EP1S10F672I7 - Stratix FPGA 10K LE, 672-FBGA | Intel
MPN: EP1S10F672I7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $174.9 | $174.90 |
| 10 | $165.5 | $1,655.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138.4 | $69,200.00 |
| 1,000 | $124.75 | $124,750.00 |
Drop-in alternatives for EP1S10F672I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10F672C7
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View Datasheet →EP1S10F672C7N
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View Datasheet →EP1S10F672C6
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View Datasheet →EP1S10B672C7N
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View Datasheet →EP1S10F672I7 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 10,570 |
| User I/O Pins | 345 |
| Package | FBGA-672, 35 x 35 mm, 1.27 mm pitch |
| Operating Temperature | 0 C to +85 C (industrial grade, I7) |
| Core Supply Voltage | 1.5 V |
| Process Technology | 0.13 um CMOS |
| Maximum Internal Clock | 420.17 MHz (per datasheet) |
| Logic Family | CMOS |
| Device Type | FPGA (Field Programmable Gate Array) |
| Total Pins | 672 (FBGA) |
| Configuration Method | JTAG / serial / parallel PROM |
| Memory Type | TriMatrix embedded block RAM + distributed RAM |
| DSP Blocks | Yes (dedicated hardware multipliers) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | unknown - verify per lot |
EP1S10F672I7 fbga-672, 35 x 35 mm, 1.27 mm pitch Pin Configuration Guide
Complete pinout information for EP1S10F672I7 (fbga-672, 35 x 35 mm, 1.27 mm pitch package) with 672 (FBGA) pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10F672I7.
Refer to the datasheet for full pin configuration.
Estimated pin count: 672 (FBGA) pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F672I7 is suitable for 6 applications: Telecom Base Station Channel Card, Software Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, Video Broadcast Image Processing, High-Speed Data Acquisition Front-End, Military and Aerospace Signal Processing.
Telecom Base Station Channel Card
The EP1S10F672I7 fits telecom base station channel cards because its 10,570 LEs plus dedicated DSP blocks deliver enough parallel processing for uplink/downlink baseband functions at 420 MHz internal clock. Its TriMatrix memory supports distributed and block RAM buffering for symbol-rate sample streams, while 345 user I/O pins comfortably connect to multiple ADC/DAC lanes, CPRI/OBSAI links, and backplane SERDES. Industrial temperature grade (0 to +85 C) suits outdoor cabinet deployments. Use it with EP2S60 Stratix II for headroom if future capacity growth is anticipated.
Recommended
Software Defined Radio (SDR) Baseband
For SDR baseband, the EP1S10F672I7's hardware multiplier DSP blocks accelerate FIR filters and FFT engines common in digital down-conversion chains. The 1.5 V core keeps dynamic power reasonable even at 420 MHz, while 1.27 mm-pitch FBGA-672 supports controlled-impedance routing required for parallel LVDS ADC interfaces. With 10K LEs, single-board designs can integrate channelizer, demodulator, and MAC-layer logic. Pair with EP1K50 series devices for I/O expansion or pre/post-processing glue logic.
Recommended
ASIC Prototyping and Emulation
The EP1S10F672I7 is well suited as an ASIC prototyping vehicle for designs in the 5K-15K gate-equivalent range. Designers can map RTL partitions to the 10,570 LEs, use TriMatrix block RAM to emulate SRAM/DRAM controllers, and leverage 345 I/O pins to bring out entire bus interfaces for bench validation. Industrial temperature grade allows bring-up in thermally realistic enclosures. Quartus II software provides time-domain multiplexing to map larger ASICs onto several FPGAs in co-emulation.
Recommended
Video Broadcast Image Processing
Broadcast video processing applications benefit from the EP1S10F672I7's high I/O count and DSP capability for real-time color-space conversion, scaling, and overlay composition. With 345 user I/O pins, designers can interface to multiple parallel BT.656/BT.1120 video streams plus audio and metadata channels. The 420 MHz internal clock supports SD/HD processing per device, and the FBGA-672 footprint accommodates dense controlled-impedance routing for parallel video buses. Industrial temperature grade supports broadcast head-end environments.
Recommended
High-Speed Data Acquisition Front-End
High-speed data acquisition cards use the EP1S10F672I7 to capture LVDS-parallel ADC outputs, perform real-time DSP (decimation, channelization, FFT), and forward results to host processors via PCI/PCIe or Gigabit Ethernet. The device's 345 I/O pins comfortably handle 8-16 LVDS pairs plus control I/O, while DSP blocks accelerate multiply-accumulate operations at sample rates up to 420 MHz. Industrial temperature grade is appropriate for laboratory and field-deployed instrumentation.
Recommended
Military and Aerospace Signal Processing
Military and aerospace signal processing applications leverage the EP1S10F672I7's industrial temperature range, radiation-tolerant design flow, and reconfigurable logic for radar, EW, and SIGINT subsystems. The 10K-LE capacity fits channelized receiver back-ends where DSP blocks perform pulse compression, beamforming, and detection. The FBGA-672 package supports hermetic and ruggedized PCB assemblies. Verify lot-level screening and extended-temperature variants with Intel FPGA military programs if full -55 C to +125 C operation is required.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F672I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F672C7 | EP1S10F672C7N | EP1S10F672C6 | EP1S10B672C7 | EP1S10B672C7N | EP1S10B672C6 |
|---|---|---|---|---|---|---|---|
| Package | FBGA-672 (35x35 mm, 1.27 mm pitch) | FBGA-672 (same footprint) | FBGA-672 (same footprint) | FBGA-672 (same footprint) | FBGA-672 (same footprint) | FBGA-672 (same footprint) | FBGA-672 (same footprint) |
| Brand | Intel (formerly Altera) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) |
| Logic Elements | 10,570 | 10,570 (same) | 10,570 (same) | 10,570 (same) | 10,570 (same) | 10,570 (same) | 10,570 (same) |
| Temperature Grade | Industrial 0 to +85 C (I7) | Commercial 0 to +70 C | Commercial 0 to +70 C | Commercial 0 to +70 C | Commercial 0 to +70 C | Commercial 0 to +70 C | Commercial 0 to +70 C |
| Speed Grade | -7 (faster) | -7 | -7 | -6 (slower bin) | -7 | -7 | -6 (slower bin) |
| Lead-Free (RoHS) | unknown - verify per lot | unknown | Yes (N suffix) | unknown | unknown | Yes (N suffix) | unknown |
| User I/O Pins | 345 | 345 | 345 | 345 | 345 | 345 | 345 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Family / Process | Stratix / 0.13 um | Stratix / 0.13 um | Stratix / 0.13 um | Stratix / 0.13 um | Stratix / 0.13 um | Stratix / 0.13 um | Stratix / 0.13 um |
Key Differentiators
- Industrial temperature grade variant (vs EP1S10F672C7)
- Faster -7 speed grade (vs EP1S10F672C6)
- Lead-free RoHS variant available (vs EP1S10F672C7 (without N suffix))
- Identical die to other EP1S10F672 variants (vs EP1S10B672C7 (B-suffix alternate))
Design Notes
The FBGA-672 package requires a thermal pad or thermal vias to a copper heatsink area. Estimate: at 420 MHz internal clock and typical Stratix toggle activity (~30%), core power dissipation is roughly 1.5-2 W, plus I/O power proportional to switching rate. Use at least 4-layer PCB with solid inner ground plane and 0.5-1 square inch of top-layer copper under the BGA, plus thermal via array (0.3 mm vias, 1 mm pitch) for production designs. Always verify with on-board thermistor for production validation.
BGA fan-out must use either via-in-pad (with plugged and plated-over vias) or dog-bone escape routing. Maintain 50 ohm controlled impedance for LVDS and 60 ohm for LVTTL/CMOS single-ended signals. Provide at least four dedicated power planes (1.5 V core, 3.3 V I/O, auxiliary, ground) with 22 uF + 0.1 uF + 10 uF decoupling placed as close to each power ball cluster as possible. BGA routing requires blind/buried vias or sequential lamination for full fanout on a 4-layer board.
Common pitfalls with mature Stratix devices: (1) using a Quartus version that no longer supports original Stratix - verify tool support before committing to a design; (2) confusing the I7 speed/temperature suffix with a memory size or package code - I = industrial, 7 = speed grade; (3) ignoring the configuration scheme - the EP1S10F672I7 requires a configuration device (EPC2/EPC4/EPC8 family) or JTAG download cable; (4) power sequencing - core 1.5 V must ramp before I/O voltages for proper power-on reset. Always verify with Quartus II PowerPlay early in the design.
For LVDS I/O, place 100 ohm differential termination resistors within 7 mm of the FPGA receiver pins. Series AC-coupling capacitors (100 nF) are recommended for inter-board LVDS links to prevent DC bias drift. For parallel ADC interfaces running above 100 MHz DDR, use internal soft-logic SERDES or external clock buffers (e.g., CY2305) to maintain low jitter. Verify SI with HyperLynx or similar tool before tape-out.
Compliance Information
EP1S10F672C7N and EP1S10B672C7N variants carry confirmed lead-free RoHS finish. Standard EP1S10F672I7 RoHS status is not stated in current distributor listings - request lot-specific certificate from supplier. AEC-Q100 not applicable (FPGA, not automotive discrete).
