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel / Altera |
| Product Family | Stratix |
| Logic Family | CMOS |
| Logic Elements/Cells | 10570 cells |
| Maximum Internal Clock | 420.17 MHz |
| Core Supply Voltage | 1.5 V |
| Technology Node | 130 nm |
| Package Code | BGA |
| Number of Terminals | 672 |
| Package Body Size | 35 x 35 mm |
| Ball Pitch | 1.27 mm |
| Package Shape | Square |
| Temperature Grade | Commercial extended, 0 to 85 C |
| Terminal Form | Ball |
| Configuration/JTAG | JTAG boundary-scan per Stratix family data sheet |
| RoHS | unknown - N suffix may indicate Pb-free, not verified in fetched data |
EP1S10B672C7N square Pin Configuration Guide
Complete pinout information for EP1S10B672C7N (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10B672C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10B672C7N is suitable for 6 applications: Wired Communications Line Card, Broadcast Video Processing, ASIC and SoC Prototyping, Custom DSP Front-End, Protocol Bridge and Packet Processing, Industrial Test and Measurement.
Wired Communications Line Card
The EP1S10B672C7N provides 10,570 logic elements and a 1.5 V Stratix architecture that can implement packet parsing, channelized framing, and MAC/PHY adaptation logic in wired communications equipment. Its 672-ball BGA supports a large number of LVDS and single-ended I/O signals used to connect to framers, SFP modules, and backplane transceivers. The 420.17 MHz listed speed gives headroom for 10/100/1000 Ethernet, SONET, and legacy TDM aggregation designs. When placed in a line card, the FPGA is normally configured at power-up from EPC or similar configuration memory; system designers must budget combinatorial logic for CRC, header insertion, and queue management. The commercial 0 to 85 C temperature limit means this variant is best for central-office or indoor rack environments. For extended outdoor temperature, select the I7N industrial variant in the same footprint. Board designers should verify VCCIO levels per I/O bank and avoid mixing 3.3 V and 1.8 V banks without careful level-shifting.
Recommended
Broadcast Video Processing
EP1S10B672C7N is suitable for broadcast video processing because a 10,570-logic-element Stratix FPGA can handle high-speed pixel pipelines, color-space conversion, blanking insertion, and lightweight motion detection without the cost of a full ASIC. Standard video signals such as HD-SDI at 1.485 Gb/s often require deserialization and multiplexing outside the FPGA core, but the parallel processing inside the FPGA can implement frame buffers, overlay logic, and timing generators. The 672-ball BGA gives enough pins for parallel RGB or YCbCr buses and control interfaces. Using the 130 nm 1.5 V Stratix core reduces dynamic power versus older 2.5 V parts, but still requires careful decoupling near the BGA when processing high-definition streams. Developers can implement the logic in VHDL or Verilog and use Altera/Quartus-related IP for FIFOs and memory interfaces.
Recommended
ASIC and SoC Prototyping
EP1S10B672C7N can serve as an emulation or prototyping FPGA for ASIC logic blocks with moderate capacity requirements. Ten thousand sixty-nine? Actually 10,570 logic elements provide enough fabric to prototype DSP datapaths, state machines, and bus interfaces before committing to an ASIC. Because the Stratix family is well supported by Altera's classic design flow, engineers can partition RTL into multiple FPGAs and use the BGA-672 for dense pin-to-pin interconnect. The 35 x 35 mm package is suitable for a prototyping board with multiple FPGAs if routing can be escaped at 1.27 mm pitch. JTAG support simplifies debug and real-time configuration loading. Designers must consider the 1.5 V core rail and VCCIO rails, and should use current-limiting programming circuits. The FPGA itself provides no on-chip hard processor, so soft logic is used to emulate AHB, AXI, or similar SoC buses.
Recommended
Custom DSP Front-End
The EP1S10B672C7N is a viable FPGA for custom DSP front-ends that need real-time digital filtering, frequency translation, or demodulation in a 1.5 V Stratix platform. The 420.17 MHz listed maximum internal clock allows many multiply-accumulate operations to be time-shared across a relatively small number of MACs if the ALMs and embedded multipliers are used efficiently. Although the fetched data does not specify the exact DSP block count, Stratix devices generally contain dedicated DSP blocks that reduce LUT resource consumption relative to soft multipliers. Engineers should use the Quartus/Stratix family design tools to instantiate the correct DSP block macros and constrain the design to meet timing. For sample rates above 100 MSPS, parallel channelization becomes necessary; the BGA-672 package supports wide parallel data words to ADCs and DACs. Keep power rail noise low on the 1.5 V core to maximize signal integrity in mixed-signal systems.
Recommended
Protocol Bridge and Packet Processing
EP1S10B672C7N can implement protocol bridges between legacy bus interfaces and modern packetized networks. Its 672-ball BGA supplies enough I/O pins to connect to DDR SRAM, FIFO devices, address decoders, and several parallel buses simultaneously. The Stratix fabric supports CAM-like lookups, queues, and packet counters, making it suitable for protocol conversion applications that do not require large external memories. Since the part is a 130 nm, 1.5 V device, board designers should use a dedicated regulator for core power and keep the switching supply away from clock inputs. For simple bridges, the FPGA can run from a single configuration source and undergo reconfiguration over JTAG. In production, external EPC/EPCS memories minimize host intervention. The commercial temperature grade makes this a fit for indoor rack equipment, network appliances, and lab test instruments.
Recommended
Industrial Test and Measurement
EP1S10B672C7N supports industrial test and measurement equipment where 0 to 85 C indoor operation is acceptable and logic density, not low power, is the priority. Test instruments such as logic analyzers, pattern generators, and data acquisition controllers often use FPGAs for trigger logic, acquisition sequencing, and interface translation. The BGA-672 package enables connection to wide acquisition memories and multiple ADC/DAC channels. Engineers can use the Stratix FPGA plus an external analog front-end to implement custom triggering and real-time data reduction at speeds far beyond a microcontroller. Because the part is mature and legacy, it may be attractive to equipment manufacturers with an existing Stratix design base, avoiding an FPGA migration. Ensure the configuration controller and processor interface are on a well-decoupled 1.5 V power island to improve timing margin.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10B672C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10B672C7 | EP1S10B672C6 | EP1S10B672C6N | EP1S10B672I7N |
|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | BGA-672, 35 x 35 mm, 1.27 mm pitch | BGA-672, same package | BGA-672, same package | BGA-672, same package | BGA-672, same package |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -7 (C7) | -7 | -6 | -6 | -7 |
| Operating Temperature | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C | -40 to 100 C (industrial) |
| Maximum Internal Clock | 420.17 MHz | [DATA_NEEDED | [DATA_NEEDED | [DATA_NEEDED | [DATA_NEEDED |
| Package Pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Lead-Free Finish | Unknown from fetched data; N suffix implies lead-free | Non-N, likely lead-bearing finish | Non-N, likely lead-bearing finish | N suffix, likely lead-free finish | N suffix, likely lead-free finish |
Key Differentiators
- Lead-free-marked N variant of the Stratix 10k BGA-672 device (vs EP1S10B672C7)
- C7 speed grade balances cost and timing for moderate-frequency logic (vs EP1S10B672C6N)
- Cost-optimized commercial temperature range (vs EP1S10B672I7N)
Design Notes
EP1S10B672C7N requires a stable 1.5 V core supply. Legacy Stratix devices have several supply requirements including VCCIO and VCC_PLL supplies; do not tie all rails to 1.5 V. Use a dedicated low-noise regulator for the core and separate filtering for PLL analog supplies if PLLs are used. Estimated core current is design-dependent; a 10k-gate design may draw from less than 1 A to several amps depending on toggle rate and I/O loading. This estimate assumes typical 130 nm FPGA activity; use power analysis tools for exact numbers rather than data-sheet-only estimates.
The 672-ball BGA includes a 35 x 35 mm body and 1.27 mm pitch, allowing standard BGA fanout without ultra-fine-pitch vias. Place decoupling capacitors close to the FPFA power balls; six-layer or higher boards are typical for routing this many pins. Use via-in-pad cautiously and confirm plating quality with the board manufacturer. Arrange I/O banks to match the VCCIO assignments of the Stratix reference design, and keep critical clock pins impedance-controlled and length-matched where needed. Since package_svg_key is 'default', the package diagram is generic rather than ball-accurate for this rank.
Do not assume the C7N suffix guarantees a specific RoHS certificate; the fetched data does not explicitly declare compliance. Validate the exact Altera/Intel ordering information before using the part in a RoHS-required product. Another pitfall is using a non-N EP1S10B672C7 in an assembly specified for lead-free only. Finally, since this is a 130 nm FPGA commercial 0 to 85 C part, avoid applying industrial temperature range to a C7N board. If you need -40 C operation, choose the I7N suffix variant with the same package.
Compliance Information
No RoHS, REACH, or conflict-mineral data was found in the fetched web data. The N suffix on Altera/Intel FPGAs is traditionally used to indicate lead-free finish, but this is not confirmed in the provided source snippets.
