EPM3512AFC256-7 - 512-Macrocell MAX 3000A CPLD, 7.5ns, BGA-256 | Intel
MPN: EPM3512AFC256-7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $82.18 | $82.18 |
| 10 | $78.5 | $785.00 |
| 100 | $72.9 | $7,290.00 |
| 500 | $65.75 | $32,875.00 |
| 1,000 | $58.4 | $58,400.00 |
Drop-in alternatives for EPM3512AFC256-7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM3512AFC256-10
✅ Drop-In✓ In Stock
$17.5 / Unit
View Datasheet →EPM3512AFC256-10N
✅ Drop-In✓ In Stock
$43.22 / Unit
View Datasheet →EPM3512AFC256-5C
✅ Drop-In✓ In Stock
$28.95 / Unit
View Datasheet →EPM3512AFC256-3N
✅ Drop-In✓ In Stock
$23.4 / Unit
View Datasheet →EPM3256AFC256-7
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →EPM3512AFC256-7 Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Logic Array Blocks (LABs) | 16 |
| User I/O Pins | 212 |
| Usable Gates | 10,000 |
| Pin-to-Pin Logic Delay | 7.5 ns |
| Counter Frequency (max) | 227.3 MHz |
| Supply Voltage - Core (VCCINT) | 3.0 V to 3.6 V (3.3 V typ.) |
| I/O Voltage (VCCIO) | 5.0 V / 3.3 V / 2.5 V (MultiVolt) |
| Package | 256-ball FineLine BGA (FBGA-256) |
| Programming | EEPROM, IEEE 1149.1 JTAG ISP (IEEE 1532-compliant) |
| Mounting Type | Surface Mount |
| Configuration Memory | Non-volatile EEPROM |
EPM3512AFC256-7 256-ball fineline bga (fbga-256) Pin Configuration Guide
Complete pinout information for EPM3512AFC256-7 (256-ball fineline bga (fbga-256) package) with 212 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3512AFC256-7.
Refer to the datasheet for full pin configuration.
Estimated pin count: 212 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512AFC256-7 is suitable for 6 applications: Address Decoding and Bus Glue Logic, Peripheral Interface Bridging, State Machine and Sequencer Controllers, I/O Expansion and GPIO Replication, Legacy System Modernization, Asynchronous Interface Translation.
Address Decoding and Bus Glue Logic
The EPM3512AFC256-7's 512 macrocells and 7.5 ns pin-to-pin delay make it well-suited to decode address and control signals on multi-master microprocessor buses where deterministic timing and instant-on configuration matter. Placed between a host CPU and peripheral chips, the device maps chip-select, read/write strobes, and interrupt vectors from raw address bits. With 212 user I/Os and MultiVolt 5V/3.3V/2.5V support, it can interface both legacy and modern peripherals on the same board. The 3.3V in-system programmability via JTAG means prototype-to-production changes require no hardware rework.
Recommended
Peripheral Interface Bridging
With MultiVolt I/O supporting 5.0V, 3.3V, and 2.5V logic levels and 212 user I/O pins, the EPM3512AFC256-7 acts as a level-shifting bridge between legacy 5V peripherals and modern 3.3V or 2.5V ASICs. The 10,000-gate capacity absorbs protocol adapters, FIFO flags, and handshake logic without external gates. 7.5 ns pin-to-pin delay ensures clean setup/hold margins at 50 MHz bus speeds. The non-volatile EEPROM configuration boots instantly, eliminating the FPGA-style external configuration memory and reducing BOM cost.
Recommended
State Machine and Sequencer Controllers
The EPM3512AFC256-7's 16 LABs of 16 macrocells each provide abundant registered logic for FSM-heavy sequencers used in industrial automation and test equipment. Its deterministic 7.5 ns timing and 227.3 MHz counter ceiling let designers build fast, glitch-free sequencers for stepper-motor control, test-pattern generation, or display timing. EEPROM-backed configuration means the device wakes up in a known good state on every power cycle, eliminating the FPGA-style multi-millisecond boot delay that would otherwise complicate real-time sequencing.
Recommended
I/O Expansion and GPIO Replication
For microcontrollers with insufficient native GPIO, the EPM3512AFC256-7 adds up to 212 programmable I/Os that can implement shift registers, PWM generators, or matrix-keypad scanners. Its MultiVolt I/O lets the CPLD drive 5V LEDs and 3.3V MCUs from the same chip. The 7.5 ns delay supports scan rates above 100 MHz for LED-matrix multiplexing. JTAG-based ISP allows field firmware updates without removing the device from the board, reducing service cost for installed systems.
Recommended
Legacy System Modernization
The EPM3512AFC256-7 is widely used to replace discrete 74-series logic, PALs, and GALs in legacy equipment retrofits, consolidating dozens of small packages into one BGA-256 device. Its 10K-gate capacity typically replaces 30-50 TTL packages, freeing board area for other functions. 3.3V core with MultiVolt I/O simplifies migration from 5V-only designs. JTAG programming and instant-on EEPROM configuration shorten production flow versus older UV-erase PALs.
Recommended
Asynchronous Interface Translation
The EPM3512AFC256-7 is ideal for asynchronous protocol conversion between UART, SPI, I2C, parallel buses, and proprietary interfaces - especially in mixed-voltage systems. The 7.5 ns timing budget accommodates fast SPI peripherals up to 60 MHz, while 212 I/Os handle wide parallel data paths. Dual VCCIO banks let the CPLD drive 5V RS-232 transceivers and 3.3V microcontrollers simultaneously. Non-volatile configuration means the converter is ready immediately at power-up, with no boot sequence to manage in the host MCU.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AFC256-7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFC256-10 | EPM3512AFC256-10N | EPM3512AFC256-5C | EPM3512AFC256-3N | EPM3256AFC256-7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Pin-to-Pin Delay (tPD) | 7.5 ns | 10 ns | 10 ns | 5 ns | 3 ns | 7.5 ns |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 |
| User I/O Pins | 212 | 212 | 212 | 212 | 212 | [DATA_NEEDED] |
| Counter Frequency (max) | 227.3 MHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 227.3 MHz |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| MultiVolt I/O Support | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V |
| Configuration Memory | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| Approx. Unit Price (qty 1) | $82.18 | Lower (older speed grade) | ~$81.65 (Heisener, as of 2026-09-12) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Largest macrocell count in MAX 3000A family (vs EPM3256AFC256-7)
- Slower but lower-cost speed grade (vs EPM3512AFC256-10)
- Non-volatile EEPROM configuration (vs MAX II EPM240T100C5N (SRAM-based))
Design Notes
The EPM3512AFC256-7 requires separate VCCINT (3.3V core) and VCCIO (I/O bank) supplies. Per the MAX 3000A datasheet, VCCINT must be in the 3.0V-3.6V range and VCCIO can be 2.5V, 3.3V, or 5.0V depending on the I/O bank. Decouple each VCCINT ball with a 0.1 uF ceramic capacitor placed within 3 mm of the pin; add a bulk 10-47 uF tantalum or ceramic capacitor at the package supply entry. Estimated core current: ICCINT approximately 50-150 mA active (family typical).
The 256-ball FineLine BGA requires a 4-layer (or better) PCB with continuous ground and power planes directly beneath the package. Per the MAX 3000A package specification, ball pitch is 1.0 mm with 0.6 mm ball diameter - use NSMD (non-solder-mask-defined) pads of 0.5 mm diameter for reliable reflow. Place via-in-pad only with proper plating fill to avoid solder wicking; microvia stackups are recommended for inner-row escape routing.
Assign JTAG pins (TDI, TDO, TMS, TCK) to dedicated balls with no series resistors, and place a 10 kohm pull-up on TCK and TMS per the IEEE 1149.1 recommendation. Per the MAX 3000A datasheet, the JTAG chain must bypass the device if it is not the final target by using the dedicated JTAG chain routing. MultiVolt I/O banks must be grouped on the same VCCIO plane; mixing 5V and 3.3V signals on one bank will damage the I/O cells.
Do not leave any VCCIO bank supply floating - unpowered banks can back-power through I/O pins and cause latch-up. Per the MAX 3000A datasheet, all four VCCIO bank pins must be connected, even if a bank is unused. In-system programming via JTAG requires the nCONFIG or equivalent enable sequence - do not tie TCK to ground. Finally, EEPROM-based devices support only a finite number of program/erase cycles (typically 100-1000); production programmers must not iterate infinitely during board test.
Compliance Information
Compliance flags not explicitly stated in the verified web data; the -7N suffix on related part numbers suggests lead-free options exist within the family. The -7 suffix (no N) typically denotes SnPb or non-RoHS terminations - confirm with the distributor before RoHS-critical applications.
