EPM3512AFC256-7 - 512-Macrocell MAX 3000A CPLD, 7.5ns, BGA-256 | Intel
N.º da peça: EPM3512AFC256-7 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $82.18 | $82,18 |
| 10 | $78.5 | $785,00 |
| 100 | $72.9 | $7.290,00 |
| 500 | $65.75 | $32.875,00 |
| 1.000 | $58.4 | $58.400,00 |
EPM3512AFC256-7 Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocells with a central interconnect matrix. It sits in the programmable-logic hierarchy between simple SPLDs/CPLDs and large FPGAs: gate-array -> FPGA -> CPLD -> SPLD -> programmable logic. The MAX 3000A family targets glue-logic, bus-interface, and state-machine integration where deterministic timing, instant-on EEPROM configuration, and low unit cost are priorities.
Key features include 4.5 ns pin-to-pin logic delays, counter frequencies up to 227.3 MHz, MultiVolt I/O supporting 5.0V, 3.3V, and 2.5V logic levels on a 3.3V core, and 3.3V in-system programmability (ISP) through the built-in IEEE Std. 1149.1 JTAG interface. The device provides 10,000 usable gates and operates from a 3.0V to 3.6V supply. The 256-ball FineLine BGA package is suitable for high-density board designs where quad flat pack is too large.
The MAX 3000A architecture uses a classic EEPROM cell array feeding a programmable interconnect, with each LAB containing 16 macrocells that share a common product-term matrix. This architecture yields predictable, deterministic timing independent of routing density, a key advantage over SRAM-based FPGAs for control-plane and interface-bridging tasks.
Typical applications include peripheral bus interface bridging, address decoding and glue logic, state-machine controllers, I/O expansion, and asynchronous interface translation between 5V, 3.3V, and 2.5V logic domains. Designers commonly pair the EPM3512AFC256-7 with microprocessors, ASICs, or larger FPGAs to absorb the random logic that does not justify its own custom silicon.
When designing with this device, allocate dedicated VCCINT and VCCIO planes; the MultiVolt interface requires separate VCCIO bank supplies if mixing 5V and 3.3V logic. JTAG chain ordering matters in multi-device boards, and ISP via JTAG eliminates the need for a separate programmer, reducing manufacturing cost.
This page synthesizes distributor pricing, MAX 3000A family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para EPM3512AFC256-7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM3512AFC256-7 (mesmo formato e footprint) — diferindo em Package, Programming Interface, Pin-to-Pin Delay (tPD), Operating Temperature, User I/O Pins.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM3512AFC256-10
✅ Drop-In✓ Em estoque
$17.5 / unidade
Ver ficha técnica →EPM3512AFC256-10N
✅ Drop-In✓ Em estoque
$43.22 / unidade
Ver ficha técnica →EPM3512AFC256-5C
✅ Drop-In✓ Em estoque
$28.95 / unidade
Ver ficha técnica →EPM3512AFC256-3N
✅ Drop-In✓ Em estoque
$23.4 / unidade
Ver ficha técnica →EPM3256AFC256-7
✅ Drop-In✓ Em estoque
$12.1 / unidade
Ver ficha técnica →EPM3512AFC256-7 Classificações máximas e características elétricas
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Logic Array Blocks (LABs) | 16 |
| User I/O Pins | 212 |
| Usable Gates | 10,000 |
| Pin-to-Pin Logic Delay | 7.5 ns |
| Counter Frequency (max) | 227.3 MHz |
| Supply Voltage - Core (VCCINT) | 3.0 V to 3.6 V (3.3 V typ.) |
| I/O Voltage (VCCIO) | 5.0 V / 3.3 V / 2.5 V (MultiVolt) |
| Encapsulamento | 256-ball FineLine BGA (FBGA-256) |
| Programming | EEPROM, IEEE 1149.1 JTAG ISP (IEEE 1532-compliant) |
| Tipo de montagem | Surface Mount |
| Configuration Memory | Non-volatile EEPROM |
Guia de Configuração de Pinos do EPM3512AFC256-7 256-ball fineline bga (fbga-256)
Configuração de pinos para EPM3512AFC256-7 (pacote 256-ball fineline bga (fbga-256)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPM3512AFC256-7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPM3512AFC256-7 é adequado para 6 aplicaçãos: Address Decoding and Bus Glue Logic, Peripheral Interface Bridging, State Machine and Sequencer Controllers, I/O Expansion and GPIO Replication, Legacy System Modernization, Asynchronous Interface Translation.
Address Decoding and Bus Glue Logic
The EPM3512AFC256-7's 512 macrocells and 7.5 ns pin-to-pin delay make it well-suited to decode address and control signals on multi-master microprocessor buses where deterministic timing and instant-on configuration matter. Placed between a host CPU and peripheral chips, the device maps chip-select, read/write strobes, and interrupt vectors from raw address bits. With 212 user I/Os and MultiVolt 5V/3.3V/2.5V support, it can interface both legacy and modern peripherals on the same board. The 3.3V in-system programmability via JTAG means prototype-to-production changes require no hardware rework.
Recomendado
Peripheral Interface Bridging
With MultiVolt I/O supporting 5.0V, 3.3V, and 2.5V logic levels and 212 user I/O pins, the EPM3512AFC256-7 acts as a level-shifting bridge between legacy 5V peripherals and modern 3.3V or 2.5V ASICs. The 10,000-gate capacity absorbs protocol adapters, FIFO flags, and handshake logic without external gates. 7.5 ns pin-to-pin delay ensures clean setup/hold margins at 50 MHz bus speeds. The non-volatile EEPROM configuration boots instantly, eliminating the FPGA-style external configuration memory and reducing BOM cost.
Recomendado
State Machine and Sequencer Controllers
The EPM3512AFC256-7's 16 LABs of 16 macrocells each provide abundant registered logic for FSM-heavy sequencers used in industrial automation and test equipment. Its deterministic 7.5 ns timing and 227.3 MHz counter ceiling let designers build fast, glitch-free sequencers for stepper-motor control, test-pattern generation, or display timing. EEPROM-backed configuration means the device wakes up in a known good state on every power cycle, eliminating the FPGA-style multi-millisecond boot delay that would otherwise complicate real-time sequencing.
Recomendado
I/O Expansion and GPIO Replication
For microcontrollers with insufficient native GPIO, the EPM3512AFC256-7 adds up to 212 programmable I/Os that can implement shift registers, PWM generators, or matrix-keypad scanners. Its MultiVolt I/O lets the CPLD drive 5V LEDs and 3.3V MCUs from the same chip. The 7.5 ns delay supports scan rates above 100 MHz for LED-matrix multiplexing. JTAG-based ISP allows field firmware updates without removing the device from the board, reducing service cost for installed systems.
Recomendado
Legacy System Modernization
The EPM3512AFC256-7 is widely used to replace discrete 74-series logic, PALs, and GALs in legacy equipment retrofits, consolidating dozens of small packages into one BGA-256 device. Its 10K-gate capacity typically replaces 30-50 TTL packages, freeing board area for other functions. 3.3V core with MultiVolt I/O simplifies migration from 5V-only designs. JTAG programming and instant-on EEPROM configuration shorten production flow versus older UV-erase PALs.
Recomendado
Asynchronous Interface Translation
The EPM3512AFC256-7 is ideal for asynchronous protocol conversion between UART, SPI, I2C, parallel buses, and proprietary interfaces - especially in mixed-voltage systems. The 7.5 ns timing budget accommodates fast SPI peripherals up to 60 MHz, while 212 I/Os handle wide parallel data paths. Dual VCCIO banks let the CPLD drive 5V RS-232 transceivers and 3.3V microcontrollers simultaneously. Non-volatile configuration means the converter is ready immediately at power-up, with no boot sequence to manage in the host MCU.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM3512AFC256-7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM3512AFC256-10 | EPM3512AFC256-10N | EPM3512AFC256-5C | EPM3512AFC256-3N | EPM3256AFC256-7 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Pin-to-Pin Delay (tPD) | 7.5 ns | 10 ns | 10 ns | 5 ns | 3 ns | 7.5 ns |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| MultiVolt I/O Support | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V | 5.0V / 3.3V / 2.5V |
| Configuration Memory | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
Principais diferenciais
- Largest macrocell count in MAX 3000A family (vs EPM3256AFC256-7)
- Slower but lower-cost speed grade (vs EPM3512AFC256-10)
- Non-volatile EEPROM configuration (vs MAX II EPM240T100C5N (SRAM-based))
Notas de projeto
The EPM3512AFC256-7 requires separate VCCINT (3.3V core) and VCCIO (I/O bank) supplies. Per the MAX 3000A datasheet, VCCINT must be in the 3.0V-3.6V range and VCCIO can be 2.5V, 3.3V, or 5.0V depending on the I/O bank. Decouple each VCCINT ball with a 0.1 uF ceramic capacitor placed within 3 mm of the pin; add a bulk 10-47 uF tantalum or ceramic capacitor at the package supply entry. Estimated core current: ICCINT approximately 50-150 mA active (family typical).
The 256-ball FineLine BGA requires a 4-layer (or better) PCB with continuous ground and power planes directly beneath the package. Per the MAX 3000A package specification, ball pitch is 1.0 mm with 0.6 mm ball diameter - use NSMD (non-solder-mask-defined) pads of 0.5 mm diameter for reliable reflow. Place via-in-pad only with proper plating fill to avoid solder wicking; microvia stackups are recommended for inner-row escape routing.
Assign JTAG pins (TDI, TDO, TMS, TCK) to dedicated balls with no series resistors, and place a 10 kohm pull-up on TCK and TMS per the IEEE 1149.1 recommendation. Per the MAX 3000A datasheet, the JTAG chain must bypass the device if it is not the final target by using the dedicated JTAG chain routing. MultiVolt I/O banks must be grouped on the same VCCIO plane; mixing 5V and 3.3V signals on one bank will damage the I/O cells.
Do not leave any VCCIO bank supply floating - unpowered banks can back-power through I/O pins and cause latch-up. Per the MAX 3000A datasheet, all four VCCIO bank pins must be connected, even if a bank is unused. In-system programming via JTAG requires the nCONFIG or equivalent enable sequence - do not tie TCK to ground. Finally, EEPROM-based devices support only a finite number of program/erase cycles (typically 100-1000); production programmers must not iterate infinitely during board test.
Informações de conformidade
Compliance flags not explicitly stated in the verified web data; the -7N suffix on related part numbers suggests lead-free options exist within the family. The -7 suffix (no N) typically denotes SnPb or non-RoHS terminations - confirm with the distributor before RoHS-critical applications.
