EP1SGX40GF800I7 - Stratix GX FPGA, 41.25K LE, 20 SERDES | Altera
MPN: EP1SGX40GF800I7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1325 | $1,325,000.00 |
Drop-in alternatives for EP1SGX40GF800I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40GF800I5N
✅ Drop-In✓ In Stock
$1390 / Unit
View Datasheet →EP1SGX40GF800C7N
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$110 / Unit
View Datasheet →EP1SGX40GF800C5N
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$198.75 / Unit
View Datasheet →EP1SGX40GF1020I8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$950 / Unit
View Datasheet →EP1S80F1508C7
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View Datasheet →EP1SGX40GF800I7 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Series | Stratix GX FPGA |
| Logic Elements (LE) | 41,250 |
| Embedded Memory | 3,423,744 bits |
| Embedded Multipliers (18x18) | 624 |
| High-Speed Transceivers (SERDES) | 20 channels, up to 3.125 Gbps |
| Package | 800-ball FineLine BGA (GF) |
| Operating Temperature | -40C to +100C (industrial, I grade) |
| Speed Grade | -7 |
| PLL Count | 12 (logic + transceiver) |
| Configuration Method | Enhanced configuration device / Passive serial / JTAG |
| Transceiver Protocols Supported | PCI Express, Gigabit Ethernet, XAUI, Serial RapidIO, Fibre Channel |
EP1SGX40GF800I7 800-ball fineline bga (gf) Pin Configuration Guide
Complete pinout information for EP1SGX40GF800I7 (800-ball fineline bga (gf) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF800I7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF800I7 is suitable for 6 applications: Multi-Gigabit Backplane Transceiver, PCI Express Endpoint Card, Telecom Line Card (XAUI to SFI Bridge), Software Defined Radio Front-End, High-Speed Storage / Fibre Channel Bridge, Industrial Video Processing Pipeline.
Multi-Gigabit Backplane Transceiver
The EP1SGX40GF800I7 fits multi-gigabit backplane designs because its 20 SERDES channels at 3.125 Gbps aggregate 62.5 Gbps of full-duplex serial bandwidth, enough to implement XAUI (4x3.125 Gbps across 5 ports), Serial RapidIO, or proprietary chip-to-chip links on a single device. With 41,250 logic elements and 624 DSP multipliers, the FPGA can implement MAC-layer logic, link training state machines, and CRC engines alongside the PHY. Use the Quartus II ALT2GXB transceiver megafunction to configure pre-emphasis, equalization, and spread-spectrum clocking. PCB routing must use 100-ohm differential pairs with length matching within 150 mils per AN-358.
Recommended
PCI Express Endpoint Card
The EP1SGX40GF800I7 is well-suited to PCI Express x4 or x8 endpoint implementations because its SERDES channels support PCIe Gen1 signaling at 2.5 Gbps with embedded 8B/10B encoding and PIPE-compliant interface. The Altera PCIe Compiler megafunction (available in Quartus II) provides a complete x1/x4/x8 IP core with transaction layer, data link layer, and physical layer integration. With 3.4 Mbits of TriMatrix memory, the device can buffer TLP packets and implement scatter-gather DMA engines on-chip, eliminating external memory for some endpoint designs.
Recommended
Telecom Line Card (XAUI to SFI Bridge)
In telecom line cards, the EP1SGX40GF800I7 can bridge between backplane XAUI (4x3.125 Gbps) and framer SFI-4 (16-bit LVDS parallel) interfaces because its 20 SERDES channels provide more than enough for multiple XAUI ports plus redundant links. The 800-ball FineLine BGA exposes sufficient LVDS pairs for SFI-4 parallel interfaces and clock distribution. Industrial temperature grade (-40C to +100C junction) ensures deployment in central-office equipment and outdoor-mounted remote units.
Recommended
Software Defined Radio Front-End
The EP1SGX40GF800I7 supports software-defined radio (SDR) baseband processing because its 624 hardware 18x18 multipliers enable high-throughput FIR filters, FFT engines, and digital down/up conversion. With 3.4 Mbits of embedded memory, the device can hold FFT twiddle factors and intermediate samples. The 20 SERDES channels allow direct ADC/DAC connection via JESD204-style protocols (with appropriate external PHY), reducing external component count. Industrial temperature screening supports tactical radio and aerospace SDR deployments.
Recommended
High-Speed Storage / Fibre Channel Bridge
The EP1SGX40GF800I7 is a good fit for Fibre Channel to Ethernet or SATA/SAS protocol bridging applications because each SERDES channel can be independently configured to 1.0625 Gbps (FC), 1.5/3.0 Gbps (SATA Gen1/Gen2), or 1.25 Gbps (Gigabit Ethernet) with the appropriate Altera megafunction. The 41,250 logic elements implement protocol state machines, CRC, and frame buffer management, while 3.4 Mbits of embedded RAM provide FC credit and SATA FIS buffering. Industrial temperature grade allows deployment in enterprise storage arrays and ruggedized storage systems.
Recommended
Industrial Video Processing Pipeline
The EP1SGX40GF800I7 supports multi-channel HD video processing because its 624 DSP blocks can perform real-time scaling, de-interlacing, and color-space conversion on 1080p60 streams. The 20 SERDES channels enable SDI (Serial Digital Interface) input/output at 270/1.485/2.97 Gbps (SD/HD/3G-SDI) via external reclocker ICs. With 3.4 Mbits of embedded memory, the device can implement line buffers and frame-store for compositing. Industrial temperature grade supports broadcast and surveillance outdoor deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF800I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF800I5N | EP1SGX40GF800C7N | EP1SGX40GF800C5N |
|---|---|---|---|---|
| Package | 800-ball FineLine BGA (GF) | 800-ball FineLine BGA (GF) - same | 800-ball FineLine BGA (GF) - same | 800-ball FineLine BGA (GF) - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Logic Elements | 41,250 | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) |
| Speed Grade | -7 | -5 (slower) | -7 (same) | -5 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| SERDES Channels | 20 x 3.125 Gbps | 20 x 3.125 Gbps (same) | 20 x 3.125 Gbps (same) | 20 x 3.125 Gbps (same) |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 (same) | 3,423,744 (same) | 3,423,744 (same) |
| Embedded 18x18 Multipliers | 624 | 624 (same) | 624 (same) | 624 (same) |
| PLL Count | 12 | 12 (same) | 12 (same) | 12 (same) |
| Lifecycle Status | Obsolete (last-time-buy) | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Faster speed grade (-7 vs -5) with industrial temperature support (vs EP1SGX40GF800I5N)
- Industrial temperature grade for harsh-environment deployment (vs EP1SGX40GF800C7N)
- Same die and package as commercial-grade alternatives (vs EP1SGX40GF800C5N)
Design Notes
The 800-ball FineLine BGA requires a 4-layer PCB minimum, with 8-12 layers strongly recommended for SERDES designs. Use 100-ohm differential impedance for all SERDES lanes with intra-pair length matching within 150 mils per Altera AN-358. Continuous reference planes must be maintained under all high-speed serial traces; ground-via stitching should be placed at 100-200 mil intervals along the route. Decoupling: 0.1uF and 0.01uF ceramic capacitors on every VCC pin within 100 mils, plus 10uF and 100uF bulk capacitors near the package.
SERDES channels operating at 3.125 Gbps require pre-emphasis and equalization configuration via the Quartus II ALT2GXB megafunction. Estimated: typical pre-emphasis settings of 4-6 dB at 2.5 GHz compensate for FR-4 channel loss of approximately 8-10 dB at 3 GHz. AC-coupling capacitors (100 nF X7R 0402) must be placed on each TX+ and TX- lane between the FPGA and connector. Use IBIS-AMI or 3D EM simulation (HFSS, Siwave) for channels exceeding 5 inches.
Do not assume the EP1SGX40GF800I7 is pin-compatible with EP1SGX40GF1020I7 despite sharing the same die - the BGA ball maps differ because the 800-ball package exposes fewer user I/O. Quartus II pin assignments from one package will not compile for the other without manual re-mapping. Configuration: use EPC16 or EPCS configuration devices in passive-serial mode for production; do not rely on JTAG for field programming only. Voltage rails: VCCINT must be sequenced before VCCIO per the Altera Power Sequencing Requirements section.
Estimated: at full SERDES utilization (20 lanes active at 3.125 Gbps) plus 80% logic utilization, the EP1SGX40GF800I7 dissipates approximately 8-12 W. The 800-ball BGA requires thermal vias under the die and a thermal pad on the top side connected to a heatsink or cold plate for reliable industrial-temperature operation. Use junction-to-ambient thermal resistance (theta_JA) of 6-8 C/W with proper thermal management; without it, junction temperature can exceed 110C at room ambient.
Compliance Information
EP1SGX40GF800I7 is an obsolete Altera/Intel FPGA from the Stratix GX family (early 2000s). Compliance information was not provided in verified web data; [DATA_NEEDED] for all fields. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.