H5ANAG8NCMR-VKI - 16Gb DDR4 SDRAM 2666Mbps x8 | SK Hynix
MPN: H5ANAG8NCMR-VKI ✓ Active| Qty | Unit Price | Extended |
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| 10 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
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Drop-in alternatives for H5ANAG8NCMR-VKI — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →H5ANAG8NCMR-VKI Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Size | 16 Gb |
| Memory Organization | x8 |
| Data Rate | 2666 Mbps per pin |
| Technology | CMOS, volatile DRAM |
| Mounting Type | Surface Mount (BGA) |
| Product Status | Active |
| Clocking | Differential clock (CK / CK#), fully synchronous |
| On-Die Termination | Yes (ODT) |
H5ANAG8NCMR-VKI [data_needed: package] Pin Configuration Guide
Complete pinout information for H5ANAG8NCMR-VKI ([data_needed: package] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: package] package pinout diagram for H5ANAG8NCMR-VKI](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for H5ANAG8NCMR-VKI.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5ANAG8NCMR-VKI is suitable for 6 applications: Server and Workstation Main Memory, Embedded Computing and COM Express Modules, Networking Line Cards and Packet Buffers, FPGA-Based Processing and Prototyping Systems, Industrial Gateways and Edge AI Systems, Medical Imaging and Instrumentation.
Server and Workstation Main Memory
The H5ANAG8NCMR-VKI is a natural fit for server and workstation main memory because its 16Gb density and 2666 Mbps data rate deliver maximum capacity per component and high sustained bandwidth. Four x8 devices populate a single-rank 8GB ECC UDIMM or RDIMM byte lane, while sixteen devices build a dual-rank 32GB module. DDR4 bank-group architecture interleaves activations for higher effective bandwidth than DDR3 at the same clock. Placed on a standard JEDEC DIMM with fly-by address/command routing and per-pin ODT, the -VKI speed grade sustains 2666 MT/s under the controller's trained read/write leveling. Compared with populating 8Gb parts, halving IC count reduces placement cost, power, and failure points in volume server builds.
Recommended
Embedded Computing and COM Express Modules
Embedded x86 and ARM compute modules (COM Express, SMARC, ATX daughterboards) use the H5ANAG8NCMR-VKI to provide multi-gigabyte system memory in a small footprint. Two to four 16Gb x8 components give 4-8GB of soldered-down memory, eliminating SO-DIMM connectors and improving vibration resistance in industrial and transportation environments. The 2666 Mbps rate matches Intel and AMD embedded controller memory references, and the 1.2V-class DDR4 interface keeps memory power low for fanless designs. Designers should run full read/write training at the target frequency and budget soldered-down memory as non-upgradable, selecting the 16Gb density upfront since it is the only way to reach 8GB with just four devices on a compact module.
Recommended
Networking Line Cards and Packet Buffers
Routers, switches, and network appliances need large, fast packet buffers and flow tables; the H5ANAG8NCMR-VKI's 16Gb density and 2666 Mbps bandwidth address both requirements. An x8 organization maps cleanly onto 64-bit control-plane memory buses using eight devices, while on-die termination supports the heavily loaded multi-drop address/command nets typical of line-card layouts. DDR4 bank groups allow concurrent activation streams that keep queue-management engines fed at line rate. Because networking systems often run 24/7 at elevated ambient temperatures, verify the device's approved operating temperature range and derate speed accordingly. Using a common footprint also lets one line-card PCB accept multiple SK Hynix speed bins based on cost and availability.
Recommended
FPGA-Based Processing and Prototyping Systems
FPGA designs for image processing, test instrumentation, and acceleration frequently require gigabyte-scale working memory; the H5ANAG8NCMR-VKI connects directly to FPGA hard DDR4 memory controllers. The x8 organization simplifies data-bus mapping to 72-bit ECC interfaces (eight devices plus one ECC device), and 2666 Mbps matches the validated upper-rate operating points of common FPGA DDR4 PHYs. During bring-up, engineers must execute the full DDR4 training sequence - write leveling, read centering, write/read DQS gating, and VREF training - which the on-die termination and differential clocking of this device support. The 16Gb density allows an 8GB buffer bank with only nine components, keeping the FPGA board layout compact and routing lengths matched.
Recommended
Industrial Gateways and Edge AI Systems
Edge AI gateways running vision inference and data logging benefit from the H5ANAG8NCMR-VKI's combination of 16Gb density and DDR4 bandwidth, which supports frame buffers for multiple camera streams and model weight storage in DRAM. Four soldered-down x8 components provide 8GB with low memory power draw, important for passively cooled edge enclosures. The 2666 Mbps rate supplies the headroom needed for real-time pre-processing pipelines, while bank-group parallelism smooths bursty DMA traffic from capture and accelerator IPs. Designers should validate sustained bandwidth under mixed read/write loads and confirm temperature ratings for the deployment environment. Choosing DDR4 components like this part also keeps the design on a mature, multi-source supply chain rather than scarce DDR5.
Recommended
Medical Imaging and Instrumentation
Medical imaging systems such as ultrasound, digital radiography, and lab analyzers require large image buffers with reliable, low-jitter memory; the H5ANAG8NCMR-VKI's 16Gb x8 DDR4 at 2666 Mbps fills this role with a small footprint. Eight devices form a 64-bit plus ECC data path that protects long image acquisitions against soft errors, and on-die termination maintains signal integrity on the dense multi-drop command bus typical of instrument backplanes. DDR4's lower operating voltage reduces memory subsystem heat, easing thermal design in enclosed benchtop instruments. Because medical programs have long lifecycles, the JEDEC-standard DDR4 footprint allows second-sourcing across SK Hynix grades and Micron equivalents without PCB redesign over the product's service life.
Recommended
Recommended Products Summary
Engineering reference data for H5ANAG8NCMR-VKI — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5ANAG8NCMR-XNI | H5ANAG8NCR-VKC | MT40A2G8AG-062E |
|---|---|---|---|---|
| Brand | SK Hynix | SK Hynix | SK Hynix | Micron Technology |
| Package | FBGA (DDR4 x8, JEDEC standard ballout) | FBGA - same footprint | FBGA - same footprint | FBGA - same JEDEC footprint |
| Memory Size | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Organization | x8 | x8 | x8 | x8 |
| Technology | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM |
| Speed Grade | -VKI (2666 Mbps class) | -XNI (2666-class bin) | -VKC (2666-class bin) | -062E (2666-class bin) |
| Lifecycle Status | Active | Active | Active | Active |
| Broker Stock (latest snapshot) | 36,040-49,100 pcs (2025-2026 snapshots) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- 16Gb density halves IC count per gigabyte (vs H5AN8G8NCJR-VKI)
- Multi-bin same-footprint family for cost/supply tuning (vs H5ANAG8NCMR-XNI)
- JEDEC-standard cross-brand second source (vs MT40A2G8AG-062E)
Design Notes
At 2666 Mbps, DDR4 signal integrity depends on fly-by address/command routing with per-DIMM or per-device ODT, matched-length data groups (skew within controller spec, typically a few picoseconds per mm rule of thumb), and solid reference planes. Route each byte lane over an unbroken ground reference, and terminate VTT with bulk plus high-frequency decoupling near the termination rail. Run the full training sequence (write leveling, read centering, VREF training) at the target frequency rather than assuming datasheet timings alone guarantee margin.
DDR4 operates from separate VDD, VDDQ, and VPP rails with VTT termination at VDDQ/2. Estimate per-device current from the controller's bandwidth profile - 16Gb x8 at 2666 Mbps can draw appreciable peak current during bank-group interleaved bursts, so size the VTT regulator and bulk capacitance for worst-case simultaneous read/write patterns, not average throughput. Verify actual VDD/VDDQ values and current figures against the SK Hynix datasheet before finalizing the power tree; the retrieved data did not include explicit rail specifications.
Soldered-down DDR4 is not upgradeable: choose the 16Gb H5ANAG8NCMR-VKI upfront if there is any chance of needing 8GB from four chips. Second, speed-bin suffixes (V/X/U/R codes) encode both speed and temperature/grade attributes - never substitute a lower bin and assume the same operating frequency. Finally, when qualifying the Micron MT40A2G8AG-062E cross-brand, re-verify output driver strength, ODT settings, and AC timings against both vendors' datasheets, since JEDEC pin compatibility does not guarantee identical electrical behavior.
Compliance Information
Compliance status not stated in retrieved distributor snippets; request RoHS/REACH certificates from SK Hynix or distributor before compliance-critical use.
