EPM3512AFC256-22 - MAX 3000A CPLD, 512 Macrocells, BGA-256 | Intel
MPN: EPM3512AFC256-22 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.75 | $2,175.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $16.1 | $16,100.00 |
Drop-in alternatives for EPM3512AFC256-22 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM3512AFC256-22 Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 208 (typical for FC256 package) |
| Speed Grade | -22 (tPD ~22 ns) |
| Propagation Delay (tPD) | 22 ns |
| Supply Voltage VCCINT | 3.3 V |
| I/O Standards Supported | 2.5 V, 3.3 V, 5.0 V (VCCIO selectable) |
| In-System Programming | IEEE Std. 1532-compliant ISP via JTAG |
| Configuration Memory | On-chip EEPROM (non-volatile) |
| Package | FC-256 (FineLine BGA, 256 balls, 1.0 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
EPM3512AFC256-22 fc-256 (fineline bga, 256 balls, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EPM3512AFC256-22 (fc-256 (fineline bga, 256 balls, 1.0 mm pitch) package) with 208 (typical for FC256 package) pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3512AFC256-22.
Refer to the datasheet for full pin configuration.
Estimated pin count: 208 (typical for FC256 package) pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512AFC256-22 is suitable for 6 applications: Bus Address Decoding and Mapping, Peripheral Glue Logic Consolidation, Board-Level Voltage Translation Bridge, Industrial Control State Machine, Legacy Peripheral Emulation and Replacement, Test and Measurement Fixture Logic.
Bus Address Decoding and Mapping
The EPM3512AFC256-22 fits bus address decoding because its 512 macrocells comfortably handle wide-address decoders (24-32 bits) and chip-select generation for multiple peripherals. The 22 ns tPD is fast enough to provide stable chip selects within a single memory or peripheral access cycle of common microcontrollers and DSPs. According to the MAX 3000A datasheet, the device supports 5.0V VCCIO so it can directly interface with legacy TTL peripherals while running its core from 3.3V VCCINT. The non-volatile EEPROM configuration also means the decoder powers up active with valid chip selects before the host processor even begins its boot ROM fetch.
Recommended
Peripheral Glue Logic Consolidation
The EPM3512AFC256-22 consolidates dozens of 74-series TTL packages (latches, muxes, encoders, shift registers) into one programmable device, reducing PCB area and BOM cost in legacy industrial designs. With 16 Logic Array Blocks and 512 macrocells, the device can replace 20-30 discrete logic chips while maintaining the deterministic timing that made the original TTL design work. Per the MAX 3000A family datasheet, the JTAG boundary-scan (IEEE 1149.1) support lets you keep board-level test coverage after consolidation. The instant-on EEPROM configuration also preserves the fail-safe behavior of pure combinational TTL, which is critical for safety interlocks.
Recommended
Board-Level Voltage Translation Bridge
The EPM3512AFC256-22 acts as a voltage translation bridge between 5.0V legacy buses and 3.3V or 2.5V modern peripherals because the MAX 3000A family supports mixed-voltage I/O banks via separate VCCIO pins. According to the datasheet, each I/O bank can be powered independently at 2.5V, 3.3V, or 5.0V, so the device can sit physically between a 5V microcontroller bus and a 3.3V FPGA or DSP without external level shifters. With 512 macrocells, the bridge can also perform bus width conversion (e.g., 16-bit legacy to 32-bit modern) in the same device, simplifying board stack-up.
Recommended
Industrial Control State Machine
The EPM3512AFC256-22 is well suited to industrial control state machines because its non-volatile EEPROM configuration eliminates the FPGA-style boot delay that could be hazardous in motor-control or process-control loops. With 512 macrocells, the device can implement multi-state FSMs with 32-64 states plus parallel datapath logic for sensor debouncing, encoder decoding, and PWM generation. The 22 ns tPD is more than adequate for sub-microsecond control loop response at typical PLC scan rates (1-10 ms). Per the MAX 3000A datasheet family, the industrial temperature grade option supports -40C to +85C operation.
Recommended
Legacy Peripheral Emulation and Replacement
The EPM3512AFC256-22 is used to emulate obsolete or end-of-life peripherals (custom ASICs, vintage I/O controllers) in legacy system sustainment programs. Because the FC-256 BGA matches other MAX 3000A family members, sustainment engineers can drop in a faster speed grade or lower-density variant when the original -22 is out of stock. The Quartus design suite retains backward compatibility across the family, so legacy HDL designs can be re-targeted without HDL rewrite. According to the Alldatasheet listing, the EPM3512A family datasheet (42 pages) covers all package variants and dedicated pin-outs needed for emulation work.
Recommended
Test and Measurement Fixture Logic
The EPM3512AFC256-22 provides programmable pattern generation and timing control in test and measurement fixtures (ICT bed-of-nails, functional testers) because its JTAG and ISP interfaces let engineers re-program the device in seconds between test runs. With 208+ user I/O pins in the FC-256 package, one EPM3512AFC256-22 can drive a full parallel test bus plus handshake logic. The 22 ns tPD is appropriate for sub-50 MHz test vectors typical of boundary-scan and cluster test systems. Per the MAX 3000A datasheet, IEEE Std. 1532 ISP compliance means the device can be re-programmed in-circuit without removing it from the fixture.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AFC256-22 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-21 | EPM3512AFC256-20 | EPM3256AFC256-10 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-256 (256-ball BGA, 1.0 mm pitch) | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same | FC-256 (256-ball BGA) - same |
| Family | MAX 3000A | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same | MAX 3000A - same |
| Macrocells | 512 | 512 - same | 512 - same | 512 - same | 512 - same | 256 (-50%) |
| Speed Grade (tPD) | 22 ns | ~10 ns (faster) | ~10 ns (faster) | ~21 ns (similar) | ~20 ns (slightly faster) | ~10 ns (faster) |
| VCCINT | 3.3 V | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same |
| I/O Standards (VCCIO) | 2.5V / 3.3V / 5.0V | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same | 2.5V / 3.3V / 5.0V - same |
| Configuration Memory | EEPROM (non-volatile) | EEPROM - same | EEPROM - same | EEPROM - same | EEPROM - same | EEPROM - same |
| In-System Programming | IEEE Std. 1532 (JTAG) | IEEE Std. 1532 - same | IEEE Std. 1532 - same | IEEE Std. 1532 - same | IEEE Std. 1532 - same | IEEE Std. 1532 - same |
Key Differentiators
- Slowest speed grade in the FC-256 BGA, often cheapest on the secondary market (vs EPM3512AFC256-10N)
- Highest macrocell density available with this slow speed grade in the MAX 3000A family (vs EPM3256AFC256-10)
- Pin-compatible with all other EPM3512AFC256 speed grades for in-the-field upgrade (vs EPM3512AFC256-15)
- Non-volatile EEPROM configuration enables instant-on behavior impossible with FPGAs (vs Modern MAX II (EPM2210GF256C5N))
Design Notes
The MAX 3000A family uses a split-rail power architecture: VCCINT powers the internal logic and input buffers (always 3.3V for the EPM3512A), while VCCIO powers the I/O output drivers and can be tied to 2.5V, 3.3V, or 5.0V. Per the MAX 3000A datasheet, decoupling must include at least one 0.1 uF ceramic cap adjacent to every VCCINT and VCCIO pin pair, plus a bulk 10-100 uF tantalum or polymer cap per supply rail. Estimated: at 50 MHz toggle rate with 50% I/O utilization, the FC-256 device draws approximately 200-400 mA from VCCINT - design the 3.3V regulator with at least 25% margin.
The FC-256 FineLine BGA uses a 1.0 mm ball pitch, which requires microvia PCB technology (laser-drilled vias or stacked vias) for fan-out. Per IPC-7351 and the MAX 3000A package guidelines, allow at least 4 routing layers with continuous power/ground planes beneath the BGA to control simultaneous-switching noise (SSN) on the 208+ I/O pins. Estimated: a full BGA fan-out requires approximately 4-6 PCB layers with 4-mil trace/space design rules. Use the Altera/Intel package footprint file (or download from the Intel FPGA board design resource center) to ensure your land pattern matches the recommended NSMD (non-solder mask defined) pad geometry.
Do not leave VCCIO pins floating - the EPM3512AFC256-22 has multiple VCCIO banks and each must be tied to a valid supply (2.5V, 3.3V, or 5.0V) even if the bank is unused. Per the MAX 3000A datasheet, an unpowered VCCIO bank can cause I/O pin behavior to be undefined and may increase quiescent current. Also ensure the JTAG TCK pin is pulled to a known state (typically low) during power-up to prevent unintended ISP operations. Finally, configure unused I/O pins as outputs driving low (or as inputs with internal pull-up enabled) to minimize power and reduce SSN - the Quartus fitter default handles this if you enable 'Auto implement unused pins' in the device options.
Place the EPM3512AFC256-22 with its JTAG chain accessible at a board-level test header so IEEE Std. 1532 in-system programming can be performed after PCB assembly. Per the MAX 3000A datasheet, the JTAG pins (TCK, TMS, TDI, TDO, and optional TRST) must be series-terminated with 100-200 ohm resistors if the TCK trace exceeds 50 mm to prevent ringing. Keep TCK trace length under 100 mm total and route it on an inner signal layer with ground reference. The TDO signal should be pulled up to VCCIO of the JTAG bank (typically 3.3V) through a 10 kohm resistor if the JTAG chain is breakable.
The MAX 3000A family outputs can source/sink 25 mA per pin (per datasheet), making them well-suited for direct LED drive or bus termination, but simultaneous switching of many outputs can cause ground bounce. Per the MAX 3000A datasheet, limit simultaneously-switching outputs (SSO) to roughly 16-20 pins per VCCIO/GND pair to keep ground bounce below 1V. Use chip-on-board ground inductance minimization (multiple via arrays under the BGA) and consider adding 22-33 ohm series termination on high-speed outputs that drive more than 50 mm of trace. Estimated: at 22 ns tPD, the output edge rate is approximately 2-3 ns, so treat traces longer than one-quarter of the edge-rate-length product (~150 mm at 50 MHz) as transmission lines.
Compliance Information
Compliance status for the EPM3512AFC256-22 was not present in the verified web data; the MAX 3000A family is obsolete, so a current RoHS/REACH declaration may not be published by Intel. The part is not AEC-Q100 qualified (CPLDs are not typically automotive-qualified unless explicitly listed).
