EP20K100CQ240C8ES - 189-I/O 240QFP FPGA | Intel
MPN: EP20K100CQ240C8ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $58 | $58.00 |
| 10 | $54.9 | $549.00 |
| 100 | $49.8 | $4,980.00 |
| 500 | $44.2 | $22,100.00 |
| 1,000 | $39.6 | $39,600.00 |
Drop-in alternatives for EP20K100CQ240C8ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP20K100CQ240C8ES Maximum Ratings & Electrical Characteristics
| Device Type | FPGA (Field Programmable Gate Array) |
| Product Family | Intel/Altera EP20K series FPGA family |
| Number of Logic Elements / Cells | 4,160 |
| Total RAM Bits | 53,248 bits |
| Number of User I/O | 189 |
| Package / Case | 240-BFQFP / QFP-240 |
| Package Type | Quad Flat Package |
| Packaging | Tray |
| Mounting Type | Surface Mount |
| Ordering/ Speed Grade Suffix | C8ES |
| Stock Quantity | 4,816 pieces per Heisener listing |
| Lead Time | To Be Confirmed |
| Unit Price | Request a Quote |
| RoHS Status | Unknown - not confirmed in scraped listing |
EP20K100CQ240C8ES quad flat package Pin Configuration Guide
Complete pinout information for EP20K100CQ240C8ES (quad flat package package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100CQ240C8ES.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100CQ240C8ES is suitable for 6 applications: Industrial Bus Bridging and Glue Logic, Parallel Video and Image-Sensor Interface, UART / SPI / I2C Protocol Converter, ASIC Prototyping and Functional Validation, Telecom Line-Card Status and Control Logic, Embedded Prototyping and FPGA Evaluation Board.
Industrial Bus Bridging and Glue Logic
The EP20K100CQ240C8ES fits industrial bus bridging applications where multiple parallel buses, status signals, and control lines must be translated without a high gate-count FPGA. Its 189 user I/O pins let a designer connect an MCU bus, a DSP host interface, and peripheral control lines concurrently, while its 4,160 logic elements handle address decoding, FIFO control, and simple protocol conversion. When placed beside an Intel/Altera 4-Mbit EPCS4 configuration device, the FPGA can be loaded from serial flash at power-up, providing a reproducible industrial control module. Designers should verify core and I/O voltage compatibility with the host processor and add pull-up or series termination according to the board's logic standards before committing the 240-pin QFP footprint.
Recommended
Parallel Video and Image-Sensor Interface
Moderate parallel video processing is a realistic use case for EP20K100CQ240C8ES because the FPGA provides 189 I/O pins and 53,248 bits of on-chip RAM. A designer can capture a parallel RGB or grayscale sensor bus, insert timing signals, and perform simple line-based processing or pixel-muxing into a downstream ASIC. The embedded RAM is useful for small line buffers or histograms, not full-frame storage, so external SDRAM or SRAM should be used when frame buffering is required. The 240-pin BQFP package provides enough pins for a sensor data bus, clock, sync, and a host control port in a single device. Timing constraints must be declared for the pixel clock to obtain predictable FPGA timing during place-and-route.
Recommended
UART / SPI / I2C Protocol Converter
EP20K100CQ240C8ES can implement protocol conversion between standard serial interfaces and wider internal data buses. The 189 I/O pins allow multiple UARTs, SPI slave ports, and parallel register interfaces to coexist, while the logic elements implement baud-rate generators, FIFOs, and state machines. For example, the FPGA can aggregate several asynchronous serial channels to one high-level bus or translate SPI commands to a parallel memory interface. Because the part is an older FPGA, designers should check each protocol's maximum frequency against Intel timing models; the exact speed-grade suffix C8ES must be confirmed. By storing protocol lookup tables in the 53,248 bits of RAM, the converter can remain a single-chip solution without external memory.
Recommended
ASIC Prototyping and Functional Validation
Design teams prototyping an ASIC can use EP20K100CQ240C8ES to evaluate RTL function before fabrication because an FPGA can be reconfigured with test builds. The 4,160 logic elements and 189 I/O pins cover a range of control-centric prototypes, including DSP control, bus controllers, and state-machine-heavy algorithms. The 53,248 bits of RAM are sufficient for small model memories, register files, and scratchpad test structures. During validation, the ES suffix may indicate sample-grade silicon, so the team should separate functional bring-up results from production qualification data. Using a production-ordering alternative such as EP20K100CQ240C8 for final board validation provides a more representative part for manufacturing readiness testing.
Recommended
Telecom Line-Card Status and Control Logic
Legacy telecom line-card designs use FPGAs for status aggregation, alarm detection, and control-signal distribution. EP20K100CQ240C8ES offers enough I/O count to read multiple line-status inputs and control LEDs, relays, or alarm buses, while the logic resources implement debounce filters, counters, and diagnostic registers. The 53,248 bits of RAM can store small fault logs or mapping tables for alarm consolidation. In a 240-pin QFP package, the FPGA can replace multiple discrete PLDs on a line card, reducing board area and part count. However, telecom timing requirements often need precise delay analysis; verify the C8 suffix timing against Intel timing files and avoid using an ES sample in a deployed system unless explicitly approved by the telecom customer.
Recommended
Embedded Prototyping and FPGA Evaluation Board
Engineering teams building a general-purpose FPGA evaluation board can select EP20K100CQ240C8ES to provide a cost-effective logic target for firmware experimentation. The 4,160 logic elements can host simple soft processors, state-machine controllers, peripheral exercisers, and glue logic; the 189 I/O pins connect to headers, test points, and mezzanine connectors. Because the package is a 240-pin BFQFP with standard through-hole or SMD attach on a compact board, it is practical for student labs and internal benchmark boards. The ES suffix is acceptable for experimentation as long as the board also supports a production alternative. Designers should provide a JTAG header and a configuration flash companion so different bitstreams can be loaded quickly during evaluation.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100CQ240C8ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100CQ240C8 | EP20K100CQ240C7ES | EP20K100CQ240C7 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 240-BFQFP / QFP-240 | 240-BFQFP / QFP-240 | 240-BFQFP / QFP-240 | 240-BFQFP / QFP-240 |
| Logic Elements / Cells | 4,160 | 4,160 | 4,160 | 4,160 |
| Total RAM Bits | 53,248 bits | 53,248 bits | 53,248 bits | 53,248 bits |
| User I/O Count | 189 | 189 | 189 | 189 |
| Ordering Speed Grade | C8 | C8 | C7 | C7 |
| ES Engineering-Sample Suffix | ES | None | ES | None |
| Listed Stock at Heisener (2026-09-07) | 4,816 pieces | [DATA_NEEDED: live stock] | [DATA_NEEDED: live stock] | [DATA_NEEDED: live stock] |
Key Differentiators
- The EP20K100CQ240C8ES is specifically stocked in reasonably high quantity by Heisener: 4,816 units as of 2026-09-07. (vs EP20K100CQ240C7)
- It is pin-compatible with the same-package C8 and C7 family variants, allowing reuse of the 240-BFQFP layout. (vs EP20K100CQ240C7ES)
- The ES suffix can be valuable for engineering sample evaluation but requires production qualification review. (vs EP20K100CQ240C8)
Design Notes
FPGA power estimation for EP20K100CQ240C8ES cannot be completed from the scraped snippets because no core voltage, I/O voltage, or maximum current figures are listed. Estimated: assume the FPGA draws both core and I/O current; multiply estimated core current by the selected VCCINT and add I/O bank current to get a preliminary power number. Confirm all supply rails from the Intel/Altera device datasheet before choosing a voltage regulator. Use low-ESR ceramic decoupling capacitors on every power pin, and keep the core supply ripple below the device recommendation.
For the 240-pin BFQFP package, thermal performance depends heavily on airflow, board copper, and package thermal resistance. Since the exact theta-JA of EP20K100CQ240C8ES is not in the verified snippets, calculate board-level thermal resistance from Intel/Altera package data before finalizing heatsink or fan decisions. Estimated: use the datasheet theta-JA multiplied by estimated power dissipation to estimate junction rise; derate for ambient temperature. Add a thermal via array under the package if the QFP variant has an exposed pad, but verify pad presence from the mechanical drawing.
Do not mistake the trailing “ES” in EP20K100CQ240C8ES for a standard production speed grade. ES often means engineering sample, so the part should be used only for evaluation or prototyping unless Intel officially documents production release. Also verify whether C7/C8 ordering grades change timing closure; a bitstream compiled for one suffix might not meet timing on the other. Keep a 10-pin JTAG header and a compatible configuration flash on the board. Because the 240-pin BQFP pinout was not fully present in the scraped data, always confirm pin mapping from a complete EDA symbol before routing.
Compliance Information
One datasheet aggregator page showed a “RoHS Status” header, but no specific compliant/non-compliant value was visible in the verified snippet. Request a compliance certificate from the supplier or Intel before lead-free assembly decisions.
