EP20K1000CF672C8ES - 1M-gate APEX20KE FPGA, 672-BGA | Intel
MPN: EP20K1000CF672C8ES ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $320 | $160,000.00 |
| 1,000 | $285 | $285,000.00 |
Drop-in alternatives for EP20K1000CF672C8ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP20K1000CF672C8ES Maximum Ratings & Electrical Characteristics
| Family | APEX 20K (APEX20KE) |
| Logic Elements | 38,400 |
| Typical Gates | 25,920 |
| Maximum System Gates | 1,000,000 |
| Embedded Memory (ESB) | 216 Kbits |
| User I/O Pins | 508 |
| Package | 672-ball FineLine BGA |
| Speed Grade | C8 |
| Operating Temperature | Commercial (0C to +85C) |
| Process Technology | 0.18 µm CMOS |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, LVDS, LVPECL, GTL, SSTL-2/3 |
| PLLs | 4 (ClockLock/ClockBoost) |
| Programming Interface | JTAG (IEEE 1149.1 / IEEE 1532) |
| MSL Level | 3 (168 hours) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP20K1000CF672C8ES 672-ball fineline bga Pin Configuration Guide
Complete pinout information for EP20K1000CF672C8ES (672-ball fineline bga package) with 508 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000CF672C8ES.
Refer to the datasheet for full pin configuration.
Estimated pin count: 508 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K1000CF672C8ES is suitable for 6 applications: Telecommunications Line Cards, Custom DSP Coprocessor / Datapath Engine, High-Speed Video/Graphics Pre/Post-Processing, ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Legacy System Sustainment and Migration Designs.
Telecommunications Line Cards
The EP20K1000CF672C8ES's 1M system gates and 508 user I/O pins are well-matched to legacy telecommunications line cards requiring multi-protocol support. The APEX 20K's True-LVDS I/O directly drives T1/E1 framer interfaces, while the four ClockLock PLLs generate jitter-clean clocks for 155 Mbps ATM/SONET paths. Embedded system blocks (ESBs) implement per-channel elastic stores and Look-Up Tables for ATM AAL2/AAL5 SAR functions. Designers typically place the device between a network processor and PHY, where its 25,920 typical gates absorb protocol-conversion glue logic that previously required an FPGA-plus-ASIC pair. Industrial temperature variants exist for outside-plant deployments.
Recommended
Custom DSP Coprocessor / Datapath Engine
The EP20K1000CF672C8ES serves as a flexible coprocessor alongside a host DSP or microprocessor. The 38,400 LEs implement custom arithmetic datapaths - FIR filters, FFT butterflies, Viterbi decoders - while the 216 Kbits of embedded system block memory provides dual-port register files and coefficient storage that would otherwise consume external SRAM. Designers use the APEX 20K's high-speed multiplier support (via embedded multipliers in some variants) or fabric-based shift-and-add trees for multiply-accumulate operations. The ClockLock PLL synchronizes the coprocessor to the host DSP at exact integer ratios, while the device's 508 I/Os handle parallel data buses and handshake signals.
Recommended
High-Speed Video/Graphics Pre/Post-Processing
The EP20K1000CF672C8ES implements real-time video preprocessing pipelines such as color-space conversion, deinterlacing, scaling, and overlay composition. With 508 I/Os, the device accepts parallel ITU-R BT.656 or BT.1120 video buses plus ancillary data, while the 38,400 LEs perform per-pixel arithmetic at clock rates up to 180 MHz in C8 speed grade. Embedded system blocks store line buffers and frame-comparison metadata. The LVDS I/O capability enables direct connection to LVDS-based camera sensors and flat-panel display drivers, simplifying board layout. The 1M-gate capacity is sufficient for 1080i processing in single-chip configurations.
Recommended
ASIC Prototyping and Emulation
The EP20K1000CF672C8ES is widely used as an ASIC prototyping vehicle - designers map RTL onto the device's 38,400 LEs and run at or near real-time speeds before taping out the ASIC. The 216 Kbits of ESB memory substitutes for on-chip ASIC SRAM, while the 508 I/O count exposes a large number of ASIC pins for test fixture access. Quartus II and MAX+PLUS II synthesis tools compile Verilog/VHDL directly, and the JTAG interface allows real-time in-system debugging. Multiple EP20K1000 devices can be paralleled on a multi-FPGA prototyping system to emulate ASICs exceeding 1M gates.
Recommended
Industrial Control and Factory Automation
The EP20K1000CF672C8ES's 508 I/Os allow direct connection to large numbers of industrial sensors, motor drivers, and PLC backplanes. Industrial-temperature variants (-40C to +100C) are available in the same 672-FBGA package for factory-floor environments. The device implements complex state machines, motion-control algorithms, and fieldbus protocol handlers (Profibus, DeviceNet, CANopen) within the same FPGA, reducing board area versus microcontroller-plus-ASIC solutions. The APEX 20K's robust I/O structure tolerates industrial electrical noise while the ClockLock PLL synthesizes clean motor PWM frequencies.
Recommended
Legacy System Sustainment and Migration Designs
Defense, aerospace, medical, and industrial OEM systems with installed bases that were designed around APEX 20K FPGAs need replacement devices to maintain field-serviceable units. The EP20K1000CF672C8ES is the production-current variant for these sustainment programs - the same 672-FBGA footprint, pinout, and timing allow direct PCB insertion as a like-for-like replacement for non-ES EP20K1000 variants. The C8 speed grade preserves the timing budget of the original design, eliminating the need for re-characterization. Long-term availability from independent distributors supports programs with 10-15 year support windows.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000CF672C8ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000CF672C8 | EP20K1000CF672C7 | EP20K1000CF672C7GZ | EP20K1000CB652C8ES |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FineLine BGA | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 652-ball BGA - smaller, verify pinout |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| User I/O | 508 | 508 | 508 | 508 | 475 (652-ball) |
| Speed Grade | C8 | C8 | C7 (faster) | C7 (faster, Pb-free) | C8 |
| ESB Memory | 216 Kbits | 216 Kbits | 216 Kbits | 216 Kbits | 216 Kbits |
| Suffix Variant | ES (Enhanced Spec) | No suffix (standard) | No suffix (standard) | GZ (green/Pb-free) | ES (Enhanced Spec) |
| Lifecycle | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Enhanced Specification (ES) suffix variant (vs EP20K1000CF672C8)
- Larger 672-ball FineLine BGA for maximum I/O count (vs EP20K1000CB652C8ES)
- 2.5 V VCCINT for lower power (vs EP20K1000CF33C8ES)
Design Notes
The 672-ball FineLine BGA requires careful thermal management. The center thermal balls MUST be soldered to a continuous, unbroken ground pour for primary heat removal. A top-side heatsink is recommended for designs operating at junction temperatures above 100C. Estimated: at full I/O toggling (508 outputs at 20 MHz, 10 pF load), dynamic power is ~2.5 W plus quiescent; the package θJA is approximately 12 C/W with center-thermal balls attached, giving ~30C rise above ambient. At commercial temperature (85C max ambient), this leaves only 30C margin.
Use 4-layer PCB with continuous power and ground planes. The 672-FBGA has 1.0 mm ball pitch - microvia or via-in-pad technology is strongly recommended for breakout routing. Set VCCINT to 2.5 V ±5% with decoupling of at least 12 × 0.1 μF X7R ceramic capacitors within 5 mm of the BGA. VCCIO must be tied to 3.3 V, 2.5 V, or 1.8 V depending on the bank - consult the Quartus II pinout file for bank assignments. Per Altera reference designs, place JTAG TCK/TMS/TDO/TDI signals on noise-free layers.
Do not confuse EP20K1000CF672C8ES with EP20K1000CB652C8ES - the 'F' (FineLine BGA) and 'B' (standard BGA) prefixes denote different package families with DIFFERENT pinouts even though both are 1M-gate parts. Verify the exact package code against your PCB footprint before ordering. Also note: APEX 20K is NOT supported by modern Quartus Prime - you must use MAX+PLUS II or Quartus II 13.0 or earlier. Last-time-buy status means no new factory production - verify date code and conditioning before high-reliability applications.
Differential LVDS pairs must be routed with 100 Ω differential impedance and matched lengths to within 50 mils intra-pair and 200 mils inter-pair. Use only true-LVDS-capable I/O banks - refer to the Quartus II assignment editor. Clock signals from the ClockLock PLLs should be routed on inner layers with 50 Ω single-ended impedance and guarded by ground traces. Keep PLL analog supply (VCC_PLL) decoupled with a dedicated pi-filter (ferrite bead + 10 μF + 0.1 μF) per Altera APEX 20K reference schematic.
Compliance Information
RoHS compliant per Intel/Altera APEX 20K family product information. Lead-free BGA balls (SAC305). AEC-Q100 not qualified - this is a commercial-grade FPGA; choose APEX 20K industrial-grade variants (-40C to +100C) for harsh-environment applications. Halogen-free status not explicitly stated in available data - [DATA_NEEDED: halogen-free certification].
