EP1S80F1020I7N - Stratix 79K LEs 1020-BGA FPGA | Altera
MPN: EP1S80F1020I7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8214.27 | $8,214.27 |
| 10 | $7800 | $78,000.00 |
| 100 | $7200 | $720,000.00 |
| 500 | $6800 | $3,400,000.00 |
| 1,000 | $6500 | $6,500,000.00 |
Drop-in alternatives for EP1S80F1020I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S80F1020C7NGA
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View Datasheet →EP1S80F1020C6N
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View Datasheet →EP1S80F1020C5N
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View Datasheet →EP1S80F1020I6N
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EP1S80F1020I7N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 79,040 |
| Adaptive Logic Modules (ALMs) | 7,904 LABs/CLBs |
| Total RAM Bits | 7,427,520 |
| User I/O Count | 773 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm |
| Package | 1020-ball FC-FBGA |
| Maximum Operating Frequency | 420.17 MHz |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
EP1S80F1020I7N 1020-ball fc-fbga Pin Configuration Guide
Complete pinout information for EP1S80F1020I7N (1020-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S80F1020I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S80F1020I7N is suitable for 7 applications: Telecommunications Baseband Processing, ASIC Prototyping and Emulation, High-Performance DSP / Image Processing, Military and Aerospace Signal Processing, Medical Imaging Front-Ends (CT/MRI), High-Throughput Data Acquisition Systems, Industrial Automation and Control.
Telecommunications Baseband Processing
The EP1S80F1020I7N's 79,040 logic elements and embedded DSP blocks deliver the parallel arithmetic throughput needed for WCDMA, WiMAX, and LTE baseband processing. Its 7.4 Mbit TriMatrix memory buffers packet data between PHY and MAC layers without external SRAM, while 773 user I/Os connect to multiple SFP/RF front-ends. At 420 MHz internal clock, the device comfortably handles 16-bit MAC chains and Viterbi decoding for multi-antenna systems.
Recommended
ASIC Prototyping and Emulation
The EP1S80F1020I7N's 79,040 LEs emulate ASIC designs up to 2-3 million gates with high timing accuracy. Its 1020-ball FC-FBGA exposes enough I/O (773) to bring out full SoC buses, while 7.4 Mbit internal RAM emulates embedded SRAM blocks. Designers partition ASIC RTL across multiple Stratix FPGAs using JTAG or Ethernet bridging, and the industrial temperature grade supports bring-up labs and at-speed validation.
Recommended
High-Performance DSP / Image Processing
Embedded DSP blocks accelerate FIR filters, FFTs, and matrix multiplies at rates that off-the-shelf DSPs cannot match. The 7.4 Mbit on-chip RAM holds line buffers and coefficient tables, avoiding costly external memory accesses. With 773 I/Os, the EP1S80F1020I7N interfaces to multiple CMOS image sensors, SDRAM banks, and high-speed ADC/DAC pairs for medical imaging, machine vision, and broadcast video pipelines.
Recommended
Military and Aerospace Signal Processing
The industrial temperature grade (-40C to +100C) and 130 nm silicon-on-insulator process heritage make the EP1S80F1020I7N suitable for radar, electronic warfare, and avionics signal processing. Its massive parallel I/O connects to multiple ADC channels digitizing RF intermediate frequencies, while embedded DSP blocks perform pulse compression, MTI filtering, and beamforming in real time. Long-term reliability programs may qualify the part to MIL-STD-810 environmental profiles.
Recommended
Medical Imaging Front-Ends (CT/MRI)
The EP1S80F1020I7N's large logic and RAM resources support real-time reconstruction algorithms such as filtered back-projection and iterative reconstruction for CT scanners. With 773 user I/Os, the FPGA interfaces to high-channel-count detector arrays and high-speed ADCs, while on-chip DSP blocks perform per-channel calibration and beamforming corrections. Medical OEMs value the deterministic latency of FPGA-based pipelines versus GPU-based alternatives for safety-critical imaging chains.
Recommended
High-Throughput Data Acquisition Systems
The 773 user I/Os of the EP1S80F1020I7N support multi-channel ADC aggregation at sample rates above 100 MSPS, while the 7.4 Mbit internal memory buffers streaming data before DMA transfer to host CPUs. Industrial temperature grade suits factory-floor test equipment, oscilloscopes, and protocol analyzers. The FPGA's embedded transceivers (on Stratix GX variants) and parallel LVDS pairs handle multi-gigabit serial links to back-end processors.
Recommended
Industrial Automation and Control
The EP1S80F1020I7N is well suited to high-speed PLCs, motion controllers, and CNC machines requiring deterministic multi-axis servo loops. Its 79,040 logic elements handle multiple PID loops and trajectory planners in parallel, while 773 I/Os connect to encoder interfaces, stepper drivers, and safety interlocks. The industrial temperature grade supports factory-floor deployment with ambient temperatures up to 100C inside sealed cabinets.
Recommended
Recommended Products Summary
Engineering reference data for EP1S80F1020I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S80F1020C7N | EP1S80F1020C6N | EP1S80F1020C5N | EP1S80F1020I6N |
|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Brand | Altera | Altera (same) | Altera (same) | Altera (same) | Altera (same) |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 |
| Total RAM Bits | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| User I/Os | 773 | 773 | 773 | 773 | 773 |
| Speed Grade | -7 (fastest) | -7 | -6 | -5 (slowest) | -6 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Process / Core Voltage | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Highest logic capacity in the original Stratix family (vs EP1S60F1020I6N)
- Industrial temperature grade with same die (vs EP1S80F1020C7N)
- Highest speed grade available (-7) (vs EP1S80F1020I6N)
Design Notes
The EP1S80F1020I7N is built on 130 nm CMOS and can dissipate 5-15 W depending on utilization and clock rate. The 1020-ball FC-FBGA package requires thermal vias under the central BGA grid to conduct heat to internal copper planes. For industrial enclosures above 70C ambient, a heatsink with thermal interface material is recommended. Reference the Stratix PowerPlay Early Power Estimator (EPE) to size thermal solutions accurately.
Layout the 1020-ball FC-FBGA with 1.0 mm pitch using microvia (HDI) stack-up; standard 4-layer FR-4 is insufficient for power integrity and BGA breakout. Use buried vias to fan out from inner rows, keep LVDS pairs matched within 150 mil, and provide at least four 1 oz power planes (1.5 V core, 3.3 V aux, 2.5 V PLL, GND) to minimize SSN. Decouple each power pin with a 0.1 uF MLCC plus 10 uF bulk.
LVDS signaling on the Stratix I requires 100 ohm differential termination near the receiver. SSTL2/SSTL3 memory interfaces need series resistors at the driver to dampen reflections. For source-synchronous interfaces (DDR, LVDS), use the FPGA's PLL with matched feedback delay to deskew the clock vs. data. Avoid routing high-speed signals across the BGA's split power-plane boundaries.
Common pitfalls include: (1) using the wrong speed-grade bin (the -7 is fastest but limited availability in LTB; -5/-6 may be the only option); (2) failing to specify Pb-free / lead-free (suffix 'N') for RoHS designs; (3) trying to migrate Quartus II 4.x designs to 7.x without recompiling all IP cores; (4) underestimating configuration time from EPC16/EPC8 PROM at 50 MHz; (5) leaving JTAG TCK un-terminated in multi-device scan chains.
Compliance Information
RoHS compliance depends on the 'N' suffix ordering code; the EP1S80F1020I7 (without N) is lead-bearing and NOT RoHS compliant. AEC-Q100 is not applicable for this FPGA class.
