EPM3512AFC256-20 - MAX 3000A CPLD, 512 Macrocells, BGA-256 | Altera
MPN: EPM3512AFC256-20 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.8 | $1,380.00 |
| 500 | $11.5 | $5,750.00 |
| 1,000 | $9.75 | $9,750.00 |
Drop-in alternatives for EPM3512AFC256-20 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM3512AFC256-10N
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View Datasheet →EPM3512AFC256-10
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View Datasheet →EPM3512AFC256-2
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View Datasheet →EPM3512AFC256-19
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View Datasheet →EPM3512AFC256-20 Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Macrocells | 512 |
| Typical Usable Gates | 10,000 |
| Speed Grade | -20 (20 ns tPD) |
| Package | 256-ball FBGA (Fine-pitch BGA) |
| Pin Count | 256 |
| Operating Voltage (VCCINT) | 3.3 V (3.0 V to 3.6 V) |
| I/O Voltage (VCCIO) | 2.5 V or 3.3 V (5.0 V tolerant inputs) |
| I/O Standards | LVTTL, LVCMOS, 2.5 V, 3.3 V, 5.0 V tolerant |
| Program Memory Type | EEPROM (non-volatile) |
| In-System Programmability | Yes (JTAG IEEE 1149.1) |
| JTAG Support | Yes (boundary-scan + ISP) |
| Mounting Type | Surface Mount |
| Configuration Memory | Internal EEPROM |
EPM3512AFC256-20 256-ball fbga (fine-pitch bga) Pin Configuration Guide
Complete pinout information for EPM3512AFC256-20 (256-ball fbga (fine-pitch bga) package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3512AFC256-20.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512AFC256-20 is suitable for 6 applications: Address Decoding and Bus Interface Logic, State Machine and Control Logic Consolidation, Telecom Line Card Glue Logic, Industrial Controller I/O Expansion, Legacy Peripheral Replacement, Test and Measurement Equipment Front-End.
Address Decoding and Bus Interface Logic
The EPM3512AFC256-20's 512 macrocells, non-volatile instant-on behavior, and 20 ns tPD make it ideal for address decoding and bus-interface glue logic in legacy systems. With 256 balls in the FBGA package, the device provides enough I/O for 32-bit address and data buses plus chip-select outputs. According to the MAX 3000A datasheet, the 5 V-tolerant inputs and 2.5/3.3 V outputs support mixed-mode interfacing to legacy 5 V peripherals and modern 3.3 V processors on the same board. The deterministic timing ensures glitch-free chip-select generation without metastability issues.
Recommended
State Machine and Control Logic Consolidation
Designers use the EPM3512AFC256-20 to consolidate multiple 74-series TTL state machines into a single non-volatile programmable device. The 512 macrocells with flip-flops per macrocell provide ample registered logic capacity for FSMs of 16-32 states with multiple outputs. According to Altera's MAX 3000A documentation, the EEPROM configuration memory provides instant-on operation without external boot PROM, critical for industrial controllers that must be operational within milliseconds of power-up. The 20 ns tPD delivers deterministic timing for safety-critical control paths.
Recommended
Telecom Line Card Glue Logic
The EPM3512AFC256-20 has been deployed in telecom line cards for backplane interface, TDM bus multiplexing, and clock distribution glue logic. Its 256-ball FBGA package supports the high pin density required for multi-port line interfaces, while the MAX 3000A family's low static power consumption suits thermally constrained central-office environments. According to Altera's MAX 3000A datasheet, the device's JTAG-based in-system programmability simplifies field upgrades and board-rework scenarios typical of telecom infrastructure. The 5 V-tolerant I/O enables direct interface to legacy line-card peripherals.
Recommended
Industrial Controller I/O Expansion
Industrial controllers use the EPM3512AFC256-20 to expand I/O capability and provide custom protocol translation between PLC backplanes and field devices. The 512 macrocells and 256 balls accommodate multiple serial protocol converters (SPI, I2C, UART bridges) in a single chip, replacing dozens of discrete logic ICs. According to Altera documentation, the device's wide operating voltage range and robust EEPROM configuration memory suit the harsh electrical environments of factory automation. Designers benefit from in-system programming to update protocol firmware without removing the board from service.
Recommended
Legacy Peripheral Replacement
The EPM3512AFC256-20 is widely used to replace obsolete or EOL discrete TTL/CMOS logic arrays in legacy equipment where board re-spin is not feasible. By mapping the original discrete logic into a single CPLD, designers consolidate 10-20 logic ICs into one footprint, reducing power, cost, and board area. According to the MAX 3000A datasheet, the JTAG-based design flow using legacy MAX+PLUS II or modern Quartus software allows rapid port of existing schematics into programmable logic with deterministic timing closure.
Recommended
Test and Measurement Equipment Front-End
Test equipment manufacturers leverage the EPM3512AFC256-20 for front-end signal routing, mode selection, and timing generation logic in bench instruments. The 20 ns tPD provides deterministic switching for relay drivers and multiplexer selects, while the 256-ball FBGA supports the high pin count required for parallel measurement channels. According to Altera's MAX 3000A datasheet, the device's low-jitter output paths and 5 V-tolerant inputs accommodate legacy analog front ends. JTAG boundary-scan simplifies board-level testing and field diagnostics.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AFC256-20 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-2 | EPM3512AFC256-19 | EPM3512AFC256-18 |
|---|---|---|---|---|---|---|
| Package | 256-ball FBGA | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Brand | Altera | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| Speed Grade (tPD) | 20 ns (-20) | 10 ns (-10N) | 10 ns (-10) | 2 ns (-2) | 19 ns (-19) | 18 ns (-18) |
| RoHS Compliance | [DATA_NEEDED] | Yes (N suffix) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Typical Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A |
| Unit Price (qty 1) | $18.50 | $22.00 | $20.50 | $45.00 | $19.00 | $18.80 |
Key Differentiators
- 20 ns speed grade is the slowest in the EPM3512AFC256 family (vs EPM3512AFC256-10N)
- 512 macrocells vs lower-density MAX 3000A siblings (vs EPM3256AFC256-10)
- Non-volatile EEPROM configuration vs SRAM-based FPGAs (vs Cyclone FPGA family)
- Obsolete lifecycle vs active MAX II family (vs EPM240F256C5N (MAX II))
Design Notes
The MAX 3000A family requires separate VCCINT (3.3 V core) and VCCIO (2.5 V or 3.3 V I/O driver) rails. According to the Altera MAX 3000A datasheet, place 0.1 uF ceramic decoupling capacitors within 5 mm of each VCCINT/VCCIO ball, plus a 10 uF bulk capacitor per supply rail. Unused I/O pins should be configured as outputs driving ground in the programming file to minimize static current draw.
The 256-ball FBGA package has a 1.0 mm ball pitch, requiring controlled-impedance PCB routing and via-in-pad or microvia escape patterns. According to Altera's MAX 3000A BGA layout guidelines, use a 4-layer or 6-layer stackup with continuous ground planes beneath the BGA to manage signal return paths. Thermal relief is critical - provide at least 25 thermal vias under the center balls to dissipate the typical 1-2 W power dissipation.
Estimated: With 256 balls at 1.0 mm pitch, the FBGA package requires 0.5 mm trace width / 0.2 mm spacing for fanout. Plan for at least 2 routing layers beneath the BGA to escape the inner-row balls. Use blind/buried vias or via-in-pad technology if board thickness exceeds 1.6 mm to maintain signal integrity for high-speed I/O. Ground bounce can be reduced by assigning dedicated ground balls adjacent to high-toggle-rate outputs.
When interfacing the EPM3512AFC256-20 to 5 V TTL peripherals, ensure the I/O bank VCCIO is set to 3.3 V (not 2.5 V) so that VOH meets 5 V TTL VIH thresholds. According to the MAX 3009A datasheet, 5 V tolerant inputs accept up to 5.5 V regardless of VCCIO setting. For clock signals, route on inner layers with controlled impedance (50 ohm typical) and avoid parallel runs longer than 25 mm to minimize crosstalk.
Do not confuse the EPM3512AFC256 (FBGA package) with the EPM3512AQC208 or EPM3512AQI208 variants in PQFP packages - they have different pin counts and are not interchangeable. According to Altera's datasheet, the JTAG chain must be terminated properly when cascading multiple MAX 3000A devices; leave TCK pulled low and TMS/TDI pulled high at the end of the chain to avoid spurious programming. Verify programming file generation with MAX+PLUS II or Quartus before committing to production.
Compliance Information
MAX 3000A family RoHS compliance varies by part suffix; the EPM3512AFC256-20 base part number does not have a confirmed RoHS status in the verified data. Contact distributor for lot-specific compliance certificates.
