H5AN4G8NBJR-VKI - 4Gb DDR4 SDRAM x8 2666Mbps | SK hynix
MPN: H5AN4G8NBJR-VKI ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.95 | $2.95 |
| 10 | $2.72 | $27.20 |
| 100 | $2.45 | $245.00 |
| 500 | $2.21 | $1,105.00 |
| 1,000 | $1.98 | $1,980.00 |
Drop-in alternatives for H5AN4G8NBJR-VKI — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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H5AN4G8NBJR-VKC
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View Datasheet →H5AN4G8NBJR-VKI Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 4 Gb |
| Organization | 512M x 8 |
| Data Rate | 2666 Mbps |
| Supply Voltage | 1.2 V |
| I/O Voltage | 1.2 V (SSTL12) |
| Package | FBGA-78 |
| Mounting Type | Surface Mount |
| Speed Grade | V (2666) |
| Temperature Grade | Industrial (I suffix) |
| Architecture | CMOS, 8n prefetch, bank groups |
| Termination | On-Die Termination (ODT) |
| DBI Support | Yes (Data Bus Inversion / DM) |
H5AN4G8NBJR-VKI fbga-78 Pin Configuration Guide
Complete pinout information for H5AN4G8NBJR-VKI (fbga-78 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5AN4G8NBJR-VKI.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5AN4G8NBJR-VKI is suitable for 6 applications: Industrial PC Main Memory, Networking Switches and Routers, Server ECC DIMM Modules, Embedded ARM Compute Modules, Test and Measurement Instruments, Automotive-Adjacent Telematics and Gateways.
Industrial PC Main Memory
Industrial PCs and fanless embedded controllers require DRAM that survives wide ambient temperatures and long product lifecycles. The H5AN4G8NBJR-VKI fits because the -I suffix denotes industrial temperature qualification within SK hynix's H5AN4G8NBJR family, while its 4Gb x8 organization and 2666 Mbps data rate provide mainstream memory bandwidth for x86 and ARM compute modules. Soldered-down FBGA-78 DRAM also resists vibration better than DIMM sockets, a common requirement in factory automation and transportation computing. Designers typically populate two to four chips per CPU memory channel in x8 mode, enabling ECC when paired with controllers supporting 72-bit buses. The 1.2V supply keeps memory power draw low in passively cooled enclosures, though designers must validate junction temperature at worst-case ambient using the datasheet thermal data.
Recommended
Networking Switches and Routers
Enterprise and carrier networking equipment uses DDR4 SDRAM for packet buffers, routing tables, and management-plane software. The H5AN4G8NBJR-VKI aligns with this role: 2666 Mbps per pin delivers the bandwidth that network processors and ARM control CPUs expect, and the x8 organization supports ECC-capable memory buses that protect forwarding tables from soft errors during continuous operation. Because network gear runs 24/7 in controlled but sometimes non-climate-controlled closets, the industrial temperature grade adds margin. Designs commonly place eight or nine FBGA-78 chips around a switch ASIC or network processor in fly-by DDR4 topology with on-die termination handling reflected-wave signaling. The stability of a mature, multi-source JEDEC DDR4 footprint also simplifies second-sourcing across the product's multi-year deployment life.
Recommended
Server ECC DIMM Modules
Server memory modules built on 4Gb DDR4 x8 die remain relevant for legacy platform maintenance and replacement DIMM production. In an ECC registered DIMM, each x8 chip supplies one byte-lane of a 72-bit word, so H5AN4G8NBJR-VKI's 512M x 8 organization is precisely the standard ECC granularity. Its 2666 Mbps speed grade matches DDR4-2666 server platforms, and industrial qualification improves module-level yield over temperature cycling during burn-in. Module designers mount the die on both PCB sides with fly-by CA routing, per-rank termination, and a register/PMIC pair controlling the command bus and 1.2V rail distribution. Because the DRAM itself is soldered on the module, footprint-level drop-in compatibility with the VKC/UHI siblings gives module makers speed-bin flexibility using a single PCB revision.
Recommended
Embedded ARM Compute Modules
System-on-module (SOM) and single-board computer vendors use soldered DDR4 for Linux-class ARM processors such as NXP i.MX, TI Sitara, and Rockchip parts. The H5AN4G8NBJR-VKI's 4Gb density and 2666 Mbps rate match typical 32-bit LP-heavy or 64-bit DDR4 controllers, while 1.2V operation meets module power budgets of a few watts total. x8 organization allows one or two chips for 512 MB or 1 GB configurations with optional ECC on supporting SoCs. The FBGA-78 footprint's ~0.8 mm ball pitch fits the fine-pitch, high-density layouts SOMs require, and industrial temperature rating supports edge deployments in uncontrolled environments. Firmware teams must implement DDR4 initialization, training, and ODT calibration for the specific speed grade; SK hynix programming sequences in the H5AN4GxNBJR datasheet govern bring-up.
Recommended
Test and Measurement Instruments
Oscilloscopes, logic analyzers, and signal generators buffer large acquisition datasets into DDR4 memory between the acquisition front-end and the analysis processor. The H5AN4G8NBJR-VKI contributes 4Gb per chip with 2666 Mbps bandwidth; arrays of eight to sixteen chips achieve the multi-GB, multi-GB/s buffering such instruments need. Instrument environments are typically lab-condition, so the industrial grade adds reliability margin rather than being mandatory; commercial VKC units can reduce cost in benchtop lines while the VKI serves portable field instruments. DDR4's bank-group architecture sustains the sequential burst-heavy traffic pattern of streaming acquisition, and x8 lanes map cleanly onto FPGA memory controllers from Xilinx and Intel that provide hardened DDR4 PHYs, shortening bring-up for instrument design teams.
Recommended
Automotive-Adjacent Telematics and Gateways
Telematics units, fleet gateways, and infotainment head units outside the strict safety domain still need soldered DDR4 that tolerates -40C cold starts and hot cabins. The H5AN4G8NBJR-VKI's industrial qualification and 1.2V rail suit these quasi-automotive designs where full AEC-Q100 DDR4 is not mandated but robustness is expected. Its 4Gb capacity comfortably hosts Linux-based gateway stacks, and 2666 Mbps supports SoCs driving displays and multiple network interfaces. Designers derate junction temperature for under-hood-adjacent mounting, choose x8 ECC-capable organizations to protect navigation state, and leverage the FBGA-78 footprint shared with the VKC/UHI family members for dual sourcing. DDR4 driver support is mature across automotive-grade SoC vendors, minimizing software risk when selecting this standard JEDEC part.
Recommended
Recommended Products Summary
Engineering reference data for H5AN4G8NBJR-VKI — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5AN4G8NBJR-VKC | H5AN4G8NBJR-UHI | H5AN4G8NBJR-UHC | H5AN4G8NBJR-PBC |
|---|---|---|---|---|---|
| Package | FBGA-78 | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Max Data Rate | 2666 Mbps | 2666 Mbps | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Grade | Industrial (I) | Commercial (C) | Industrial (I) | Commercial (C) | Commercial (C) |
| Lifecycle Status | Active | Active | Active | Active | Active |
Key Differentiators
- Industrial temperature qualification (vs H5AN4G8NBJR-VKC)
- Top speed bin of the NBJR family (vs H5AN4G8NBJR-PBC)
- x8 organization enabling ECC (vs H5AN8G6NDJR-XNC)
Design Notes
At 2666 Mbps, route the command/address bus in fly-by topology with VTT termination, and match each DQ byte lane to its DQS/DQS# strobe pair within the skew budget defined by the H5AN4GxNBJR datasheet timing parameters. Use ~40-ohm single-ended trace impedance, reference all DDR4 signals to an unbroken ground plane, and avoid routing near switching rails. Run SI simulation with the SK hynix IBIS models at the V speed grade corner to confirm eye margins before tape-out.
The H5AN4G8NBJR-VKI runs on a 1.2V rail shared between VDD and VDDQ. Estimated: at DDR4-2666 typical current for a 4Gb x8 die under read-heavy traffic is on the order of several hundred mA peak, so plan the 1.2V regulator with headroom and bulk capacitance near each DRAM plus 0.1 uF per power ball pair. Include a precision ZQ calibration resistor (240 ohm 1%) with a clean local ground for ODT/output driver calibration accuracy.
Do not swap -VKI for a different speed-grade sibling (UHI, RDC, PBC) without confirming the memory controller supports that bin's CAS latency and timing register set; a P-grade part will not reliably close timing at DDR4-2666. Also verify board-level ECC configuration assumes x8 devices - x16 die such as H5AN8G6NDJR are not pin-compatible despite the same family branding. Always re-run DRAM training after any BOM substitution.
Keep the FBGA-78 land pattern per JEDEC MO-207 and place decoupling capacitors on the far side directly under the ball field to minimize loop inductance. Estimated: keep DQ/DQS trace lengths matched within 25 mils per byte lane for DDR4-2666 on FR-4. Provide thermal relief through the PCB copper; DRAM junction temperature limits assume airflow or board conduction as specified in the datasheet thermal section.
Compliance Information
Compliance status was not stated in the retrieved web data; consult the SK hynix product compliance portal for RoHS/REACH declarations for H5AN4G8NBJR-VKI.
