H5AN8G8NAFR-PBC - 8Gb DDR4 SDRAM x8 1.2V | SK hynix
MPN: H5AN8G8NAFR-PBC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.2 | $3.20 |
| 10 | $2.95 | $29.50 |
| 100 | $2.7 | $270.00 |
| 500 | $2.45 | $1,225.00 |
| 1,000 | $2.2 | $2,200.00 |
Drop-in alternatives for H5AN8G8NAFR-PBC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5AN8G8NAFR-TFC
✅ Drop-In📋 Reference alternative (not in catalog)
H5AN8G8NAFR-UHC
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →H5AN8G8NMFR-TFC
✅ Drop-In📋 Reference alternative (not in catalog)
MT40A1G8AG-062E
✅ Drop-In✓ In Stock
$3.1 / Unit
View Datasheet →K4A8G085WC-BCTD
✅ Drop-In✓ In Stock
$50.85 / Unit
View Datasheet →H5AN8G8NAFR-PBC
✅ Drop-In✓ In Stock
$2.2 / Unit
View Datasheet →H5AN8G8NAFR-PBC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 8 Gb |
| Organization | 1G x 8 |
| Supply Voltage | 1.2 V |
| Package | FBGA-78 |
| Mounting Type | Surface Mount |
| Interface | DDR4 (double data rate, synchronized to clock) |
| Address Inputs | A0 - A17 (A10/AP, A12/BC_n, RAS_n/A16, CAS_n/A15, WE_n/A14 multiplexed) |
| Connectivity Test Mode | TEN (optional input on x4/x8, required on x16) |
| Process Technology | CMOS |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| RoHS Status | Compliant |
| Datasheet Revision | Rev. 1.2 / July 2017 |
H5AN8G8NAFR-PBC fbga-78 Pin Configuration Guide
Complete pinout information for H5AN8G8NAFR-PBC (fbga-78 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5AN8G8NAFR-PBC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5AN8G8NAFR-PBC is suitable for 6 applications: PC and Workstation Main Memory (UDIMM/SODIMM), Server Memory Modules (RDIMM/LRDIMM), Embedded and Industrial Computing, Networking and Telecom Equipment, Set-Top Boxes and Smart Home Hubs, Test, Measurement, and Data Acquisition Systems.
PC and Workstation Main Memory (UDIMM/SODIMM)
The H5AN8G8NAFR-PBC is a natural fit for consumer and workstation DRAM modules, where its 8Gb-per-chip density lets a single-rank 8 GB UDIMM use only eight chips (or sixteen for 16 GB). Its 1.2V supply cuts module power roughly in half compared with an equivalent DDR3 design, directly reducing DIMM thermal load and enabling fanless SODIMM designs in mini PCs and notebooks. In module designs the x8 organization gives per-byte-lane granularity that aligns one chip per DQ lane, simplifying SPD configuration, ECC-free UDIMM layouts, and rank interleaving. The JEDEC FBGA-78 footprint also lets module makers dual-source Micron MT40A1G8AG or Samsung K4A8G085WC equivalents without PCB respin, which is critical for high-volume module production.
Recommended
Server Memory Modules (RDIMM/LRDIMM)
In server RDIMMs, density per chip drives maximum capacity per DIMM and per channel. Using the 8Gb H5AN8G8NAFR-PBC allows 16 GB RDIMMs built from 18 chips (16 data plus buffer/SPD support on x8 organization), and 8Gb-class chips are the building blocks for the mainstream 32 GB per-DIMM configurations in dual-socket servers. DDR4's bank-group architecture and DBI support reduce command bus contention and improve signal integrity at high data rates across heavily loaded server channels. Because the part shares the JEDEC FBGA-78 ballout with Micron and Samsung equivalents, server ODMs qualify all three sources against the same PCB, and the registered buffer (e.g., RCD companion ICs) handles command/address fan-out and parity checking across the high chip count.
Recommended
Embedded and Industrial Computing
Industrial PCs, machine-vision controllers, and edge-compute gateways use DDR4 controllers from x86 or ARM SoCs paired with discrete DDR4 components like the H5AN8G8NAFR-PBC. Its 8Gb density in one package suits designs needing 2-8 GB of working memory (two to eight chips) without moving to stacked memory-down LPDDR solutions, keeping BOM cost low and allowing socketed/repairable designs. The 1.2V rail simplifies power-tree design with standard DDR4 PMICs and termination regulators, and the RoHS-compliant, lead-free, halogen-free construction aligns with industrial environmental requirements. Designers should verify the SoC's memory training tables include the Hynix AFR die or use flexible DDR4 PHY training to accept the speed bin of the -PBC suffix.
Recommended
Networking and Telecom Equipment
Routers, switches, and network-attached processors buffer large packet flows in external DDR4 memory, and the H5AN8G8NAFR-PBC's combination of 8Gb density and x8 organization supports the 1-4 GB buffering pools typical in managed switches and SD-WAN appliances. DDR4's high bandwidth (double-data-rate transfers on both clock edges with bank-group interleaving) sustains line-rate packet buffering, while 1.2V operation lowers the thermal budget of fanless telecom hardware. The TEN (connectivity test) mode noted in the SK hynix datasheet aids board-level ball-connection verification during ICT and production test, valuable on high-layer-count network boards. The JEDEC FBGA-78 footprint supports multi-sourcing against Micron and Samsung DDR4 equivalents to protect networking product roadmaps from DRAM allocation.
Recommended
Set-Top Boxes and Smart Home Hubs
Advanced set-top boxes, Android TV platforms, and smart-home hubs run Linux-based middleware stacks that need 1-2 GB of DRAM, which the H5AN8G8NAFR-PBC delivers with just one or two chips in memory-down layouts. The 1.2V DDR4 supply suits always-on consumer devices where standby power regulations apply, and the compact FBGA-78 package fits dense main-board layouts alongside the SoC. Because consumer platforms ship in very high volumes, the ability to drop in the SK hynix TFC/UHC speed-bin variants or the pin-compatible Micron/Samsung equivalents without PCB changes is a decisive sourcing advantage. Firmware teams must ensure the bootloader's DDR4 training covers the Hynix AFR die and the chosen -PBC speed bin.
Recommended
Test, Measurement, and Data Acquisition Systems
Bench instruments, logic analyzers, and high-speed data-acquisition cards capture large sample streams into DRAM, and the H5AN8G8NAFR-PBC's 8Gb capacity per chip enables deep capture buffers (e.g., 4 GB using four chips) at mainstream commodity cost. DDR4's double-data-rate interface and bank-group architecture provide the sustained write bandwidth needed to keep pace with multi-gigasample ADC front ends, while the x8 organization pairs cleanly with FPGA memory controllers implementing per-lane DQS calibration. The TEN connectivity-test input supports manufacturing test of the dense FBGA solder joints on multilayer instrument boards. Instruments benefit from the multi-source FBGA-78 footprint, allowing memory upgrades or supply changes without redesigning the capture subsystem.
Recommended
Recommended Products Summary
Engineering reference data for H5AN8G8NAFR-PBC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5AN8G8NAFR-TFC | H5AN8G8NAFR-UHC | H5AN8G8NMFR-TFC | MT40A1G8AG-062E | K4A8G085WC-BCTD |
|---|---|---|---|---|---|---|
| Package | FBGA-78 | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | Micron Technology | Samsung Electronics |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 1G x 8 | 1G x 8 | 1G x 8 | 1G x 8 | 1G x 8 | 1G x 8 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Bin | -PBC [DATA_NEEDED: data rate] | -TFC bin | -UHC bin | -TFC bin (MFR die) | -062E bin | BCTD bin |
| RoHS / Lead-Free | Compliant / Lead-free, halogen-free | Compliant (family datasheet) | Compliant (family datasheet) | Compliant | [DATA_NEEDED] | [DATA_NEEDED] |
| Die Generation | AFR (NAFR) | AFR (NAFR) | AFR (NAFR) | MFR (newer die) | Micron DDR4 8Gb | Samsung DDR4 8Gb |
Key Differentiators
- Original AFR-die SK hynix 8Gb part with documented 45-page datasheet (vs H5AN8G8NMFR-TFC)
- JEDEC FBGA-78 footprint enables seamless dual-sourcing (vs MT40A1G8AG-062E)
- 1.2V DDR4 operation versus DDR3 predecessors (vs H5AN8G8NMFR-TFC)
Design Notes
DDR4 routing for the H5AN8G8NAFR-PBC must follow JEDEC fly-by topology on address/command/control with VTT termination, and length-matched DQ/DQS routing per byte lane within tight intra-pair and inter-lane skew budgets. DQS_t/DQS_c differential pairs need matched length and solid reference planes. Address nets carrying multiplexed functions (A10/AP, A12/BC_n, RAS_n/A16, CAS_n/A15, WE_n/A14 per the datasheet) must meet address-bus setup/hold, not just static timing. On DIMM designs, follow the JEDEC module design guide rather than point-to-point rules.
Provide separate 1.2V VDD and VDDQ rails (typically from a DDR4 PMIC with a VTT termination regulator for the fly-by bus). Estimated: a 1 GB module of eight H5AN8G8NAFR-PBC chips draws a few watts at full bandwidth - size the regulator and copper pour using the datasheet IDD currents at the -PBC speed bin rather than generic DDR4 values. Decouple VDD/VDDQ with bulk plus high-frequency ceramics close to each ball, and keep the VTT rail capable of sourcing and sinking termination current dynamically.
The most common failure with commodity DDR4 substitutions is memory-controller training data: firmware bootloaders (U-Boot, BIOS reference code) often carry per-die training tables. When swapping in H5AN8G8NMFR (MFR die), H5AN8G8NAFR-TFC/-UHC speed bins, or Micron/Samsung equivalents, re-run memory training and update SPD EEPROM contents. Also confirm the -PBC bin data rate against controller limits - a controller validated only at lower bins may fail at higher AC timing. Finally, source from authorized channels with traceability; commodity DRAM is a frequent target of remarketed/recycled parts.
Compliance Information
SK hynix datasheet explicitly describes the part as Lead-Free & Halogen-Free (RoHS Compliant). REACH and conflict-minerals declarations should be requested from SK hynix or the distributor for current certificates.
