H5AN8G6NCJR-VKC - 8Gb DDR4 SDRAM 2666Mbps FBGA-96 | SK Hynix
MPN: H5AN8G6NCJR-VKC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.34 | $42.34 |
| 10 | $40.22 | $402.20 |
| 100 | $38.11 | $3,811.00 |
| 500 | $36.2 | $18,100.00 |
| 1,000 | $35.16 | $35,160.00 |
Drop-in alternatives for H5AN8G6NCJR-VKC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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✅ Drop-In📋 Reference alternative (not in catalog)
H5AN8G6NCJR-VKC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Size | 8 Gbit |
| Memory Organization | 512M x 16 |
| Data Rate | 2666 Mbps (MT/s) |
| Clock Frequency | 1.333 GHz |
| Supply Voltage (VDD) | 1.14 V to 1.26 V |
| Interface | Parallel |
| Operating Temperature | 0C to +95C |
| Package | FBGA-96 |
| Mounting Type | Surface Mount |
| Standby Current | 28 mA |
| Operating Current | 45 mA |
| Features | Auto self-refresh, auto precharge, asynchronous reset, data mask, write leveling, CRC, dynamic ODT, ZQ calibration |
| Lead-Free / Halogen-Free | Yes (per datasheet description) |
| RoHS Status | Compliant |
| Lifecycle Status | Active |
H5AN8G6NCJR-VKC fbga-96 Pin Configuration Guide
Complete pinout information for H5AN8G6NCJR-VKC (fbga-96 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5AN8G6NCJR-VKC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5AN8G6NCJR-VKC is suitable for 6 applications: Embedded Industrial Computing, Networking Equipment, Set-Top Boxes and Smart TV, Automotive Infotainment (Commercial Temp), Test and Measurement Instruments, Memory Modules and SODIMM Designs.
Embedded Industrial Computing
Industrial PCs, edge controllers, and HMI platforms use the H5AN8G6NCJR-VKC as main memory because its 8Gb density and 2666 Mbps data rate deliver the bandwidth that Linux- and RTOS-class processors demand, while the 1.14V-1.26V rail keeps system power low versus DDR3. The x16 organization pairs naturally with mid-range MPUs offering 16- or 32-bit DDR controllers, letting one or two chips reach 1-2 GB without a full 64-bit bus. In a typical layout the device sits within 50-80 mm of the controller with fly-by clock/address routing and dynamic ODT handling termination. Because it is rated 0C to +95C, it suits cabinet-enclosed industrial environments; designs requiring extended cold start should validate the lower temperature limit.
Recommended
Networking Equipment
Switches, routers, and network-attached appliances rely on the H5AN8G6NCJR-VKC to buffer packets and hold control-plane code. The 2666 Mbps pin rate supports multi-gigabit line-rate buffering when combined with packet processors, and CRC plus write-leveling features maintain data integrity across the high-speed interface. A common topology mounts four to eight devices on a 64-bit or 128-bit bus, where dynamic on-die termination reduces the external termination component count versus DDR3. The 0C to +95C range fits centrally located, fan-cooled networking chassis. Designers should budget refresh overhead (about 4-6% at extended temperature) when sizing buffer depths, and verify ZQ calibration resistor placement within 10 mm of the ZQ ball per the datasheet.
Recommended
Set-Top Boxes and Smart TV
Broadcast and streaming set-top boxes use the H5AN8G6NCJR-VKC as the primary memory for SoC-based video decode platforms. Its 8Gb capacity comfortably holds dual 4K stream buffers plus an Android/Linux software stack, and the x16 interface matches the 16/32-bit DDR controllers common in consumer SoCs, minimizing chip count and cost. The 1.2V-class supply helps products meet regional standby-power regulations, and auto self-refresh lowers power during suspend states. At 2666 Mbps the shared bus sustains decode, graphics, and network traffic concurrently when the controller is configured with appropriate QoS arbitration. Board designers should length-match DQ/DQS pairs within +/-25 mils and follow the SoC vendor's DDR4 layout checklist for the fly-by address bus.
Recommended
Automotive Infotainment (Commercial Temp)
In-cabin infotainment and digital-cluster platforms with controlled temperature environments can use the H5AN8G6NCJR-VKC where its 0C to +95C range is acceptable. The 8Gb x16 device feeds SoCs driving multiple displays, and the 2666 Mbps bandwidth supports smooth graphics compositing and navigation rendering. DDR4's lower 1.2V rail reduces heat inside sealed dashboard enclosures compared with DDR3 solutions. Note that this part is not AEC-Q100 qualified per available data; production automotive programs should confirm acceptance with the OEM or select an automotive-graded SKU. Layout guidance includes keeping the memory within 60 mm of the SoC, using solid reference planes for DQ routing, and enabling the asynchronous RESET# function so the cluster recovers cleanly from crank-related supply transients.
Recommended
Test and Measurement Instruments
Bench instruments, data-acquisition units, and logic analyzers use the H5AN8G6NCJR-VKC to hold long capture buffers and run embedded analysis software. The 8Gb density enables deep sample memory, while the 2666 Mbps interface keeps DMA transfers from becoming the acquisition bottleneck. CRC and write-leveling features improve capture integrity at speed, which matters when customers compare waveform fidelity across instruments. The device's asynchronous reset supports deterministic recovery after firmware faults, and dynamic ODT simplifies multi-load buses when two to four devices share a 64-bit controller. Designers should verify refresh scheduling against real-time capture deadlines and decouple each VDD ball group with at least 0.1 uF plus bulk capacitance to suppress current transients during burst writes.
Recommended
Memory Modules and SODIMM Designs
Custom SODIMMs and soldered-down memory mezzanines built around the H5AN8G6NCJR-VKC benefit from the JEDEC-standard x16 FBGA-96 ball map, which is shared across SK Hynix, Samsung, and Micron DDR4 x16 components, enabling multi-sourcing on one PCB footprint. A typical 64-bit module uses eight x16 devices for 8 GB total; down-populating four devices yields a 4 GB option on the same board. The 2666 Mbps grade supports mainstream DDR4-2666 host platforms, and the 0C to +95C range covers office and light-industrial module environments. For module designs, follow JEDEC reference layout rules for fly-by CA routing, series termination on clock nets, and per-device ZQ resistors; the data-mask function supports write masking on module-level controllers that require it.
Recommended
Recommended Products Summary
Engineering reference data for H5AN8G6NCJR-VKC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5AN8G6NCJR-UHC | H5AN8G6NCJR-RDC | H5AN8G6NCJR-PBC | H5AN8G8NCJR-VKI | K4A8G165WB-BCRC |
|---|---|---|---|---|---|---|
| Package | FBGA-96 | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | Samsung Electronics |
| Memory Size | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 1G x 8 | 512M x 16 |
| Data Rate | 2666 Mbps | [DATA_NEEDED: UHC speed grade value] | [DATA_NEEDED: RDC speed grade value] | [DATA_NEEDED: PBC speed grade value] | 2666 Mbps | 2666 Mbps |
| Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
| Operating Temperature | 0C to +95C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| ECC Support (x8 for sideband ECC) | No (x16 uses data mask) | No (x16) | No (x16) | No (x16) | Yes (x8 organization) | No (x16) |
Key Differentiators
- Fast 2666 Mbps speed grade with wide distributor availability (vs H5AN8G6NCJR-PBC)
- x16 organization minimizes chip count (vs H5AN8G8NCJR-VKI)
- JEDEC-standard footprint enables Samsung second source (vs K4A8G165WB-BCRC)
Design Notes
At 2666 Mbps, DDR4 routing discipline is non-negotiable: route DQ/DQS/DM as length-matched groups (typical spec +/-10 mils intra-byte, DQS to its DQ group within +/-25 mils), and use fly-by topology for clock/address/command with 30-60 ohm controlled impedance. Enable write leveling and dynamic ODT in the controller; the H5AN8G6NCJR-VKC supports both per its feature list. Keep the ZQ calibration resistor (240 ohm, 1%) within 10 mm of the ZQ ball with a direct ground return. Simulate with IBIS models from SK Hynix before finalizing stackup.
The device runs from a 1.14V-1.26V VDD rail with typical standby current of 28 mA and operating current of 45 mA per distributor data, but burst activity produces fast current transients. Estimated: for an 8-chip x16 bus peaking near 1 A total, a PDN targeting under 30 mV ripple requires bulk capacitance of roughly 100-330 uF (polymer or MLCC mix) plus at least one 0.1 uF MLCC per VDD ball group placed within 2 mm. Verify the VRM meets the DDR4 controller's load-line requirement and sequence VPP/VDD per the JEDEC power-up ramp spec in the datasheet.
Common substitution mistakes: (1) assuming the x16 H5AN8G6NCJR-VKC directly replaces an x8 H5AN8G8NCJR - the 96-ball footprint matches but ball functions differ by JEDEC organization, so nets must be re-verified; (2) forgetting the asynchronous RESET# pin, which must be asserted during power ramp or the device may not initialize; (3) ignoring refresh overhead at high operating temperature - plan controller scheduling for tREFI changes above 85C. Always confirm the speed-grade suffix code matches your controller's configured timing table before assembly.
Compliance Information
Datasheet description on ALLDATASHEET states Lead-Free & Halogen-Free; JLCPCB listing marks ROHS compliant. REACH and conflict-minerals status not stated in provided data.
