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Samsung Electronics

K6X4008C1F-MF55 - 512Kx8 4Mbit 55ns SRAM | Samsung

MPN: K6X4008C1F-MF55 βœ— End of Life
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5 V Vdss [DATA_NEEDED: typical active current] Id TSOP2-32 (0.400 inch, REVERSE) Package SRAM - Asynchronous Memory
From $2.7 USD / Unit
MOQ: 1 |
Price updated: 2026-09-01
Volume Pricing
Qty Unit Price Extended
1 $4.5 $4.50
10 $4.05 $40.50
100 $3.6 $360.00
500 $3.15 $1,575.00
1,000 $2.7 $2,700.00
ℹ️ All prices are in USD

Drop-in alternatives for K6X4008C1F-MF55 β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

K6X4008C1F-UF55

βœ… Drop-In
πŸ“¦ TSOP2-32 REVERSE
same family, same 55 ns speed and 512Kx8 organization; different operating temperature range suffix

πŸ“‹ Reference alternative (not in catalog)

K6X4008C1F-MF70

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ TSOP2-32 REVERSE
access time 70 ns vs 55 ns (+27%), otherwise same package, organization and supply

πŸ“‹ Reference alternative (not in catalog)

K6X4008C1F-UF70

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ TSOP2-32 REVERSE
access time 70 ns vs 55 ns (+27%), different temperature-range suffix than MF70

πŸ“‹ Reference alternative (not in catalog)

KM684000CL-55

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ TSOP2-32
predecessor 512Kx8 5V 55 ns CMOS SRAM; verify standard vs REVERSE package orientation on PCB

πŸ“‹ Reference alternative (not in catalog)

KM684000BL-55

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ TSOP2-32
predecessor 512Kx8 5V 55 ns CMOS SRAM variant; package orientation and refresh of suffix may differ from K6X4008C1F

πŸ“‹ Reference alternative (not in catalog)

K6X4008C1F-MF55 Maximum Ratings & Electrical Characteristics

Memory Type SRAM - Asynchronous
Organization 512K x 8 bit
Memory Size 4 Mbit
Access Time 55 ns
Interface Parallel
Supply Voltage 5 V
Technology Full CMOS
Package TSOP2-32 (0.400 inch, REVERSE)
Mounting Type Surface Mount
Data Retention Supported, low data retention voltage/current for battery backup
Control Signals CE, OE, WE
Address Lines 19 (A0-A18)
Data Lines 8 (I/O1-I/O8)

K6X4008C1F-MF55 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 CE β€” Chip Enable (active low)
Pin 2 A16 β€” Address input 16
Pin 3 A15 β€” Address input 15
Pin 4 A17 β€” Address input 17
Pin 5 OE β€” Output Enable (active low)
Pin 6 A14 β€” Address input 14
Pin 7 A13 β€” Address input 13
Pin 8 A12 β€” Address input 12
Pin 9 A11 β€” Address input 11
Pin 10 A10 β€” Address input 10
Pin 11 A9 β€” Address input 9
Pin 12 A8 β€” Address input 8
Pin 13 VCC β€” Power supply (+5 V)
Pin 14 I/O1 β€” Data input/output bit 1
Pin 15 I/O2 β€” Data input/output bit 2
Pin 16 I/O3 β€” Data input/output bit 3
Pin 17 I/O4 β€” Data input/output bit 4
Pin 18 I/O5 β€” Data input/output bit 5
Pin 19 I/O6 β€” Data input/output bit 6
Pin 20 I/O7 β€” Data input/output bit 7
Pin 21 I/O8 β€” Data input/output bit 8
Pin 22 GND β€” Ground
Pin 23 A7 β€” Address input 7
Pin 24 A6 β€” Address input 6
Pin 25 A5 β€” Address input 5
Pin 26 A4 β€” Address input 4
Pin 27 A3 β€” Address input 3
Pin 28 A2 β€” Address input 2
Pin 29 A1 β€” Address input 1
Pin 30 A0 β€” Address input 0
Pin 31 A18 β€” Address input 18
Pin 32 WE β€” Write Enable (active low)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for K6X4008C1F-MF55 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

K6X4008C1F-MF55 is suitable for 6 applications: Legacy Industrial Controller Memory, Retro Computing and MSX Board Repair, Telecom and Networking Line Cards, Battery-Backed Data Retention Systems, Embedded Microprocessor Systems (5V buses), Test and Measurement Instrument Buffers.

🏭

Legacy Industrial Controller Memory

The K6X4008C1F-MF55 fits 5V industrial PLC, motor-controller, and instrumentation designs that were laid out in the 1990s-2000s era of 5V microprocessors. Its 4 Mbit (512K x 8) organization matches common external-memory maps for 80186, 68HC000, and early 80C32-class CPUs, while the 55 ns access time covers buses up to roughly 25 MHz with standard address-decode margins. Used as the processor's external data/scratchpad RAM between the CPU data bus and an address latch (e.g., 74HC573) plus a PLD-generated CE signal, it drops onto the original footprint during service repairs, keeping EOL industrial equipment alive without PCB redesign. Low data-retention current also enables battery-backed parameter storage.

πŸ”§

Retro Computing and MSX Board Repair

Retro-computing communities, notably the MSX Resource Center forum, actively use K6X4008C1F parts as replacements for the Samsung KM684000 SRAM in MSX machines, arcade boards, and 8/16-bit home computers. The 5V rail, 512K x 8 organization, and asynchronous parallel interface map directly onto Z80 (3.5 MHz) and similar CPU designs, where the 55 ns access time provides generous timing margin. Repairers should verify package orientation because the -MF55 uses a REVERSE TSOP2 footprint; the community thread 'K6X4008C1F instead of KM684000 for SRAM?' confirms real-world success with attention to pin 1 placement. Battery-backed save-RAM cartridge designs also benefit from the family's low data-retention voltage.

🌐

Telecom and Networking Line Cards

Older telecom line cards and network interface boards used 5V asynchronous SRAM as fast buffering between line-processing ASICs and control CPUs. The K6X4008C1F-MF55's deterministic 55 ns clockless access simplifies timing analysis in TDM-style buffers, avoiding the latency uncertainty of DRAM solutions. Its full CMOS process keeps active current low compared with NMOS-era predecessors, reducing per-card power budgets in high-slot-count shelves, and the low data-retention current supports battery-backed configuration storage during shelf power events. Because many of these shelves remain in service for decades, the TSOP2-32 footprint replacement with the same-family UF55 variant is a standard maintenance practice for legacy telecom hardware operators.

πŸ”‹

Battery-Backed Data Retention Systems

The K6X4008C1F family explicitly supports 'low data retention voltage for battery back-up operation with low data retention current' per the Samsung family datasheet, making the -MF55 suitable for metering, gaming, and data-logging equipment that must preserve state through power loss. In a typical circuit, the CE pin is monitored by a supervisor; when VCC falls below threshold, CE is held near the retention voltage while a lithium coin cell takes over the array. Full CMOS cells then draw microamp-level retention current, extending coin-cell life for years. The 55 ns operating performance returns instantly when main power is restored, with no software re-initialization required, which is a decisive advantage over Flash-based state storage for fast-cycling equipment.

⚑

Embedded Microprocessor Systems (5V buses)

For 5V embedded designs such as industrial gateways, test fixtures, and automotive diagnostics tools built around 5V MCUs, the K6X4008C1F-MF55 provides external RAM without any level-shifting circuitry. The parallel 8-bit bus connects directly to processor pins, and the three-signal CE/OE/WE interface is generated by simple decode logic, keeping BOM count minimal. The 55 ns access time supports 0-wait-state operation for many 16-bit embedded CPUs up to about 20 MHz. Compared with a parallel DRAM alternative, this SRAM needs no refresh controller and has constant access latency, which matters for hard real-time ISRs that store state in external memory during time-critical events.

πŸ–₯️

Test and Measurement Instrument Buffers

Bench instruments - logic analyzers, EPROM programmers, universal device programmers, and pattern generators - from the 5V era rely on fast, deterministic SRAM as sample or buffer memory. The K6X4008C1F-MF55's 55 ns asynchronous access lets capture hardware stream 8-bit samples without handshake delays, and the 512K x 8 depth matches typical capture windows of that generation. Service technicians repairing such instruments value the direct TSOP2-32 REVERSE footprint compatibility with original boards. The full CMOS design also tolerates the repeated power-cycling typical of instrument bench use, with no refresh logic and negligible warm-up behavior, keeping repair turnaround fast and calibration procedures unaffected by memory replacement.

Recommended Products Summary

SN74HC573N Address latch for multiplexed bus Used in: Legacy Industrial Controller Memory DS1233 Microprocessor reset supervisor protecting SRAM during brownout Used in: Legacy Industrial Controller Memory KM684000CL-55 Predecessor SRAM being replaced in repair scenarios Used in: Retro Computing and MSX Board Repair Z84C0020 Z80 CPU whose external bus drives the SRAM Used in: Retro Computing and MSX Board Repair DS1210 Power-cap/battery-backup controller for SRAM Used in: Telecom and Networking Line Cards, Battery-Backed Data Retention Systems MCP7940N RTC sharing battery-backed domain Used in: Battery-Backed Data Retention Systems AT89C55WD 5V 8051-class MCU using external SRAM Used in: Embedded Microprocessor Systems (5V buses) GAL16V8D Address decode generating CE/OE/WE Used in: Embedded Microprocessor Systems (5V buses) K6X4008C1F-UF55 Same-family temperature-range variant used in instrument BOMs Used in: Test and Measurement Instrument Buffers
What is the Samsung K6X4008C1F-MF55?
The K6X4008C1F-MF55 is a 512K x 8 bit (4 Mbit) low-power full CMOS asynchronous static RAM from Samsung Semiconductor. It runs from a single 5V supply, offers a 55 ns address access time, and comes in a 32-pin TSOP2 REVERSE (0.400 inch) package. It uses three control signals (CE, OE, WE) and supports battery-backup data retention with low retention current, per the Samsung K6X4008C1F family datasheet.
Where to buy K6X4008C1F-MF55 online?
The K6X4008C1F-MF55 is listed on DigiKey Marketplace (DigiKey part 5736-K6X4008C1F-MF55-ND) with 'Buy now, ships today' availability, and is also stocked or quoteable via Octatronics, Ampheo, Xecor, Jotrin, and Veswin Electronics. XAIPART offers RFQ-based purchasing with verified stock. Because this Samsung SRAM is end-of-life, secondary-distributor stock changes quickly, so confirm current quantity and lot date before ordering.
What is the price of K6X4008C1F-MF55?
XAIPART price tiers as of 2026-09-01 are: USD 4.50 at qty 1, USD 4.05 at qty 10, USD 3.60 at qty 100, USD 3.15 at qty 500, and USD 2.70 at qty 1000. Distributor pricing on marketplaces such as DigiKey and Ampheo varies with remaining EOL stock; because the part is discontinued, per-unit pricing typically rises as inventory depletes.
What is the access time of K6X4008C1F-MF55?
The K6X4008C1F-MF55 has a 55 ns access time, as indicated by the -M55 speed suffix and confirmed by distributor listings such as datasheets.com ('512KX8, 55ns, CMOS, PDSO32, 0.400 INCH, REVERSE, TSOP2-32'). This speed comfortably supports typical 5V microprocessor buses operating at 20-30 MHz clock rates with standard CE and OE timing margins.
What package does the K6X4008C1F-MF55 use?
The K6X4008C1F-MF55 is packaged in a 32-pin TSOP2 in the REVERSE orientation (0.400 inch body width), also described in distributor data as PDSO32. The REVERSE designation means pin 1 sits at the opposite corner compared with the standard TSOP2, so a board designed for a standard-orientation TSOP2 SRAM must be checked for footprint orientation before this part is used.
What is the best drop-in replacement for K6X4008C1F-MF55?
The closest drop-in replacement is the same-family Samsung K6X4008C1F-UF55, which shares the 512K x 8 organization, 55 ns speed, 5V supply, and 32-pin TSOP2 REVERSE footprint. Within the same family, K6X4008C1F-MF70 and -UF70 (70 ns grades) are also pin-compatible if your bus timing allows a slower access time. The predecessor Samsung KM684000 is a common board-level substitute discussed by the retro-computing community, but verify pinout revision against your PCB.
Can the KM684000 replace the K6X4008C1F-MF55?
Often yes at the board level: the Samsung KM684000 is also a 512K x 8 5V CMOS SRAM, and the MSX Resource Center community regularly discusses using K6X4008C1F in place of KM684000 and vice versa. However, package orientation (standard vs REVERSE TSOP2) and speed grade may differ, so this is a board-verified substitute rather than a guaranteed drop-in. Always compare the two pinouts against your PCB footprint before soldering.
K6X4008C1F-MF55 vs K6X4008C1F-UF55 - which is better?
They are electrically equivalent: both are 512K x 8, 4 Mbit, 5V, 55 ns CMOS SRAMs in 32-pin TSOP2 REVERSE. The difference is the operating temperature range designation in the Samsung family naming scheme - per the family datasheet, the K6X4008C1F family 'supports various operating temperature range and various package types for user flexibility'. Choose the suffix that matches your environmental requirement; either works for most industrial 0-70C designs.
Is a cross-brand equivalent available for K6X4008C1F-MF55?
Cross-brand 512K x 8 5V 32-pin TSOP2 SRAMs exist historically from Alliance Memory and ISSI, but XAIPART did not find verified web cross-reference data confirming a pin-to-pin REVERSE-TSOP2 match, so none is listed here. Per cross-reference best practice (e.g., Molex's guidance), parametric similarity tools do not guarantee drop-in replacement; verify package orientation, pinout, and timing on the datasheets of any cross-brand candidate you consider.
When should I choose the K6X4008C1F-MF55 over a 70 ns grade?
Choose the -M55 55 ns grade when your CPU bus cycle time leaves less than about 30 ns of margin after address decode and buffer delays - for example, 20-25 MHz 5V processors. If your design runs at 12 MHz or below (typical of MSX-class and industrial 8051/68K systems), the pin-compatible 70 ns grades (-MF70/-UF70) cost the same or less and simplify timing, with no other functional difference.
Is the K6X4008C1F-MF55 suitable for battery-backed memory applications?
Yes. According to the Samsung K6X4008C1F family datasheet, the family 'supports low data retention voltage for battery back-up operation with low data retention current.' With CE held at the retention voltage, a coin cell can preserve SRAM contents for years, which is why this family is popular in industrial controllers, gaming cartridges, and metering equipment that need non-volatile scratchpad storage.
Is the K6X4008C1F-MF55 still in production?
No - the K6X4008C1F-MF55 is discontinued/end-of-life from Samsung, which is why it is distributed through marketplace and excess-inventory channels (e.g., DigiKey Marketplace listings from Arcotek). Last-time-buy windows have closed; design-in for new projects is discouraged. Use remaining stock for service and repair, or qualify an alternative SRAM for new designs.
Where to download the K6X4008C1F-MF55 datasheet PDF?
The Samsung 'K6X4008C1F Family CMOS SRAM' datasheet PDF is available via the Arrow-hosted copy (static6.arrow.com, ds_k6x4008c1f_rev20.pdf, revision 2.0), and PDF mirrors exist on alldatasheet.com (177 KB, 9 pages) and datasheetq.com. XAIPART links the authoritative family document; note the datasheet covers the whole K6X4008C1F family including multiple speed grades and package options.
What are the key specifications of K6X4008C1F-MF55 that engineers should know?
Key specs: 4 Mbit asynchronous SRAM organized 512K x 8; 5V single supply; 55 ns access time; full CMOS process; 19 address lines (A0-A18), 8 I/O lines, and CE/OE/WE controls; 32-pin TSOP2 REVERSE (0.400 inch) package; low data-retention voltage and current for battery backup; operating temperature options across the Samsung family. Source: Samsung K6X4008C1F family datasheet and distributor listings.
What is the pinout location and control scheme of the K6X4008C1F-MF55?
The device exposes 19 address pins, 8 bidirectional I/O pins, and three active-low controls: CE (chip enable), OE (output enable), and WE (write enable), plus VCC and GND, across 32 TSOP2 REVERSE pins. A read occurs when CE and OE are low with WE high; a write occurs when CE and WE are low. Because the package is REVERSE-orientated, locate pin 1 (CE) carefully using the package mark before wiring or probing.
What compliance status does the K6X4008C1F-MF55 have?
Compliance data (RoHS, lead-free, halogen-free) for this EOL Samsung part is not consistently published on current distributor pages and is marked unknown on this page. Many existing stock lots predate RoHS deadline refreshes and may contain lead-based finishes. If your application requires RoHS compliance, request the manufacturer certificate of conformance for the specific date/lot code from your supplier before purchase.
Hey Google, what can replace the K6X4008C1F-MF55?
The most reliable replacements are same-family Samsung parts: K6X4008C1F-UF55 (identical, drop-in) and the 70 ns grades K6X4008C1F-MF70/UF70 (pin-compatible, slower). The Samsung KM684000 family is a commonly used board-level substitute in retro-computing repairs. Cross-brand 512K x 8 5V TSOP2 SRAMs exist but were not verified as drop-in for the REVERSE orientation - verify pinout and package orientation on the datasheet first.

Engineering reference data for K6X4008C1F-MF55 β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the K6X4008C1F-MF55 when repairing or maintaining existing 5V boards that specify the TSOP2-32 REVERSE footprint and need 55 ns timing - it is the exact original part. Choose the same-family K6X4008C1F-UF55 when availability of the -MF55 suffix runs dry: it is electrically identical and drop-in. Choose the 70 ns grades (K6X4008C1F-MF70/UF70) only if your CPU bus timing analysis shows adequate address-access margin, typically for 12 MHz or slower systems such as MSX-class machines. Consider the KM684000 generation for community-proven board-level repair of older SRAM sockets, but only after verifying standard-vs-REVERSE package orientation on your PCB. For new designs, avoid all of these EOL parts: qualify a currently produced low-voltage SRAM or use MRAM/FRAM instead, accepting the required level-shifting or redesign work.

Comparison with Alternatives

Parameter This Product K6X4008C1F-UF55 K6X4008C1F-MF70 K6X4008C1F-UF70 KM684000CL-55 KM684000BL-55
Package TSOP2-32 (0.400 in, REVERSE) TSOP2-32 REVERSE - same TSOP2-32 REVERSE - same TSOP2-32 REVERSE - same TSOP2-32 - verify orientation TSOP2-32 - verify orientation
Brand Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics
Organization 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8 512K x 8
Memory Size 4 Mbit 4 Mbit 4 Mbit 4 Mbit 4 Mbit 4 Mbit
Access Time 55 ns 55 ns 70 ns 70 ns 55 ns 55 ns
Supply Voltage 5 V 5 V 5 V 5 V 5 V 5 V
Battery Data Retention Yes (low retention V/I) Yes Yes Yes Yes Yes
Lifecycle Status EOL EOL EOL EOL EOL EOL

Key Differentiators

  • Identical 55 ns speed in same-family swap (vs K6X4008C1F-UF55)
  • Faster than 70 ns family grades (vs K6X4008C1F-MF70)
  • Modern CMOS process vs predecessor (vs KM684000CL-55)

Design Notes

The -MF55 uses a REVERSE-orientation TSOP2-32 (0.400 inch) package: pin 1 (CE) sits at the opposite corner relative to a standard TSOP2. Before placing this part on a board laid out for KM684000 or other standard-orientation SRAMs, rotate the footprint or confirm that the silkscreen pin-1 dot matches the package chamfer. Mis-insertion of a 32-pin TSOP reverses VCC and GND and will destroy the device on power-up. This is the single most common failure mode reported when substituting between Samsung SRAM families.

Estimated: with a 5V rail and full CMOS SRAM cells, decouple each package with 0.1 uF ceramic placed within 5 mm of VCC (pin 13) plus a 10 uF bulk capacitor per bus segment. During battery-backup operation, hold CE near the retention voltage rather than floating it; the family datasheet specifies low data-retention voltage and current for this mode, which is what enables multi-year coin-cell life. Ensure the backup supervisor switches CE before VCC collapses to avoid corruption of the last write cycle.

For new designs, do not design in an EOL part. The K6X4008C1F-MF55 is discontinued and available only from excess-inventory channels with mixed lot dates. Verify bus timing against your speed grade: substituting a 70 ns (-70) part for a 55 ns (-55) part on a 20+ MHz CPU bus without re-checking address-access margin will produce intermittent, temperature-dependent failures. Also confirm address line count: 19 address lines (A0-A18) are required for the full 512K x 8 range; grounding A18 restricts decoding to 256K.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

EOL Samsung part; RoHS/lead-free status varies by production date and is not consistently published on distributor pages. Request certificate of conformance for the specific lot before purchase.

Data verified on: 2026-09-01 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Samsung Electronics Samsung Semiconductor K6X4008C1F-MF55 K6X4008C1F-UF55 KM684000 SRAM asynchronous static RAM static random access memory CMOS 512K x 8 4 Mbit TSOP2-32 PDSO32 MSX battery backup data retention parallel memory interface CE OE WE control signals Memory ICs
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