H5CG46MEBDX017N - 16Gb DDR5 4800Mbps DRAM | SK hynix
MPN: H5CG46MEBDX017N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.8 | $5.80 |
| 10 | $5.35 | $53.50 |
| 100 | $4.85 | $485.00 |
| 500 | $4.45 | $2,225.00 |
| 1,000 | $4.1 | $4,100.00 |
Drop-in alternatives for H5CG46MEBDX017N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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H5CG46MEBDX015N
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View Datasheet →H5CG46MEBDX017N Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM |
| Density | 16 Gbit |
| Organization | 1G x 16 |
| Data Rate | 4800 Mbps/pin |
| Speed Grade | DDR5-4800 |
| VDD Supply Voltage | 1.1 V |
| VDDQ Supply Voltage | 1.1 V |
| Interface Type | DDR5 (synchronous, double data rate) |
| Package Type | FCBGA (flip-chip ball grid array) |
| Mounting Type | Surface Mount |
| On-Die ECC | Yes (DDR5 standard feature) |
| Bank Groups | DDR5 architecture (8 bank groups) |
| Part Family | H5CG46 series |
| Manufacturer Status | MP (mass production) |
H5CG46MEBDX017N fcbga (flip-chip ball grid array) Pin Configuration Guide
Complete pinout information for H5CG46MEBDX017N (fcbga (flip-chip ball grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5CG46MEBDX017N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5CG46MEBDX017N is suitable for 6 applications: PC Main Memory (UDIMM/SODIMM Modules), Industrial Controllers and Automation, Embedded Computing Modules (COM/SoM), Networking and Communication Equipment, Storage and SSD Controller Buffering, Embedded Logging and Firmware Systems.
PC Main Memory (UDIMM/SODIMM Modules)
The H5CG46MEBDX017N is a JEDEC-standard DDR5 component designed for desktop and notebook main-memory modules. Its 16 Gbit density in x16 organization allows module builders to reach 16 GB on a UDIMM with eight x16 devices or to build high-capacity SODIMMs for laptops. At 4800 Mbps/pin, it meets the DDR5-4800 profile used by current Intel and AMD client memory controllers, and the 1.1 V rail combined with on-module PMIC keeps power within client thermal budgets. SK hynix developed the industry's first JEDEC-compliant DDR5 DRAM, making this family a first-choice component for module ODMs. Devices are mounted on the fly-by address/command bus with per-byte data lanes; the on-die ECC improves module-level reliability versus DDR4 at the same density.
Recommended
Industrial Controllers and Automation
Industrial controllers, PLCs, and factory-automation compute modules need dependable, high-bandwidth main memory with long lifecycle support. The H5CG46MEBDX017N provides 16 Gbit of DDR5 in a compact FCBGA footprint, and its x16 organization allows 16-bit or 32-bit buses that simplify layout on space-constrained controller boards. The 1.1 V supply reduces heat inside sealed industrial enclosures, and DDR5's on-die ECC raises data integrity for process-critical logging and control loops. Its mass-production status and wide distribution channel availability (tens of thousands of pcs in distributor stock per Octopart data) support multi-year procurement programs. Designers should verify the industrial temperature range requirement against the datasheet speed/temperature tables before qualification.
Recommended
Embedded Computing Modules (COM/SoM)
Computer-on-Module and System-on-Module vendors use x16 DDR5 components like the H5CG46MEBDX017N on soldered-down memory designs where SODIMM sockets are impractical. The FCBGA package supports standard SMT reflow on the carrier board or module PCB, and the 1G x 16 organization lets a COM pair four devices for a 64-bit bus at 16 GB capacity or two devices for a cost-optimized 32-bit bus. At DDR5-4800 the bus provides the bandwidth needed for edge AI inference and video pipelines in embedded platforms. The 1.1 V VDDQ rail simplifies power-tree design with common buck regulators. DDR5 training is handled by the host SoC memory controller during boot, with mode-register programming per the SK hynix device operation document.
Recommended
Networking and Communication Equipment
Switches, routers, and 5G baseband cards rely on large, fast main memory for packet buffering, route tables, and control-plane software. The H5CG46MEBDX017N supplies 16 Gbit per device at 4800 Mbps, and multiple devices populate to reach the 8 GB to 32 GB capacities typical of access and aggregation equipment. DDR5's eight bank groups allow concurrent access that improves effective bandwidth for the mixed read/write traffic patterns in network workloads, while on-die ECC protects against soft errors in always-on telecom environments. The 1.1 V rail reduces the power budget in fanless outdoor and edge-network hardware. High-speed routing should follow DDR5 fly-by topology with strict length matching on data byte lanes.
Recommended
Storage and SSD Controller Buffering
Enterprise SSDs and storage controllers use DRAM for FTL (flash translation layer) mapping tables and write buffering, where capacity per watt matters. The H5CG46MEBDX017N offers 16 Gbit in a single x16 device, letting a controller attach a 32-bit bus with just two packages, saving board area inside 2.5-inch, M.2, and U.2 form factors. At DDR5-4800 the interface keeps mapping-table updates from becoming the bottleneck on high-IOPS NVMe designs. The 1.1 V operation lowers the drive's idle power, which is a key metric for datacenter TCO, and on-die ECC complements controller-level ECC schemes for end-to-end data protection. DRAM-less designs can also use this component in hybrid caching tiers.
Recommended
Embedded Logging and Firmware Systems
Data loggers, gateways, and firmware-heavy embedded systems need working memory for boot code execution, runtime logging, and analytics buffers. The H5CG46MEBDX017N's 16 Gbit capacity accommodates Linux-class firmware with headroom for logging and telemetry accumulation, while the x16 organization minimizes component count on cost-sensitive boards. DDR5-4800 bandwidth accelerates firmware decompression and OTA update staging compared to DDR4-based predecessors, and the low 1.1 V rail suits battery-backed and energy-harvesting logging nodes. The part's mass-production lifecycle status from SK hynix supports the long design-in windows typical of logging and metering products, which often ship for a decade after launch.
Recommended
Recommended Products Summary
Engineering reference data for H5CG46MEBDX017N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5CG46MEBDX015N | H5CG46AGBDX017N | H5CG46AGBDX017 | H5CG46AGBDX015 |
|---|---|---|---|---|---|
| Package | FCBGA | FCBGA - same | FCBGA - same | FCBGA - same | FCBGA - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit |
| Organization | 1G x 16 | 1G x 16 | 1G x 16 | 1G x 16 | 1G x 16 |
| Data Rate | 4800 Mbps/pin | 4800 Mbps/pin | 5600 Mbps/pin | 5600 Mbps/pin | 5600 Mbps/pin |
| Supply Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Lifecycle Status | Active (MP) | [DATA_NEEDED] | Active | [DATA_NEEDED] | [DATA_NEEDED] |
| Unit Price (qty 1, as of 2026-09-05) | $5.80 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- DDR5-4800 speed bin at lowest family cost (vs H5CG46AGBDX017N)
- Identical die as alternate test bins for dual sourcing (vs H5CG46MEBDX015N)
- x16 organization minimizes component count (vs H5CG48MEBDX014N (x8))
Design Notes
At 4800 Mbps/pin, DDR5 data strobes (DQS) and data lines require precise length matching - typically within +/-25 mil intra-byte-lane skew on standard FR-4. Use fly-by routing for address/command lines with series termination per the SK hynix DDR5 design guide, and configure on-die termination (ODT) values via mode registers MR11/MR22 through memory-controller training. Simulate eye diagrams at the package ball level including the FCBGA via transitions, since flip-chip interconnects introduce low but non-zero inductance that affects SI margins at the DDR5-4800 operating point.
The H5CG46MEBDX017N operates from 1.1 V VDD/VDDQ rails. Decouple each device with a network of low-ESR ceramic capacitors (mix of 100 nF and 10 uF) placed within 2-3 mm of the ball exits, plus bulk capacitance per the platform PDN design. Estimate peak current: at 4800 Mbps x 16 lanes with toggling rates typical of DDR5, per-device peak current can reach several hundred mA during bursts, so design the 1.1 V buck regulator and its layout for transient response. Unlike DDR4, DDR5 moves PMIC functions to the module - component-level designs must supply clean 1.1 V directly.
Do not assume all suffix variants are interchangeable without checking the speed bin: H5CG46AGBDX017N parts are DDR5-5600 while this MEBD part is DDR5-4800, and mixing bins on the same bus forces the whole channel to the slowest device's timing. Also verify the host memory controller supports DDR5 training and mode-register programming for this generation of die. Procurement teams should confirm suffix compatibility (015N vs 017N test bins) with their controller vendor's memory support list before qualifying alternate SK hynix suffixes for volume production.
Compliance Information
Verified web data does not include explicit RoHS/REACH/environmental certificates for this MPN. SK hynix DDR5 production parts are generally RoHS-compliant and lead-free as standard practice, but confirm via manufacturer material declaration before procurement sign-off.
