EP1S80F1020C5N - 79,040 Logic Elements FPGA | Intel
MPN: EP1S80F1020C5N ✗ End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP1S80F1020C5N Overview
A field-programmable gate array is a semiconductor device containing programmable logic blocks, programmable interconnects, and configurable I/O resources. FPGA devices are positioned hierarchically within programmable logic, digital logic ICs, integrated circuits, and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing, allowing hardware functions to be changed without redesigning the silicon. Stratix devices are used when engineers need high logic density, broad interface capability, and implementation flexibility.
The principal verified parameters are 79,040 logic elements, 7,904 logic-array blocks, and 773 I/O pins. These resources make the device suitable for parallel datapaths, protocol processing, control logic, and systems integrating many external interfaces. Its 1,020-ball FBGA package supports the scale of the device while using a 1 mm ball pitch. The supplied package data describes the package as 33 mm by 33 mm and FBGA-1020.
EP1S80F1020C5N belongs to the Stratix FPGA family and uses CMOS technology. The exact device architecture combines programmable logic resources with user-configurable I/O. The verified listings do not provide speed grade, embedded-memory capacity, phase-locked-loop count, transceiver count, supply-voltage limits, or thermal-resistance values; those parameters require confirmation from the manufacturer datasheet before schematic, power, timing, or thermal sign-off.
Typical applications include industrial control, communications infrastructure, test and measurement, image processing, and high-performance embedded computing. The 79,040 logic elements support large concurrent designs, while 773 user I/O pins are valuable for memory buses, parallel converters, control interfaces, and board-level communication. Engineers should not infer electrical performance from logic capacity alone; pinout, configuration circuitry, clocking, power integrity, and signal-integrity constraints must be checked against the official datasheet.
A 1,020-ball fine-pitch package requires controlled PCB fabrication, accurate component placement, sound power-delivery design, and reliable high-speed layout practices. Because exact supply requirements and I/O-bank characteristics are absent from the verified data, use the manufacturer documentation rather than estimated values when selecting regulators, decoupling networks, configuration components, or board-stackup rules.
This product synthesis combines the verified distributor specifications, package details, sourcing context, and practical FPGA integration guidance while clearly separating confirmed values from parameters that still require datasheet verification. Pricing is shown as of 2026-09-07 and does not imply current stock, lifecycle availability, or a drop-in substitute recommendation.
Drop-in alternatives for EP1S80F1020C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1S80F1020C5N (same form factor and footprint) — differing in Operating Temperature, Process Technology, Package, RoHS Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S80F1020C5
✅ Drop-In✓ In Stock
$745 / Unit
View Datasheet →EP1S80F1020C5N Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Device Family | Stratix |
| Logic Technology | CMOS |
| Logic Elements | 79,040 |
| Logic Cells | 9,191 |
| Logic Array Blocks | 7,904 |
| User I/O Pins | 773 I/O |
| Total Package Pins or Balls | 1,020 |
| Package Type | FBGA-1020 |
| Package Dimensions | 33 mm x 33 mm |
| Ball Pitch | 1 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 85 °C |
| Speed Grade | C5 |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
EP1S80F1020C5N 33 mm x 33 mm Pin Configuration Guide
Pin configuration for EP1S80F1020C5N (33 mm x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S80F1020C5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1S80F1020C5N is suitable for 6 applications: Industrial Control, Communications Infrastructure, Test and Measurement, Image and Video Processing, High-Performance Embedded Computing, Data Acquisition and Control.
Industrial Control
EP1S80F1020C5N is well matched to industrial-control platforms that combine real-time control with parallel data processing. The device's verified 79,040 logic elements and 7,904 logic-array blocks provide capacity for motion controllers, state machines, protocol bridges, and supervisory logic in one programmable platform. Its 773 user I/O pins can connect sensors, actuators, converters, and control buses. The 0 °C to 85 °C operating range supports commercial industrial environments, but exact supply voltages, I/O-bank limits, and configuration requirements must be confirmed from the manufacturer datasheet before release.
Recommended
Communications Infrastructure
EP1S80F1020C5N can support communications infrastructure that needs parallel packet processing, traffic management, and multiple external interfaces. The verified 79,040 logic elements provide room for high-channel-count datapaths, while 773 user I/O pins are useful for parallel buses and multiple interface devices. Its 1,020-ball FBGA package is intended for surface-mount systems with substantial board-level connectivity. Because transceiver count, supported I/O standards, clocking resources, and power limits are not in the supplied data, verify those details before selecting it for a communications design.
Recommended
Test and Measurement
EP1S80F1020C5N is suitable for test and measurement systems requiring configurable acquisition, timing, and instrument-control logic. The verified 79,040 logic elements can host multiple measurement channels, trigger engines, data-format converters, and control processors concurrently. The 773 user I/O pins provide a large interface surface for converters, memories, sensors, and backplane connections. Engineers should use the device only after confirming pinout, supported I/O standards, configuration mode, timing performance, and power requirements from official documentation; the verified web data does not provide those electrical parameters.
Recommended
Image and Video Processing
EP1S80F1020C5N can address image and video processing tasks that benefit from parallel, reconfigurable datapaths. Its verified 79,040 logic elements support pixel pipelines, filtering, frame buffering control, and format conversion, while the 7,904 logic-array blocks provide structured resources for repeated operations. The 773 user I/O pins can interface with image sensors, displays, memories, and converters. Exact DSP, memory, clock, and high-speed I/O capabilities are not included in the verified data, so the manufacturer datasheet is required to determine throughput and interface feasibility.
Recommended
High-Performance Embedded Computing
EP1S80F1020C5N is a candidate for embedded-computing platforms that need hardware acceleration alongside a processor. The verified 79,040 logic elements can accelerate filtering, encoding, protocol handling, control, and custom accelerators, while 773 user I/O pins support processor buses and peripheral expansion. Its Stratix CMOS architecture gives system designers a programmable hardware path that can be updated without changing the silicon. Before adoption, confirm configuration interface, supported memory, I/O voltage rules, clocking, thermal performance, and software compatibility from the official device documentation.
Recommended
Data Acquisition and Control
EP1S80F1020C5N fits data-acquisition systems that aggregate many channels and require deterministic programmable control. The verified 773 user I/O pins can support parallel ADC or DAC interfaces, sensor buses, and timing controls, while 79,040 logic elements accommodate channel calibration, buffering, and protocol processing. The 0 °C to 85 °C operating range is suitable for the stated commercial range. Designers must verify the actual supported I/O standards, bank organization, power sequencing, configuration method, and signal-integrity guidance because those details are not present in the supplied web specifications.
Recommended
Recommended Products Summary
Engineering reference data for EP1S80F1020C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S80F1020C5 |
|---|---|---|
| Brand | Intel | Intel |
| Package | FBGA-1020 | FBGA-1020 |
Key Differentiators
- High verified programmable-logic capacity (vs EP1S80F1020C5)
- Large user-I/O interface (vs EP1S80F1020C5)
- Large fine-pitch BGA integration (vs EP1S80F1020C5)
Design Notes
The supplied data confirms CMOS technology but does not provide supply-voltage, current, power, or power-sequencing limits. Before schematic design, obtain the official Stratix datasheet and derive the required rails, regulators, decoupling network, and startup sequence from the documented limits. Do not estimate FPGA current from the 79,040 logic elements or 773 user I/O pins. Account for logic utilization, I/O switching, clock rates, memory use, and configuration mode, then verify the final power budget with measured or manufacturer-approved conditions.
EP1S80F1020C5N uses an FBGA-1020 package with 1 mm ball pitch, so PCB routing begins with a verified ball map rather than a generic symbol pinout. Use the official Stratix device-family and package documents to identify I/O banks, power balls, configuration balls, clock inputs, and no-connect balls. Confirm whether the selected PCB fabricator supports the required via-in-pad or dog-bone escape strategy. Layer stack-up, via diameter, antipad geometry, impedance control, and BGA fanout should be checked against fabrication capabilities before layout release.
The device's 773 user I/O pins create a large interface but do not establish supported voltage standards, differential-I/O counts, or maximum toggle rates. Verify I/O-bank restrictions and pin multiplexing in the manufacturer datasheet, then assign interfaces according to bank voltage, direction, timing, and signal-integrity requirements. Keep clock and high-speed routes short, provide appropriate termination where required, maintain reference-plane continuity through transitions, and validate stack-up impedance with the fabricator. Simulate or measure critical interfaces after the first PCB revision.
EP1S80F1020C5N is rated for 0 °C to 85 °C operation, but the verified data does not provide junction-temperature limits, thermal resistance, or power dissipation. Use the official package thermal information and the estimated design power to determine airflow, copper spreading, heat spreading, and enclosure requirements. Treat any thermal estimate as preliminary until validated with the actual utilization, clocking, I/O activity, and board assembly. Keep temperature sensors or system-level monitoring in the qualification plan where the FPGA controls safety-relevant or high-availability equipment.
Do not assume that a family-related Intel FPGA, a similar logic capacity, or the same FBGA-1020 package guarantees drop-in compatibility. The alternative list contains only EP1S80F1020C5 because the provided web evidence does not establish five verified drop-in parts. Before selecting it, compare the exact ordering suffix, package ball map, speed grade, temperature range, voltage domains, configuration interface, firmware, and timing constraints. For an end-of-life device, review counterfeit risk, traceability, storage condition, and long-term availability before committing to production.
Compliance Information
The supplied Verified Web Data does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not claimed for this commercial FPGA. Compliance must be confirmed from the manufacturer or distributor documentation before procurement.
