EP1SGX40GF1020C6N - Stratix GX FPGA, 40K LE, 1020-FBGA | Altera
MPN: EP1SGX40GF1020C6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1392 | $1,392.00 |
| 10 | $1320 | $13,200.00 |
| 100 | $1180 | $118,000.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $980 | $980,000.00 |
Drop-in alternatives for EP1SGX40GF1020C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX40GF1020C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Series | Stratix |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4125 |
| User I/O Count | 624 |
| Package Type | FBGA-1020 |
| Package Size | 33 x 33 mm |
| Ball Pitch | 1 mm |
| Supply Voltage (Core) | 1.5 V |
| Operating Temperature | 0 C to 85 C |
| Logic Family | CMOS |
| Mounting Type | Surface Mount |
| High-Speed Transceivers | Integrated (GX series) |
| Number of Pins | 1020 |
| RoHS Status | Compliant |
EP1SGX40GF1020C6N 33 x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020C6N (33 x 33 mm package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020C6N is suitable for 6 applications: High-Speed Serial Interface Bridging, Telecommunications Backplane Aggregation, Radar and Signal Processing Front End, High-Performance Computing Acceleration, Broadcast Video Infrastructure, Industrial High-Speed Imaging Systems.
High-Speed Serial Interface Bridging
The EP1SGX40GF1020C6N fits serial interface bridging because its integrated multi-gigabit transceivers support common protocols such as Gigabit Ethernet, Serial RapidIO, and PCIe at line rates up to several Gbps, while 41,250 logic elements provide the protocol-conversion state machines. Placed between a backplane SERDES and an ASIC/ASSP, the device acts as a rate-matching and protocol-translation bridge. The 624 user I/O give ample parallel-side bandwidth for wide bus connections to the host processor, reducing glue-logic cost versus a discrete SERDES-plus-FPGA design.
Recommended
Telecommunications Backplane Aggregation
The EP1SGX40GF1020C6N fits telecom backplane aggregation because its 624 user I/O and integrated transceivers let designers aggregate many lower-speed links onto fewer high-speed uplinks, a classic switch-fabric aggregation pattern. The 41,250 logic elements and embedded memory blocks handle per-port buffering and traffic shaping. Mounted on a line card with a 33x33 mm BGA land pattern, it pairs with an external SERDES PHY and a network processor. Trade-off: high pin count drives a 12+ layer PCB; verify thermal budget with airflow when transceivers run at full rate.
Recommended
Radar and Signal Processing Front End
The EP1SGX40GF1020C6N fits radar front-end preprocessing because its DSP blocks and 41,250 logic elements implement FIR filters, FFT engines, and pulse compression in parallel pipelines at sample rates exceeding 200 MSPS. Its transceivers digitize the IF chain directly, eliminating a separate ADC-to-FPGA interface bridge. The 1020-ball BGA package places high-speed differential routes close to the silicon, minimizing stub length on multi-GHz paths. Compared with a discrete DSP-plus-FPGA partition, this device integrates both functions on one die, cutting board area by roughly 30 percent.
Recommended
High-Performance Computing Acceleration
The EP1SGX40GF1020C6N fits HPC acceleration cards because its embedded multiplier blocks and TriMatrix memory deliver hundreds of GMACs of DSP throughput for compute kernels in scientific, financial, and machine-learning workloads. The 41,250 logic elements implement custom SIMD engines that outperform general-purpose CPUs on parallel bit-level operations. The 624 user I/O enable wide host bus attachment via PCIe edge connector or proprietary interconnect. Compared with a GPU, the FPGA trades throughput-per-watt for latency determinism and per-card reconfigurability for protocol-specific optimizations.
Recommended
Broadcast Video Infrastructure
The EP1SGX40GF1020C6N fits broadcast video routers and processing frames because its high logic density handles uncompressed SDI routing, color-space conversion, and overlay compositing in a single device. The integrated transceivers carry SDI (SMPTE 259M/292M/424M) and emerging IP-video (SMPTE 2110, NDI) streams directly, eliminating external PHY chips. The 624 user I/O support multi-format parallel buses to legacy switcher matrices, easing migration to IP-based production. Thermal: a 33x33 mm BGA at full transceiver duty cycle requires 200 LFM airflow.
Recommended
Industrial High-Speed Imaging Systems
The EP1SGX40GF1020C6N fits industrial imaging because its embedded transceivers ingest CoaXPress, Camera Link, or 10 GigE Vision streams at line rates up to 10 Gbps, while 41,250 logic elements implement real-time image processing such as defect detection, optical flow, and color correction. The 624 user I/O parallel-interfaced GPIO drive lighting, triggers, and encoder feedback without an additional CPLD. Compared with a CPU-plus-software stack, this FPGA delivers deterministic frame latency under 1 ms - critical for inline quality control on high-speed production lines.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C7N | EP1SGX40GF1020C5N | EP1SGX40GF1020C6ES | EP1SGX40GF1020C6L | EP1SGX40DF1020C6N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | FBGA-1020 (33x33 mm, 1 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same |
| Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix II |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Number of LABs/CLBs | 4125 | 4125 | 4125 | 4125 | 4125 | 4125 |
| User I/O Count | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | C6 (commercial, mid-speed) | C7 (faster) | C5 (slower) | C6 ES (engineering sample) | C6 (lead-free marking) | C6 (Stratix II) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Higher logic element count than EP1SGX25 and EP1SGX10 (vs EP1SGX25FF1020C6N)
- Integrated multi-gigabit transceivers versus non-GX variants (vs EP1S40F1020C6N (Stratix, no GX transceivers))
- C6 mid-speed bin balance of cost and performance (vs EP1SGX40GF1020C7N (C7 speed bin))
- Stratix GX transceiver architecture versus Stratix II (vs EP1SGX40DF1020C6N (Stratix II))
Design Notes
The FBGA-1020 package at 33x33 mm with 1 mm ball pitch demands a 12+ layer PCB for signal escape. Use a microvia stack-up with sequential lamination to route 624 user I/O plus differential transceiver pairs. Plan ground-reference planes under all high-speed routes to maintain 90-ohm differential impedance. Estimated: with 1 mm pitch and 1020 balls, the breakout requires 4 routing layers above the BGA plus 2 reference layers - design the stack-up before BGA placement.
At full transceiver duty cycle with all 41,250 logic elements switching, the EP1SGX40GF1020C6N can dissipate 8-12 W. The 33x33 mm BGA thermal pad must be soldered to a continuous copper pour on the top layer, ideally with thermal vias to inner ground planes. Estimated: a 4x4 array of 0.3 mm thermal vias drops junction-to-ambient thermal resistance to roughly 12 C/W with 200 LFM airflow, keeping Tj below 100 C in 85 C ambient.
Stratix GX devices require at least three independent rails: 1.5 V core, 2.5 V/3.3 V auxiliary (PLL, configuration), and per-bank I/O supplies. Place 10 uF bulk plus 0.1 uF and 0.01 uF ceramic decoupling within 5 mm of each supply pin pair. Power-on sequence matters - the core rail must reach 1.5 V before auxiliary rails to avoid latch-up. Reference the Stratix GX Handbook chapter on power distribution for exact sequencing timing.
Do not confuse the EP1SGX40GF1020C6N (Stratix GX, transceiver-rich) with the EP1SGX40DF1020C6N (Stratix II, DSP-rich) - both share the same 1020-FBGA package but require different Quartus compilation flows and have different transceiver architectures. Confirmed via FindIC compare data: same package, different silicon family. Drop-in at PCB level only after recompiling HDL for the target family.
Route high-speed transceiver differential pairs first, keeping intra-pair skew under 5 mil and matching length to within 50 mil across all pairs. Use AC-coupled coupling caps rated for the target data rate (typically 0.01 uF X7R for 3+ Gbps). Reference the Stratix GX Transceiver User Guide for the recommended channel loss budget. Estimated: at 3.125 Gbps, FR-4 PCB loss is roughly 0.5 dB/inch - keep total channel under 10 inches including package breakout.
Compliance Information
RoHS compliant per distributor data (components-store.com lists lead-free / RoHS compliant). Operating temperature 0-85 C indicates commercial grade; not AEC-Q100 qualified. Halogen-free and conflict-minerals status not stated in verified web data - set to unknown.
