EP1S25F1020C7 - Stratix 25,660-Cell FPGA, 706 I/O, 1020-BGA | Altera
MPN: EP1S25F1020C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $947.77 | $947.77 |
| 10 | $920 | $9,200.00 |
| 100 | $890 | $89,000.00 |
| 500 | $855 | $427,500.00 |
| 1,000 | $820 | $820,000.00 |
Drop-in alternatives for EP1S25F1020C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F1020C7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S25F1020C6N
✅ Drop-In✓ In Stock
$450 / Unit
View Datasheet →EP1S25F1020C5N
✅ Drop-In✓ In Stock
$640 / Unit
View Datasheet →EP1S25F1020C6
✅ Drop-In✓ In Stock
$425 / Unit
View Datasheet →EP1S25F1020C5
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP1S25F1020C7 Maximum Ratings & Electrical Characteristics
| Series | Stratix® |
| Manufacturer | Altera (now Intel) |
| Logic Elements / Cells | 25,660 |
| Number of LABs/CLBs | 2566 |
| Total RAM Bits | 1,944,576 |
| Number of I/O | 706 |
| Voltage - Supply | 1.5 V core |
| Process Technology | 130 nm CMOS |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Maximum Internal Frequency | 420 MHz |
| Mounting Type | Surface Mount (BGA) |
| Package / Case | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch |
| Configuration Method | Passive Serial / Active Serial / JTAG |
| PLL Count | 4 |
EP1S25F1020C7 1020-bbga, fc-fbga, 33 x 33 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1S25F1020C7 (1020-bbga, fc-fbga, 33 x 33 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F1020C7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F1020C7 is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Line-Card DSP and Packet Processing, Video and Image Processing Pipelines, High-Speed Data Acquisition Front-Ends, Military and Aerospace Signal Processing, Test-and-Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP1S25F1020C7's 25,660 logic elements and 1,944,576 bits of embedded memory make it well-suited to ASIC prototyping and emulation, where engineers map large gate-level designs to a single FPGA before taping out silicon. The 706 user I/Os support multi-chip partitioning and high-pin-count SoC prototypes, while the 420 MHz internal operation preserves timing headroom for synthesized ASIC clock trees. The Stratix DSP blocks implement hardened 9x9, 18x18, and 36x36 multipliers, which accelerate prototype verification of DSP-heavy ASICs without using fabric multipliers. Designers typically pair the EP1S25F1020C7 with the Quartus II design suite and Active Serial configuration via an EPCS device.
Recommended
Telecom Line-Card DSP and Packet Processing
In telecom line-card and packet-processing applications, the EP1S25F1020C7's combination of TriMatrix memory (1.9 Mbits) and dedicated DSP blocks delivers the buffering and multiply-accumulate throughput needed for Viterbi, Turbo, and FFT pipelines. The 706 I/Os support multiple SFI / SPI / UTOPIA interfaces and connect to external network processors. Per the Stratix Family Data Sheet, the part also provides 4 PLLs for clock synthesis across multiple line-card clock domains. Power consumption typically sits around 1.5-2 W at full utilization, so the 33 x 33 mm BGA requires attention to airflow and copper thermal via density.
Recommended
Video and Image Processing Pipelines
For broadcast video processing and image pipelines, the EP1S25F1020C7 offers enough logic and on-chip RAM to host multi-channel SDI processing, color-space conversion, and motion-adaptive deinterlacing. The 706 I/Os accept multiple 10-bit parallel video buses plus LVDS links for camera input. Hard multipliers accelerate DCT/IDCT and chroma resampling. The C7 speed grade preserves timing margin at typical 148.5 MHz HD video clocks; the commercial 0-85 °C operating range covers most studio and rack-mount chassis environments.
Recommended
High-Speed Data Acquisition Front-Ends
Data-acquisition front-ends benefit from the EP1S25F1020C7's 706 I/Os and up to 80 LVDS channels at 624 Mbps, which allow direct connection to multi-channel ADCs and DACs. The 1.9 Mbit embedded memory buffers transient bursts before DMA handoff to a host processor. Hard DSP blocks implement real-time FIR filtering, decimation, and windowing without consuming fabric. The BGA's 1 mm ball pitch requires ENIG finish and high-quality PCB stackup to maintain signal integrity on parallel LVDS buses above 400 MHz.
Recommended
Military and Aerospace Signal Processing
Although the EP1S25F1020C7 is commercial-grade (0-85 °C), many defense and aerospace programs qualified it for benign airborne and shipboard signal-processing applications before the part was discontinued. The 25,660 logic elements accommodate moderate-sized FFT, beamforming, and radar return processing, while the 706 I/Os connect to RF ADC back-ends. For new designs, the part is obsolete; for sustaining legacy programs, expect to source from qualified independent distributors with MIL-STD-1686 ESD handling and full traceability.
Recommended
Test-and-Measurement Instrumentation
Test-and-measurement instruments — protocol analyzers, BERTs, and logic analyzers — leverage the EP1S25F1020C7's high I/O count to expose many test points and the DSP blocks for real-time waveform processing. The 4 PLLs synthesize multiple baud-rate clocks from a single reference, simplifying multi-rate test patterns. The 420 MHz internal frequency drives state machines faster than the stimulus rate, giving margin for protocol timing. Many legacy test platforms are still in production use; the part remains sought-after on the secondary market for repair and calibration purposes.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F1020C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F1020C7N | EP1S25F1020C6N | EP1S25F1020C5N | EP1S25F1020C6 | EP1S25F1020C5 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch (same) | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch (same) | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch (same) | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch (same) | 1020-BBGA, FC-FBGA, 33 x 33 mm, 1 mm pitch (same) |
| Speed Grade | C7 (fastest C-grade) | C7 (same) | C6 (slower) | C5 (slowest) | C6 (slower) | C5 (slowest) |
| Lead-Free (RoHS) | [DATA_NEEDED: finish status] | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (non-N) | No (non-N) |
| Logic Elements | 25,660 | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) |
| Number of LABs/CLBs | 2566 | 2566 | 2566 | 2566 | 2566 | 2566 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Number of I/O | 706 | 706 | 706 | 706 | 706 | 706 |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Unit Price (qty 1) | ~$947.77 | Similar (~$950) | Slightly lower (~$880) | Lowest (~$820) | Slightly lower (~$880) | Lowest (~$820) |
Key Differentiators
- Fastest C-grade speed in the EP1S25F1020 family (vs EP1S25F1020C6 / C5)
- Lead-free RoHS variant available as drop-in (vs EP1S25F1020C6 (non-N))
- Same 1,020-BGA footprint as five drop-in alternatives (vs EP1S25B672C7N)
Design Notes
The 1020-BGA at 33 x 33 mm with 1 mm ball pitch requires a high-quality PCB stackup. Per the Stratix Handbook package guidelines, use microvia (laser-drilled) stackup with 0.5-0.65 mm pitch escape routing. Match LVDS pairs to within 5 mil length tolerance and keep reference planes continuous under the entire BGA. ENIG or ENEPIG surface finish is recommended; OSP is acceptable for prototypes.
Estimated: at typical 1.5 V core supply and ~70% utilization (Stratix family typical), the EP1S25F1020C7 dissipates ~3-5 W. With 33 x 33 mm BGA package theta_JA around 12-18 C/W (vendor-stated), expect junction-to-ambient rise of ~50-80 C without airflow. Provide thermal vias under the central balls and at least 200 LFM airflow for commercial-grade operation at 85 C ambient.
The EP1S25F1020C7 supports up to 80 LVDS channels at 624 Mbps, requiring strict impedance control (100 ohm differential ±10%). Use buried stripline layers with reference planes on both sides; avoid reference plane splits near BGA breakout. Per Altera's Stratix Device Handbook, source-synchronous LVDS clock-to-data skew must be held within 75 ps at 624 Mbps.
Critical: the EP1S25F1020C7 is obsolete. Do not design it into new production programs without a sustaining-of-life plan. For new designs, use the Quartus II (legacy) or Quartus Prime toolchain with a supported Stratix II/III/IV/V device. Mixing C7 and C5 speed grades on the same JTAG chain can cause timing mismatch; verify all variants carry the same speed-grade suffix when designing a multi-FPGA system.
Compliance Information
RoHS/lead-free status of the EP1S25F1020C7 itself is not confirmed in the verified web data; the 'N' suffix variants (EP1S25F1020C7N etc.) are documented as lead-free per Altera's ordering nomenclature. AEC-Q100 does not apply to this FPGA commercial-grade part.
