H58G46AK6PX033N - LPDDR5 16Gb 6400Mbps Automotive DRAM | SK hynix
MPN: H58G46AK6PX033N ✓ Active| Qty | Unit Price | Extended |
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H58G46AK6PX033
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View Datasheet →H58G46BK6PX033
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H58G46AK6PX033N Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5 SDRAM |
| Density | 16 Gb (2 GB) |
| Organization | x16 |
| Data Rate | 6400 Mbps/pin |
| Interface Standard | JEDEC LPDDR5 |
| VDD2 Supply Voltage | 1.8 V |
| VDDQ Supply Voltage | 1.05 V |
| VDD1 (Core) Supply Voltage | 0.5 V |
| Package | 315-ball FBGA |
| Mounting Type | Surface Mount (BGA) |
| Grade | Automotive |
| Application Domain | Mobile, automotive, industrial controllers, computing modules |
H58G46AK6PX033N 315-ball fbga Pin Configuration Guide
Complete pinout information for H58G46AK6PX033N (315-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H58G46AK6PX033N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H58G46AK6PX033N is suitable for 6 applications: Automotive ADAS Domain Controllers, Digital Cockpit and Infotainment, Edge AI Accelerator Modules, Industrial Computing Modules, Mobile and Consumer Computing, Telematics and Embedded Logging.
Automotive ADAS Domain Controllers
The H58G46AK6PX033N fits ADAS domain controllers because its 6400 Mbps/pin LPDDR5 interface delivers roughly 12.8 GB/s of peak bandwidth per component at a x16 bus width - the throughput needed to stream camera, radar, and lidar sensor data into CNN-based perception pipelines. Its automotive qualification targets the extended reliability and quality expectations of vehicle platforms, and the 2GB capacity supports frame buffering plus intermediate feature maps for multi-sensor fusion. In the memory subsystem, the component is soldered to the 315-ball FBGA footprint on a length-matched fly-by or point-to-point route to the host SoC's LPDDR5 controller, with WCK clocking and per-byte DQS strobes. The 1.05V VDDQ rail keeps I/O power low, an important consideration for thermally sealed automotive enclosures with no active cooling.
Recommended
Digital Cockpit and Infotainment
Digital cockpit SoCs drive multiple high-resolution displays and require memory bandwidth that scales with pixel throughput; the H58G46AK6PX033N's LPDDR5-6400 interface supplies approximately 12.8 GB/s per component, enough to sustain multi-display rendering plus navigation map streaming without starving the GPU. The 16Gb (2GB) density suits mid-tier cockpit platforms where several components are paired to reach 4GB-8GB total. Its automotive grade matches the cockpit's in-vehicle deployment requirements, while the 0.5V core rail and LPDDR5 power-down states reduce standby draw during ignition-off states - a key constraint for battery-protective sleep budgets. Layout-wise, the 315-ball FBGA is placed adjacent to the cockpit SoC with strict length matching on the data groups; the 1.8V VDD2 rail should be decoupled per SK hynix reference designs to suppress transients during display refresh bursts.
Recommended
Edge AI Accelerator Modules
Edge AI inference modules need high memory bandwidth in a small, power-limited envelope, and the H58G46AK6PX033N addresses exactly this: 6400 Mbps/pin over x16 gives 12.8 GB/s of bandwidth per component while LPDDR5's low 1.05V I/O swing minimizes switching power versus legacy interfaces. System designers populate two to four components beside the AI SoC to form a 4GB-8GB bank, sufficient for quantized vision and audio models with workspace buffers. The 315-ball FBGA allows stacked, near-die placement that shortens traces and improves signal integrity at 6400 Mbps. Because the device is automotive qualified, the same module design can be reused across consumer and vehicle edge-AI products. Thermal design should account for DRAM self-refresh and active-access power under sustained inference loads, typically managed with via-array heat spreading into the module PCB.
Recommended
Industrial Computing Modules
Industrial controllers and compute modules (COM Express, SMARC form factors) embed soldered LPDDR5 to eliminate connector reliability issues in vibration-heavy environments, and the H58G46AK6PX033N's automotive-qualified build exceeds typical industrial robustness expectations. Its 2GB-per-component density and 6400 Mbps rate let a 4GB module configuration serve machine-vision inspection, robotics control, and protocol-gateway workloads with headroom for containerized runtime stacks. The triple-rail scheme (1.8V / 1.05V / 0.5V) integrates cleanly with module power trees that already generate 1.8V and 1.05V rails for other silicon. During design, the module vendor should follow SK hynix's 315-ball FBGA routing guidance - controlled-impedance data groups, WCK length matching, and solid reference planes - to sustain 6400 Mbps signaling across the module connector's indirectly referenced environment.
Recommended
Mobile and Consumer Computing
In smartphones, tablets, and consumer compute devices, LPDDR5 is the dominant main-memory interface because it maximizes bandwidth per watt; the H58G46AK6PX033N provides 16Gb per component with 6400 Mbps/pin, so two to four packages deliver 4GB-8GB of RAM - the typical mid-range configuration. LPDDR5 power-management features (per-bank refresh, deep sleep modes) extend standby battery life, which is the primary differentiator versus DDR4/DDR5 in this segment. The 315-ball FBGA's fine pitch supports the compact PoP-adjacent layouts of mobile PCBs. Consumer designs without automotive requirements can also consider the same silicon in non-automotive ordering options within the H58G46AK6 family to optimize cost. Signal integrity at 6400 Mbps demands strict stackup control: 4+ layer PCBs with impedance-controlled traces and per-byte DQS tuning during controller training are standard practice.
Recommended
Telematics and Embedded Logging
Telematics control units and embedded data-logging platforms use the H58G46AK6PX033N as working memory for OTA update staging, V2X protocol stacks, and buffered sensor logging before writes to flash. The LPDDR5-6400 interface provides responsive random-access performance for protocol processing, while the 2GB capacity holds simultaneous navigation, connectivity, and logging workloads. Automotive qualification is essential here because telematics units remain powered across wide ambient temperature swings and must survive crank/partial-power conditions. Designers typically pair the DRAM with an automotive SPI NOR or NAND for persistent storage and place the 315-ball FBGA close to the telematics SoC with the 1.8V VDD2 and 1.05V VDDQ rails sequenced per the power-up requirements in the SK hynix datasheet to avoid latch-up during ignition transients.
Recommended
Recommended Products Summary
Engineering reference data for H58G46AK6PX033N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H58G46AK6PX033 | H58G46BK6PX033 |
|---|---|---|---|
| Package | 315-ball FBGA | 315-ball FBGA - same | 315-ball FBGA - same |
| Brand | SK hynix | SK hynix | SK hynix |
| Density | 16 Gb (2 GB) | 16 Gb (2 GB) | 16 Gb (2 GB) |
| Organization | x16 | x16 | x16 |
| Data Rate | 6400 Mbps/pin | 6400 Mbps/pin | 6400 Mbps/pin |
| Interface Standard | JEDEC LPDDR5 | JEDEC LPDDR5 | JEDEC LPDDR5 |
| Supply Rails | 1.8 V / 1.05 V / 0.5 V | 1.8 V / 1.05 V / 0.5 V | 1.8 V / 1.05 V / 0.5 V |
| Automotive Grade | Yes | Yes | [DATA_NEEDED] |
| Ordering Suffix Meaning | N = packaging/flow ordering variant | base part number | B-family revision code |
Key Differentiators
- Identical silicon in base part number (vs H58G46AK6PX033)
- Automotive qualification vs consumer LPDDR5 (vs Generic consumer LPDDR5 components)
- LPDDR5-6400 bandwidth efficiency (vs DDR4 automotive parts (e.g., H5CG46AGBDX015))
Design Notes
Route the LPDDR5-6400 interface with controlled impedance (approximately 40 ohm single-ended for data groups per typical LPDDR5 practice) and keep all data-group traces length-matched within the window specified in the SK hynix datasheet. Place the H58G46AK6PX033N 315-ball FBGA as close to the host SoC as the fanout allows; every millimeter of trace at 6400 Mbps increases ISI and reflection risk. Maintain solid, unbroken reference planes under all DQ/DM/DQS nets and avoid crossing plane splits.
The device requires three rails - 1.8V (VDD2), 1.05V (VDDQ), and 0.5V (VDD1 core). Sequence power-up per the SK hynix datasheet order and decouple each rail with a network of bulk plus 0.1uF/0.01uF ceramics placed at the ball escapes. The 0.5V core rail carries the highest transient current during burst accesses; size the DC-DC converter with margin and verify rail droop during controller training patterns.
Do not assume cross-brand LPDDR5 parts are drop-in: ball maps and mode-register initialization differ between SK hynix and Micron even at matched density and speed. Always re-run memory controller training and boot-time validation after any substitution, and confirm the ordering suffix (the N in H58G46AK6PX033N) matches your packaging requirement in the SK hynix ordering information table before release to production.
Compliance Information
Verified data identifies the part as automotive-grade, but specific RoHS/REACH/AEC-Q100 qualification statements were not present in the provided data.
