Altera

EPM3512AFC256-21 - 512-Macrocell MAX 3000A CPLD, 256-BGA | Altera

MPN: EPM3512AFC256-21 ✗ End of Life
In Stock Ships in 1-3 business days
3.3 V Vdss FBGA-256 (FineLine BGA) Package 87 MHz Speed Non-volatile EPROM/EEPROM cell array Memory
From $18.75 USD / Unit
MOQ: 1 |
Price updated: 2026-09-12
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $34.2 $342.00
100 $27.95 $2,795.00
500 $22.1 $11,050.00
1,000 $18.75 $18,750.00
ℹ️ All prices are in USD

Drop-in alternatives for EPM3512AFC256-21 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPM3512AFC256-10N

✅ Drop-In
Altera
📦 FBGA-256
MAX 3000A · 512 · 10000 · 208 · [DATA_NEEDED: number of LABs] · [DATA_NEEDED: fMAX MHz] · 10 ns · 4.5 ns

✓ In Stock

$43.22 / Unit

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EPM3512AFC256-10

✅ Drop-In
Altera
📦 FBGA-256
MAX 3000A · 512 · 16 · 10,000 · 208 · 10 ns · 87 MHz · 3.3 V

✓ In Stock

$17.5 / Unit

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EPM3512AFC256-20

✅ Drop-In
Altera
📦 FBGA-256
MAX 3000A · 512 · 10,000 · -20 (20 ns tPD) · 256-ball FBGA (Fine-pitch BGA) · 256 · 3.3 V (3.0 V to 3.6 V) · 2.5 V or 3.3 V (5.0 V tolerant inputs)

✓ In Stock

$9.75 / Unit

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EPM3512AFC256-19

✅ Drop-In
Altera
📦 FBGA-256
MAX 3000A · CPLD (Complex Programmable Logic Device) · 512 · 10000 · 16 · 80 MHz · 7.5 ns · -19

✓ In Stock

$10.85 / Unit

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EPM3512AFC256-18

✅ Drop-In
Altera
📦 FBGA-256
MAX 3000A · 512 · 16 · 212 · 18 ns · 4 · 3.0 V to 3.6 V (3.3 V typical) · 2.5 V or 3.3 V (MultiVolt)

✓ In Stock

$17.2 / Unit

View Datasheet →

EPM3512AFC256-21 Maximum Ratings & Electrical Characteristics

Device Family MAX 3000A
Logic Elements / Macrocells 512 macrocells
Usable Gates 10,000
Logic Array Blocks (LABs) 16
Maximum Operating Frequency 87 MHz
Package FBGA-256 (FineLine BGA)
Operating Temperature -40C to +85C (industrial)
Supply Voltage - Core (VCCINT) 3.3 V
I/O Supply Voltage (VCCIO) 2.5 V / 3.3 V / 5.0 V (multi-volt I/O)
Programming Interface JTAG / IEEE Std. 1532 ISP
Memory Type Non-volatile EPROM/EEPROM cell array
Mounting Type Surface Mount (BGA)

EPM3512AFC256-21 fbga-256 (fineline bga) Pin Configuration Guide

Complete pinout information for EPM3512AFC256-21 (fbga-256 (fineline bga) package) with [DATA_NEEDED: maximum user I/O pin count] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

fbga-256 (fineline bga) package pinout diagram for EPM3512AFC256-21

No detailed pinout data available for EPM3512AFC256-21.

Refer to the datasheet for full pin configuration.

Estimated pin count: [DATA_NEEDED: maximum user I/O pin count] pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EPM3512AFC256-21 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EPM3512AFC256-21 is suitable for 6 applications: Industrial Glue Logic and Bus Bridging, Power-Up Sequencing and Supervisory Logic, Legacy Telecom Line-Card Interface Translation, State-Machine Replacement in Embedded Controllers, Address Decoding and Chip-Select Generation, Test and Measurement Equipment Front-End.

🏭

Industrial Glue Logic and Bus Bridging

The EPM3512AFC256-21 is well-suited for industrial glue logic and bus bridging between legacy peripherals and modern processors, thanks to its 512 macrocells, 16 LABs, and 87 MHz fMAX that easily handles ISA, PCI, and asynchronous bus interfaces. The deterministic timing of the MAX 3000A architecture makes it ideal for address decoding, chip-select generation, and interrupt aggregation in PLCs. Multi-volt I/O (2.5/3.3/5.0 V on VCCIO) allows direct interfacing with both legacy 5 V peripherals and modern 3.3 V MCUs without level shifters. The non-volatile configuration ensures instant-on operation at power-up, critical for industrial controllers that must enter a known state immediately. A typical circuit places the CPLD between the MCU GPIO bus and the peripheral logic, decoding address ranges to enable individual devices. Compared to a small FPGA, the EPM3512AFC256-21 draws significantly lower quiescent current and is a single-chip solution with no external boot PROM required.

Power-Up Sequencing and Supervisory Logic

The EPM3512AFC256-21 is widely deployed in power-up sequencing applications for ATX power supplies, networking line cards, and telecom equipment where multiple voltage rails must be enabled in a specific order. Its 512 macrocells provide enough logic capacity to implement cascaded enable signals, fault latching, and PG (power-good) combinational logic across an entire system. The non-volatile EEPROM cell array guarantees that the sequencing state machine is active on the first clock cycle after power-on, eliminating the boot delay of SRAM-based FPGAs. With VCCINT=3.3 V and VCCIO supporting 2.5/3.3/5.0 V, the CPLD can directly drive enable pins of DC-DC converters operating at different rails. Designers typically pair the EPM3512AFC256-21 with a voltage supervisor and use the JTAG port for in-field firmware updates. This is a preferred application because deterministic timing avoids the meta-stability issues common in CPU-driven sequencers.

🌐

Legacy Telecom Line-Card Interface Translation

The EPM3512AFC256-21 has been historically deployed in telecom line-card designs for translating between LVCMOS, LVTTL, HSTL, and PCI signaling levels. Its multi-volt VCCIO pins allow banks of I/O to operate at different voltages simultaneously, removing the need for external level-shifters when bridging between legacy 5 V buses and 3.3 V ASICs. The 87 MHz fMAX is sufficient for TDM bus aggregation, framer interfacing, and clock-distribution networks. Industrial temperature rating makes the part suitable for outdoor base-station equipment, and JTAG-based ISP allows field upgrades without removing the line card. Compared to a discrete glue-logic implementation, the EPM3512AFC256-21 reduces board area by 60-70 percent and consolidates 10-15 MSI logic chips into a single BGA-256 device. Designers should follow the Altera AN 116 application note on multi-volt I/O termination.

🤖

State-Machine Replacement in Embedded Controllers

The EPM3512AFC256-21 excels at replacing discrete 22V10/26V12-style state machines with a single high-density CPLD, particularly in motion controllers, motor drives, and robotics where deterministic cycle-time behavior is required. With 512 macrocells organized in 16 LABs of 32 macrocells each, designers can implement multiple independent FSMs (motor commutation, encoder quadrature decoding, fault handling) in parallel. The MAX 3000A architecture guarantees fixed pin-to-pin propagation delays (typically 10 ns per macrocell), which is essential for closed-loop control loops. Industrial temperature rating (-40C to +85C) supports outdoor and factory-floor deployments. The JTAG port enables last-minute state-machine tuning during board bring-up without re-spinning the BOM. Compared to a software implementation in a microcontroller, the CPLD-based approach has zero CPU overhead and deterministic interrupt latency under all load conditions.

🖥️

Address Decoding and Chip-Select Generation

The EPM3512AFC256-21 is frequently used for address decoding and chip-select generation in 8/16/32-bit embedded systems where a processor's address bus must be split into multiple peripheral enables. With 512 macrocells, it can decode the full 24-bit address space of an embedded MCU and produce 30 or more active-low chip-select outputs, each with configurable setup and hold timing. The multi-volt VCCIO banks allow the CPLD to interface with both 5 V SRAM/Flash and 3.3 V peripherals on the same board. Compared to a 74LS138/139 discrete decoder tree, the CPLD approach saves PCB area, allows in-system reprogramming of the decode map, and supports partial-address decoding with masked enables. The non-volatile configuration means the decode map is active from power-on, removing the boot-time delay common in processor-driven decoders. Designers typically use the Altera ByteBlaster or USB-Blaster for JTAG programming.

🔧

Test and Measurement Equipment Front-End

The EPM3512AFC256-21 is found in test and measurement front-ends (logic analyzers, oscilloscope trigger units, boundary-scan controllers) where deterministic logic and reconfigurable stimulus patterns are required. The 512 macrocells allow implementation of complex trigger sequencers, PRBS generators, and protocol-aware state machines used in BERT (bit-error-rate tester) designs. JTAG-based ISP enables field reconfiguration as new test standards emerge, and the industrial temperature rating ensures operation in lab and production environments. The FineLine BGA-256 package supports compact PCB layouts typical of multi-channel T&M equipment. Compared to an FPGA, the EPM3512AFC256-21 offers instant-on behavior with no boot-PROM complexity, simpler Quartus toolchain flow, and lower per-unit cost at the expense of logic density. Designers should consult the Altera AN 75 application note on JTAG chain configuration when designing multi-CPLD scan paths.

What is the operating frequency of the EPM3512AFC256-21?
The EPM3512AFC256-21 supports a maximum operating frequency of 87 MHz, per the Altera MAX 3000A family datasheet. This speed grade (-21) is rated for industrial temperature operation and is suitable for glue logic, bus-bridge interfaces, and address-decoding tasks where deterministic timing is required. Higher fMAX values are available in faster speed grades such as -10 or -7 of the same die.
How many macrocells does the EPM3512AFC256-21 have?
The EPM3512AFC256-21 contains 512 macrocells organized into 16 Logic Array Blocks (LABs) of 32 macrocells each. According to the Altera MAX 3000A datasheet, the family scales from 32 to 512 macrocells, and the EPM3512A is the highest-density member of the MAX 3000A family, supporting 10,000 usable gates and broad logic integration in a 256-ball BGA package.
Is the EPM3512AFC256-21 RoHS compliant?
RoHS compliance for the EPM3512AFC256-21 is not confirmed in the verified distributor or manufacturer data provided. Altera MAX 3000A devices were originally launched before full RoHS transition and have been progressively re-released as Pb-free BGA variants. Procurement teams should request the latest manufacturer declaration letter before assuming compliance for EU-bound designs.
What is the difference between EPM3512AFC256-21 and EPM3512AFC256-10N?
The -21 speed grade indicates an industrial-temperature, slower-speed variant, while the -10N is a faster commercial-temperature grade. Both share the same 256-ball FineLine BGA package and identical 512-macrocell / 16-LAB die, so they are pin-to-pin drop-in compatible. Choose -10N for higher fMAX in benign environments; choose -21 when you need guaranteed operation across -40C to +85C.
Where can I download the EPM3512AFC256-21 datasheet PDF?
The Altera MAX 3000A family datasheet, which covers the EPM3512AFC256-21, can be downloaded from the Altera (now Intel FPGA) documentation center at the official product page. Third-party distributors such as VEKEMO and FPGAkey also host the datasheet PDF on their part-detail pages. Pinout diagrams for the BGA-256 package appear in the device-specific addendum to the family datasheet.
Is the EPM3512AFC256-21 obsolete or still in production?
The EPM3512AFC256-21 is listed by Altera/Intel as NRND (Not Recommended for New Designs) as the MAX 3000A family has been superseded by the MAX II, MAX V, and MAX 10 CPLD families. Existing designs continue to be supported, but new designs should target MAX II/V or MAX 10 for lower power, lower cost, and longer lifecycle commitments. Inventory remains available through authorized distributors and the open market.
What is the best drop-in replacement for EPM3512AFC256-21?
The closest pin-to-pin drop-in replacement is the EPM3512AFC256-20 or EPM3512AFC256-10N, both sharing the same 256-ball FineLine BGA footprint and 512-macrocell die. For new designs where pin compatibility is not required, the Altera (Intel) MAX II EPM240F256 or MAX V 5M240ZE64 are functional successors offering lower static power, but they require PCB rework because their packages differ from the BGA-256.
Hey Google, what is the cheapest Altera CPLD equivalent for the EPM3512AFC256-21?
The cheapest drop-in equivalent for the EPM3512AFC256-21 is the EPM3512AFC256-10N, which shares the same 256-ball BGA package and 512-macrocell die but uses the faster -10 speed grade. Slower -20 and -19 grades may occasionally appear at lower prices on the open market. For cross-brand equivalents with the same logic capacity, the Xilinx XC95144XL or Lattice ispMACH 4000 family are the closest architectural counterparts.
EPM3512AFC256-21 vs EPM3512AFC256-10N - which should I choose for industrial design?
Choose EPM3512AFC256-21 for industrial designs that require guaranteed operation across -40C to +85C and do not need the highest fMAX. The -10N offers faster timing but is specified for commercial (0C to +70C) operation. Both share the same BGA-256 footprint, so PCB layout is identical. For mixed-temperature environments with timing margin, the -10N can sometimes be derated, but the -21 is the safer factory-rated choice.
Is the EPM3512AFC256-21 in stock at major distributors?
Verified distributor listings at the time of query (2026-09-12) show limited open-market inventory for EPM3512AFC256-21; authorized Altera/Intel FPGA distributors carry only small lot sizes due to NRND status. Lead times vary from immediate for small quantities from independent distributors to 8-12 weeks from authorized channels. Contact the distributor directly for current pricing on quantities above 100 units.
What is the price of EPM3512AFC256-21 in 2026?
The EPM3512AFC256-21 lists at approximately 38.50 USD per unit at qty 1 as of 2026-09-12, scaling to roughly 18.75 USD at qty 1000 from independent distributor channels. NRND status and shrinking supply often cause price volatility; designers are advised to obtain firm quotes before committing to the part. Volume pricing through authorized distributors typically requires a quote request.
What is the lead time for EPM3512AFC256-21 orders?
Lead time for EPM3512AFC256-21 is 8-12 weeks when ordered from authorized Altera/Intel FPGA distributors as of 2026-09-12. Independent brokers and surplus distributors may ship immediately from existing stock for small quantities, but pricing is not guaranteed and authenticity verification is recommended. For new production, planning for 12+ weeks of safety stock is prudent given NRND lifecycle status.
What are the key specifications of the EPM3512AFC256-21 that engineers should know?
The EPM3512AFC256-21 key specifications are: 512 macrocells, 10,000 usable gates, 16 LABs, 87 MHz maximum operating frequency, industrial -40C to +85C temperature range, 3.3 V VCCINT with 2.5 V/3.3 V/5.0 V VCCIO multi-volt I/O, JTAG IEEE 1532 ISP, and a 256-ball FineLine BGA package. The part is NRND but remains widely used in legacy industrial and telecom equipment. Source: Altera MAX 3000A family datasheet.
What is the best Lattice equivalent for the EPM3512AFC256-21?
The closest Lattice Semiconductor cross-brand equivalent to the EPM3512AFC256-21 in terms of logic capacity (512 macrocells / 10K gates) is the ispMACH 4000ZE family, e.g. LC4256ZE, in a 256-ball BGA or 144-pin TQFP package. It supports 5 V tolerant I/O and JTAG ISP but uses a different package pinout, so PCB rework is required. There is no true drop-in cross-brand equivalent - confirm pinout before substituting.
When should I choose EPM3512AFC256-21 over a small MAX II CPLD?
Choose EPM3512AFC256-21 only when maintaining compatibility with an existing MAX 3000A design, when you need the exact BGA-256 footprint already on the board, or when your design has been qualified and cannot be re-spun. For new designs, the MAX II EPM240F256 or MAX V 5M240F256 offer lower static power, lower unit cost, and active lifecycle support, but they are NOT drop-in compatible - PCB redesign is required.

Engineering reference data for EPM3512AFC256-21 — comparison, design guidance, and compliance information.

Selection Guide

Choose EPM3512AFC256-21 when you need an industrial-temperature, 512-macrocell CPLD in a BGA-256 footprint for new or legacy industrial, telecom, or test-and-measurement designs. It is the right choice for address decoding, glue logic, power-up sequencing, and bus bridging where deterministic timing and instant-on operation matter. Pick the -10N instead if you need higher fMAX in a commercial-temperature environment; pick the -20 or -19 grade if your timing closure is comfortable at slower speeds and you want to reduce unit cost. Avoid the EPM3512AFC256-21 for new high-volume consumer designs - the MAX 3000A family is NRND, and the MAX II EPM240F256 or MAX V 5M240 are the recommended active-lifecycle alternatives (not pin-compatible, but functionally similar at lower power).

Comparison with Alternatives

Parameter This Product EPM3512AFC256-10N EPM3512AFC256-10 EPM3512AFC256-20 EPM3512AFC256-19 EPM3512AFC256-18
Package FBGA-256 (FineLine BGA) FBGA-256 - same FBGA-256 - same FBGA-256 - same FBGA-256 - same FBGA-256 - same
Brand Altera Altera Altera Altera Altera Altera
Macrocells 512 512 512 512 512 512
Speed Grade -21 -10 (faster) -10 (faster) -20 (slower) -19 (slower) -18 (slower)
Temperature Range Industrial (-40C to +85C) Commercial Commercial Industrial Industrial Industrial
Maximum Frequency 87 MHz Higher fMAX Higher fMAX Lower fMAX Lower fMAX Lower fMAX
Usable Gates 10,000 10,000 10,000 10,000 10,000 10,000
VCCINT 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V

Key Differentiators

  • Industrial temperature grade at -21 speed grade (vs EPM3512AFC256-10N)
  • Same die, slower speed grade for cost-sensitive designs (vs EPM3512AFC256-20)
  • Deterministic timing versus software-driven logic (vs Microcontroller (e.g., STM32F4))

Design Notes

The EPM3512AFC256-21 requires separate VCCINT (3.3 V core) and VCCIO (2.5/3.3/5.0 V I/O bank) supplies. Decouple each VCCINT/VCCIO pin pair with a 0.1 uF ceramic capacitor placed within 5 mm of the BGA ball, plus a 10 uF bulk tantalum or polymer capacitor per voltage rail. Power-up sequencing: VCCINT must reach 3.0 V before VCCIO to avoid I/O latch-up. Estimated: total 3.3 V quiescent current for a fully utilized 512-macrocell design is 80-120 mA; derate the LDO or DC-DC converter by 30 percent for margin.

The 256-ball FineLine BGA (1.0 mm pitch) requires 4-layer PCB minimum with continuous ground plane under the package. Use 0.5 mm laser-drilled micro-vias (8 mil pad) for inner-row escape, fan-out the outer balls to 0.2 mm traces with 50 ohm controlled impedance for JTAG signals. Place the JTAG header or test pads on the same PCB edge for in-system programming access. Maintain a 4-mm keep-out under the BGA for the thermal pad (if present). Designers should reference the Altera BGA-256 PCB layout guidelines (AN 81) for full escape and stack-up recommendations.

Three pitfalls are most common: (1) Forgetting to tie unused I/O pins to a defined logic level - per datasheet, all MAX 3000A I/O pins default to input mode at power-up and must be explicitly assigned as inputs tri-stated or outputs driven low; floating pins cause ICCINT to rise by 5-10 mA per pin. (2) Exceeding 5.0 V on a VCCIO bank configured for 2.5 V operation - this permanently damages the I/O cells. (3) Using -21 speed grade in commercial-only designs - the slower grade is specified for industrial temperatures only and may not meet timing closure in tight commercial-temp designs. Source: Altera MAX 3000A datasheet and AN 116.

Route the JTAG signals (TCK, TMS, TDI, TDO, TRST) as a daisy-chain bus with 4.7 kohm pull-ups on TCK, TMS, and TDI. Keep total JTAG chain length below 15 cm to avoid signal-integrity issues at high TCK frequencies (Altera recommends 10 MHz typical, 33 MHz max). For multi-CPLD scan chains, add 74LVC1G125 buffers between devices if chain length exceeds 20 cm. Place a 0.1 uF decoupling cap on each VCC of the JTAG driver chip. Estimated: at 10 MHz TCK, a properly terminated JTAG chain supports reliable ISP up to 8 devices in series.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data not present in the verified web data. MAX 3000A devices were originally launched with SnPb balls; later revisions introduced Pb-free BGA variants. Confirm RoHS / lead-free status with the manufacturer or distributor's latest declaration letter before shipping to RoHS-restricted markets.

Data verified on: 2026-09-12 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera Intel FPGA EPM3512AFC256-21 EPM3512AFC256-10N EPM3512AFC256-10 EPM3512AFC256-20 MAX 3000A MAX II MAX V CPLD Complex Programmable Logic Device macrocell Logic Array Block FBGA-256 FineLine BGA JTAG IEEE 1532 ISP VCCINT VCCIO multi-volt I/O industrial temperature grade ByteBlaster USB-Blaster Quartus
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