EP1S80F1508C6AA - Stratix 79K LE FPGA, 1508-FBGA, 7427520 gates | Intel
MPN: EP1S80F1508C6AA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $235 | $23,500.00 |
| 500 | $198 | $99,000.00 |
| 1,000 | $175 | $175,000.00 |
Drop-in alternatives for EP1S80F1508C6AA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S80F1508C6
✅ Drop-In✓ In Stock
$148.2 / Unit
View Datasheet →EP1S80F1508C6N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S80F1508C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$108.4 / Unit
View Datasheet →EP1S80F1508C5
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S80B956C6AA
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$215 / Unit
View Datasheet →EP1S80F1508C6AA Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Logic Elements | 79,040 |
| Equivalent System Gates | 7,427,520 |
| Maximum User I/O | 1203 |
| Package | 1508-BBGA, FCBGA (40 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | C6 |
| Process Technology | 0.13 µm CMOS |
| Embedded Memory | TriMatrix (M512, M4K, M-RAM) |
| DSP Blocks | Yes (embedded multipliers) |
| PLLs | Up to 12 |
| Configuration Method | Serial/Parallel/JTAG |
| Moisture Sensitivity Level (MSL) | 3 (168 hours) |
EP1S80F1508C6AA 1508-bbga, fcbga (40 mm) Pin Configuration Guide
Complete pinout information for EP1S80F1508C6AA (1508-bbga, fcbga (40 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S80F1508C6AA.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S80F1508C6AA is suitable for 6 applications: High-Speed Communication Line Cards, ASIC Prototyping, Video Broadcast Equipment, Industrial Test & Measurement, Military and Aerospace Subsystems, High-Performance DSP Pipelines.
High-Speed Communication Line Cards
The EP1S80F1508C6AA's 79,040 logic elements and 1203 user I/Os fit telecom line-card designs where parallel packet processing, multi-channel SERDES glue logic, and traffic management all run on one device. The 1508-FCBGA provides enough balls for multiple SPI-4.2 / SFI-4 bus interfaces plus external PHY interconnect. Embedded DSP blocks and TriMatrix memory handle queue lookups and protocol parsing. Stratix fabric also supports deterministic latency required for TDM backplanes. Designers targeting line cards should pair the FPGA with external clocked I/O and follow Altera AN 224 for signal-integrity on the BGA breakouts.
Recommended
ASIC Prototyping
With 7,427,520 equivalent gates, the EP1S80F1508C6AA is sized to prototype large ASIC designs in a single device. The high logic count maps almost one-to-one with mid-size ASIC gate counts, and the 1203 I/Os accommodate even pad-rich designs. Multiple FPGA boards can be cascaded via LVDS interconnect to emulate larger ASICs. Quartus II design partitioning supports per-block synthesis matching ASIC RTL boundaries. Expect roughly 30-50 MHz operation in the prototyping environment compared to final ASIC speed.
Recommended
Video Broadcast Equipment
Video broadcast systems (HD-SDI routers, MPEG-TS multiplexers, frame synchronizers) need wide parallel datapaths and deterministic timing - both strong suits of the EP1S80F1508C6AA. The 1203 I/Os can sink multiple HD-SDI inputs plus genlock and housekeeping. Embedded DSP blocks accelerate 2D FIR/clipping and color-space conversion. TriMatrix memory buffers multi-line video frames at low latency. The C6 speed grade hits the 148.5 MHz pixel clock used in 1080p60 with margin. Reference designs in the Stratix handbook show typical broadcast top-down flows.
Recommended
Industrial Test & Measurement
ATE platforms, oscilloscope front-ends, and protocol analyzers rely on FPGAs to capture and process data at multi-gigasample rates. The EP1S80F1508C6AA's high I/O count supports wide parallel ADC/DAC interfaces while embedded memory buffers deep captures. PLLs (up to 12) generate the multiple clock domains needed for ADC sampling and SERDES alignment. Industrial users value the part's long-term availability and proven silicon, even though newer parts now exceed its raw performance. Designers should use the deterministic latency of fabric flip-flops for timing-critical triggers.
Recommended
Military and Aerospace Subsystems
Although the EP1S80F1508C6AA is a commercial-temperature part, its proven Stratix silicon has been used extensively in defense and aerospace subsystems. The 79,040 LE / 1203 I/O combination supports radar DSP pre-processing, electronic-warfare digital receivers, and mission-computing prototypes. Long-term programs that already have ITAR/qualification data for this part often continue to specify it. Designers should confirm date code, RoHS, and counterfeiting risk before each procurement cycle given the part's obsolete status.
Recommended
High-Performance DSP Pipelines
Embedded DSP blocks on the EP1S80F1508C6AA accelerate FIR filters, FFT/iFFT cores, and channelizer banks without consuming logic-element resources. With 1203 I/Os the device can ingest multiple 10-bit ADC lanes at hundreds of MHz, and TriMatrix M-RAM blocks hold FFT windowing coefficients for high-throughput transforms. Quartus II ships optimized DSP IP (MegaCore) targeting Stratix multipliers, including FFT and Reed-Solomon codecs. The C6 speed grade supports 200+ MHz DSP operation; tune placement with DSP-friendly constraints in the fitter settings.
Recommended
Recommended Products Summary
Engineering reference data for EP1S80F1508C6AA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S80F1508C6 | EP1S80F1508C7 | EP1S80F1508C5 | EP1S80B956C6AA |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-BBGA, FCBGA (40 mm) | 1508-BBGA, FCBGA (40 mm) - same | 1508-BBGA, FCBGA (40 mm) - same | 1508-BBGA, FCBGA (40 mm) - same | 956-BBGA (smaller package, lower I/O) |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 |
| Equivalent System Gates | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| Maximum User I/O | 1203 | 1203 | 1203 | 1203 | ~692 (956-ball BGA reduces available I/O) |
| Speed Grade | C6 | C6 | C7 (slower) | C5 (faster) | C6 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same die and package across all EP1S80F1508 variants (vs EP1S80F1508C6)
- Highest user I/O count in the Stratix family (vs EP1S80B956C6AA)
- Mid-speed (C6) grade gives balanced timing-closure headroom (vs EP1S80F1508C5)
Design Notes
Use a minimum 8-layer PCB for the 1508-FCBGA with dedicated ground and power planes. Recommended stack-up: signal / ground / signal / power / signal / power / signal / ground. Match microvia aspect ratios per IPC-6012 for the BGA pad pitch (typically 1.0 mm). Use 0402 or 0201 decoupling capacitors placed within 2-3 mm of each power pin to control switching noise on the FPGA core. Follow Intel/Altera AN 224 (High-Speed Board Design) for impedance-controlled routing and ground-return discipline.
Estimated power dissipation at full utilization (79,040 LEs + 1203 I/O toggling at 100 MHz) is roughly 8-12 W with moderate toggle rates; peak design power can exceed 20 W. The 1508-FCBGA relies on thermal vias beneath the die for heat removal. Use a thermal via array of 0.3 mm pitch, plated through to an internal copper plane acting as a heat spreader. Place a heatsink with thermal interface material if junction-to-ambient exceeds 1 C/W. Always simulate thermal behavior with the Altera PowerPlay early in the design cycle.
DDR/DDR2 SDRAM interfaces on the Stratix device require matched-length, 50 ohm impedance traces with fly-by termination. Use IBIS simulation in Quartus II to validate timing and overshoot on high-speed LVDS pairs. Place series damping resistors within 5 mm of the FPGA pin on LVDS outputs exceeding 500 Mbps. Keep differential pairs skew below 20 ps for reliable 1 Gbps operation. The C6 speed grade supports 200+ MHz internal fabric operation but does not relax signal-integrity rules.
Do not mix configuration schemes between prototypes and production without verifying the EPCS or EPC16 companion flash pinout. Confusing MSEL pin settings (00, 01, 10, 11) is a frequent cause of failed configuration. Always check Quartus II's generated .rbf/.pof files against the expected bitstream size for the EP1S80 (typically 23 Mbit uncompressed). Keep a JTAG header accessible for emergency recovery, and consider dual-configuration mode for field-upgrade reliability.
Compliance Information
Compliance data not present in the verified web sources for this obsolete part. Confirm RoHS/lead-free status with the distributor on a per-date-code basis before use in regulated applications.
