H5ANAG8NCMR-VKI - 16Gb DDR4 SDRAM 2666Mbps x8 | SK Hynix
Référence : H5ANAG8NCMR-VKI ✓ Actif| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
H5ANAG8NCMR-VKI Présentation
DDR4 SDRAM is the fourth generation of Double Data Rate synchronous DRAM, a class of volatile memory that transfers data on both rising and falling edges of the clock, doubling effective bandwidth compared to SDR DRAM. In the system memory hierarchy, DDR4 sits below LPDDR4/DDR5 in power optimization but above DDR3 in speed and density, making it the dominant main-memory technology for servers, workstations, and embedded compute platforms from roughly 2014 to the present DDR5 transition.
Key features of the H5ANAG8NCMR-VKI include fully synchronous operation referenced to both rising and falling edges of the clock, differential clock inputs (CK/CK#) for improved signal integrity, and on-die termination (ODT) that reduces reflections on high-speed address, command, and data buses. The 16Gb density in a single x8 component allows designers to populate 8GB with only four devices, reducing BOM count and PCB area compared to lower-density generations.
Technically, the device uses a bank-group architecture with multiple internal banks, supporting commands such as ACTIVATE, READ, WRITE, and PRECHARGE per the JEDEC DDR4 specification, with programmable CAS latency and burst length for system tuning. The -VKI speed grade supports 2666 Mbps operation with JEDEC-standard 1.2V VDD signaling, enabling lower power than DDR3's 1.5V interface at substantially higher bandwidth.
Typical applications include server and workstation main memory DIMMs, industrial embedded computing modules, networking equipment line-card buffers, and FPGA-based processing systems that require gigabyte-scale working memory with high sustained bandwidth.
When designing with this device, pay close attention to DDR4 fly-by routing, VREF training, and ZQ calibration requirements, which differ significantly from DDR3 layouts and are critical for signal integrity at 2666 Mbps.
This page synthesizes distributor stock data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving buyers and engineers a single decision-ready reference.
Alternatives de remplacement direct pour H5ANAG8NCMR-VKI — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec H5ANAG8NCMR-VKI (même facteur de forme et même empreinte) — différant par Data Rate, Memory Type, Package, Memory Size, Memory Organization.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
H5ANAG8NCMR-XNI
✅ Remplacement direct✓ En stock
$4.15 / unité
Voir la fiche technique →H5ANAG8NCMR-VKC
✅ Remplacement direct✓ En stock
$8.05 / unité
Voir la fiche technique →H5ANAG8NCR-VKC
✅ Remplacement direct✓ En stock
$28.13 / unité
Voir la fiche technique →H5ANAG8NAMR-UHC
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.15 / unité
Voir la fiche technique →MT40A2G8AG-062E
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →H5ANAG8NCMR-VKI Valeurs maximales et caractéristiques électriques
| Type de mémoire | DDR4 SDRAM |
| Taille de mémoire | 16 Gb |
| Memory Organization | x8 |
| Débit de données | 2666 Mbps per pin |
| Technology | CMOS, volatile DRAM |
| Type de montage | Surface Mount (BGA) |
| Product Status | Active |
| Clocking | Differential clock (CK / CK#), fully synchronous |
| On-Die Termination | Yes (ODT) |
Guide de configuration des broches du H5ANAG8NCMR-VKI standard
Configuration des broches du H5ANAG8NCMR-VKI (boîtier standard). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour H5ANAG8NCMR-VKI.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
H5ANAG8NCMR-VKI convient pour 6 applications: Server and Workstation Main Memory, Embedded Computing and COM Express Modules, Networking Line Cards and Packet Buffers, FPGA-Based Processing and Prototyping Systems, Industrial Gateways and Edge AI Systems, Medical Imaging and Instrumentation.
Server and Workstation Main Memory
The H5ANAG8NCMR-VKI is a natural fit for server and workstation main memory because its 16Gb density and 2666 Mbps data rate deliver maximum capacity per component and high sustained bandwidth. Four x8 devices populate a single-rank 8GB ECC UDIMM or RDIMM byte lane, while sixteen devices build a dual-rank 32GB module. DDR4 bank-group architecture interleaves activations for higher effective bandwidth than DDR3 at the same clock. Placed on a standard JEDEC DIMM with fly-by address/command routing and per-pin ODT, the -VKI speed grade sustains 2666 MT/s under the controller's trained read/write leveling. Compared with populating 8Gb parts, halving IC count reduces placement cost, power, and failure points in volume server builds.
Recommandé
Embedded Computing and COM Express Modules
Embedded x86 and ARM compute modules (COM Express, SMARC, ATX daughterboards) use the H5ANAG8NCMR-VKI to provide multi-gigabyte system memory in a small footprint. Two to four 16Gb x8 components give 4-8GB of soldered-down memory, eliminating SO-DIMM connectors and improving vibration resistance in industrial and transportation environments. The 2666 Mbps rate matches Intel and AMD embedded controller memory references, and the 1.2V-class DDR4 interface keeps memory power low for fanless designs. Designers should run full read/write training at the target frequency and budget soldered-down memory as non-upgradable, selecting the 16Gb density upfront since it is the only way to reach 8GB with just four devices on a compact module.
Recommandé
Networking Line Cards and Packet Buffers
Routers, switches, and network appliances need large, fast packet buffers and flow tables; the H5ANAG8NCMR-VKI's 16Gb density and 2666 Mbps bandwidth address both requirements. An x8 organization maps cleanly onto 64-bit control-plane memory buses using eight devices, while on-die termination supports the heavily loaded multi-drop address/command nets typical of line-card layouts. DDR4 bank groups allow concurrent activation streams that keep queue-management engines fed at line rate. Because networking systems often run 24/7 at elevated ambient temperatures, verify the device's approved operating temperature range and derate speed accordingly. Using a common footprint also lets one line-card PCB accept multiple SK Hynix speed bins based on cost and availability.
Recommandé
FPGA-Based Processing and Prototyping Systems
FPGA designs for image processing, test instrumentation, and acceleration frequently require gigabyte-scale working memory; the H5ANAG8NCMR-VKI connects directly to FPGA hard DDR4 memory controllers. The x8 organization simplifies data-bus mapping to 72-bit ECC interfaces (eight devices plus one ECC device), and 2666 Mbps matches the validated upper-rate operating points of common FPGA DDR4 PHYs. During bring-up, engineers must execute the full DDR4 training sequence - write leveling, read centering, write/read DQS gating, and VREF training - which the on-die termination and differential clocking of this device support. The 16Gb density allows an 8GB buffer bank with only nine components, keeping the FPGA board layout compact and routing lengths matched.
Recommandé
Industrial Gateways and Edge AI Systems
Edge AI gateways running vision inference and data logging benefit from the H5ANAG8NCMR-VKI's combination of 16Gb density and DDR4 bandwidth, which supports frame buffers for multiple camera streams and model weight storage in DRAM. Four soldered-down x8 components provide 8GB with low memory power draw, important for passively cooled edge enclosures. The 2666 Mbps rate supplies the headroom needed for real-time pre-processing pipelines, while bank-group parallelism smooths bursty DMA traffic from capture and accelerator IPs. Designers should validate sustained bandwidth under mixed read/write loads and confirm temperature ratings for the deployment environment. Choosing DDR4 components like this part also keeps the design on a mature, multi-source supply chain rather than scarce DDR5.
Recommandé
Medical Imaging and Instrumentation
Medical imaging systems such as ultrasound, digital radiography, and lab analyzers require large image buffers with reliable, low-jitter memory; the H5ANAG8NCMR-VKI's 16Gb x8 DDR4 at 2666 Mbps fills this role with a small footprint. Eight devices form a 64-bit plus ECC data path that protects long image acquisitions against soft errors, and on-die termination maintains signal integrity on the dense multi-drop command bus typical of instrument backplanes. DDR4's lower operating voltage reduces memory subsystem heat, easing thermal design in enclosed benchtop instruments. Because medical programs have long lifecycles, the JEDEC-standard DDR4 footprint allows second-sourcing across SK Hynix grades and Micron equivalents without PCB redesign over the product's service life.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour H5ANAG8NCMR-VKI — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | H5ANAG8NCMR-XNI | H5ANAG8NCR-VKC | MT40A2G8AG-062E |
|---|---|---|---|---|
| Brand | SK Hynix | SK Hynix | SK Hynix | Micron Technology |
| Package | FBGA (DDR4 x8, JEDEC standard ballout) | FBGA - same footprint | FBGA - same footprint | FBGA - same JEDEC footprint |
| Memory Size | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Organization | x8 | x8 | x8 | x8 |
| Technology | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM |
| Speed Grade | -VKI (2666 Mbps class) | -XNI (2666-class bin) | -VKC (2666-class bin) | -062E (2666-class bin) |
| Lifecycle Status | Active | Active | Active | Active |
Principaux différenciateurs
- 16Gb density halves IC count per gigabyte (vs H5AN8G8NCJR-VKI)
- Multi-bin same-footprint family for cost/supply tuning (vs H5ANAG8NCMR-XNI)
- JEDEC-standard cross-brand second source (vs MT40A2G8AG-062E)
Notes de conception
At 2666 Mbps, DDR4 signal integrity depends on fly-by address/command routing with per-DIMM or per-device ODT, matched-length data groups (skew within controller spec, typically a few picoseconds per mm rule of thumb), and solid reference planes. Route each byte lane over an unbroken ground reference, and terminate VTT with bulk plus high-frequency decoupling near the termination rail. Run the full training sequence (write leveling, read centering, VREF training) at the target frequency rather than assuming datasheet timings alone guarantee margin.
DDR4 operates from separate VDD, VDDQ, and VPP rails with VTT termination at VDDQ/2. Estimate per-device current from the controller's bandwidth profile - 16Gb x8 at 2666 Mbps can draw appreciable peak current during bank-group interleaved bursts, so size the VTT regulator and bulk capacitance for worst-case simultaneous read/write patterns, not average throughput. Verify actual VDD/VDDQ values and current figures against the SK Hynix datasheet before finalizing the power tree; the retrieved data did not include explicit rail specifications.
Soldered-down DDR4 is not upgradeable: choose the 16Gb H5ANAG8NCMR-VKI upfront if there is any chance of needing 8GB from four chips. Second, speed-bin suffixes (V/X/U/R codes) encode both speed and temperature/grade attributes - never substitute a lower bin and assume the same operating frequency. Finally, when qualifying the Micron MT40A2G8AG-062E cross-brand, re-verify output driver strength, ODT settings, and AC timings against both vendors' datasheets, since JEDEC pin compatibility does not guarantee identical electrical behavior.
Informations de conformité
Compliance status not stated in retrieved distributor snippets; request RoHS/REACH certificates from SK Hynix or distributor before compliance-critical use.
