M321R2GA3PB0-CWM - 16GB DDR5-5600 ECC RDIMM | Samsung
MPN: M321R2GA3PB0-CWM β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.9 | $45.90 |
| 10 | $43.6 | $436.00 |
| 100 | $41.2 | $4,120.00 |
| 500 | $39.1 | $19,550.00 |
| 1,000 | $37.5 | $37,500.00 |
Drop-in alternatives for M321R2GA3PB0-CWM β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
M321R2GA3PB0-CWMXJ
β Drop-Inπ Reference alternative (not in catalog)
M321R2GA3EB0-CWM
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$72 / Unit
View Datasheet βM321R2GA3EB2-CCP
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$74 / Unit
View Datasheet βM321R3GA3PB0-CWM
β Drop-Inβ In Stock
Contact for price
View Datasheet βM329R4GA0PB0-CWM
β Drop-Inπ Reference alternative (not in catalog)
M324R4GA3BB0-CQK
β Drop-Inπ Reference alternative (not in catalog)
M321R2GA3PB0-CWM-ATC
β Drop-Inπ Reference alternative (not in catalog)
M321R2GA3PB0-CWM Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM |
| Module Type | 288-pin RDIMM (ECC Registered) |
| Density | 16 GB (2G x 72) |
| Speed | 5600 Mbps (PC5-44800) |
| Operating Voltage | 1.1 V |
| Rank x Organization | 1R x 8 |
| Component Composition | (2G x 8) x 10 FBGA DRAM |
| Number of Pins | 288 |
| ECC | Registered with ECC |
| Product Status | Mass Production |
| Form Factor | EC8 RDIMM |
| Compatible Platforms | Servers and workstations with DDR5 RDIMM support (e.g. Dell PowerEdge R660) |
M321R2GA3PB0-CWM standard Pin Configuration Guide
Complete pinout information for M321R2GA3PB0-CWM (standard package) with 288 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M321R2GA3PB0-CWM.
Refer to the datasheet for full pin configuration.
Estimated pin count: 288 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M321R2GA3PB0-CWM is suitable for 6 applications: Entry-Level Virtualization Servers, Edge Compute Appliances, Small-Scale Enterprise Servers, Workstation Memory Upgrades, Memory Shortage Mitigation, Cloud and Hosting Infrastructure.
Entry-Level Virtualization Servers
The M321R2GA3PB0-CWM fits entry-level virtualization hosts because its 16 GB density and DDR5-5600 bandwidth balance cost and performance for small VM counts. The registered ECC architecture protects against single-bit memory errors that would otherwise crash hypervisors or corrupt guest images, while the single-rank 1Rx8 organization reduces memory-controller loading so more DIMMs per channel can run at full 5600 MT/s. Installed between the CPU's integrated memory controller and the OS, the module delivers PC5-44800 bandwidth per channel; the trade-off versus 32 GB dual-rank modules is lower capacity per slot, so plan slot population accordingly. Multiple modules should be installed symmetrically across channels to maximize aggregate bandwidth.
Recommended
Edge Compute Appliances
Edge-compute nodes benefit from the M321R2GA3PB0-CWM's low 1.1 V operating voltage, which reduces per-bit energy consumption and heat in fanless or constrained-cooling enclosures. Its ECC Registered DDR5 design maintains data integrity for continuous-duty inference and stream-processing workloads where uncorrected errors are unacceptable. The 16 GB capacity suits containerized edge services and local caching tiers, and the DDR5-5600 rate provides headroom for burst workloads. Because the module is JEDEC-standard 288-pin RDIMM, it drops into any x86 or Arm server SoC platform supporting registered DDR5, enabling long-life serviceability and second-source availability from NEMIX RAM and A-Tech equivalents.
Recommended
Small-Scale Enterprise Servers
For small business and departmental servers such as Dell PowerEdge R660 and R660xs class machines, the M321R2GA3PB0-CWM provides validated 16 GB DDR5-5600 registered memory at an economical price point. The same-family CWMXJ variant carries a Dell cross-reference (AC830716), simplifying qualification. The ECC function corrects single-bit errors in always-on file, print, and application hosting, and the 1Rx8 organization supports full-speed 5600 MT/s operation in one-DIMM-per-channel configurations common in entry servers. Mixed deployment with 32 GB modules (M329R4GA0PB0-CWM) allows staged capacity growth while keeping all channels populated for balanced bandwidth.
Recommended
Workstation Memory Upgrades
Professional workstations built on Xeon W or Threadripper PRO platforms accept the M321R2GA3PB0-CWM as a cost-effective 16 GB DDR5-5600 RDIMM. Content-creation and CAD applications benefit from the module's 44800 MB/s bandwidth for large asset handling, while ECC protects long render and simulation jobs from silent memory errors that would waste hours of compute. The 288-pin registered form factor is required on these platforms, distinguishing it from consumer UDIMMs. When populating eight or more DIMM slots, single-rank modules like this one often sustain full memory speed where dual-rank modules would force downclocking, an important trade-off in certified ISV workstation configurations.
Recommended
Memory Shortage Mitigation
When Samsung supply tightens, procurement teams can substitute certified-compatible third-party RDIMMs matching the M321R2GA3PB0-CWM's 16 GB DDR5-5600 1Rx8 1.1 V CL46 288-pin specification. NEMIX RAM and A-Tech (M321R2GA3PB0-CWM-ATC) modules are compatibility-tested drop-in replacements engineered to the same JEDEC registered DDR5 standard, so they can be deployed interchangeably on platforms that accept third-party memory. XAIPART recommends avoiding brand mixing within a single memory channel where possible, validating BIOS-level memory training after substitution, and confirming the server qualified vendor list to preserve warranty and support agreements on enterprise hardware.
Recommended
Cloud and Hosting Infrastructure
Colocation and hosting providers deploying high-slot-count 1U/2U servers use the M321R2GA3PB0-CWM to build balanced 128-256 GB configurations from sixteen modules at minimum cost per gigabyte. The 5600 MT/s rate maximizes per-core memory bandwidth for multi-tenant workloads, and registered ECC operation is mandatory on the EPYC/Xeon Scalable platforms these systems use. Single-rank modules improve signal integrity at full population, permitting 1DPC or 2DPC topologies without speed derating. Bulk purchasing at the 500-1000 unit tiers (approximately $39.10-$37.50 per module as of 2026-09-04) materially lowers fleet capital cost versus retail channels.
Recommended
Recommended Products Summary
Engineering reference data for M321R2GA3PB0-CWM β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M321R2GA3PB0-CWMXJ | M321R3GA3PB0-CWM | M329R4GA0PB0-CWM | M324R4GA3BB0-CQK | M321R2GA3PB0-CWM-ATC |
|---|---|---|---|---|---|---|
| Package | 288-pin RDIMM | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics (A-Tech replacement) |
| Memory Size | 16 GB | 16 GB | 24 GB | 32 GB | 32 GB | 16 GB |
| Transfer Rate | 5600 Mbps (PC5-44800) | 5600 Mbps | 5600 Mbps | 5600 Mbps | 4800 Mbps | 5600 Mbps |
| Operating Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Rank x Organization | 1R x 8 | 1R x 8 | [DATA_NEEDED] | [DATA_NEEDED] (32GB dual-rank expected) | [DATA_NEEDED] | 1R x 8 |
| ECC / Registration | ECC Registered (RDIMM) | ECC Registered | ECC Registered | ECC Registered | ECC Registered | ECC Registered |
| Product Status | Mass Production | Mass Production | Mass Production | Mass Production | Mass Production | Active (aftermarket) |
| Unit Price (Qty 1) | $45.90 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade in the compared family (vs M324R4GA3BB0-CQK)
- Single-rank efficiency at full speed (vs M329R4GA0PB0-CWM)
- OEM cross-reference availability (vs M321R3GA3PB0-CWM)
Design Notes
Never mix RDIMMs with UDIMMs or LRDIMMs on the same platform - registered modules are only recognized by server-class memory controllers. Do not assume the 288-pin DDR5 connector is backward compatible with DDR4; the key notch position differs and DDR5 signaling (1.1 V, BL16, on-die ECC, PMIC on module) is entirely new. When populating channels, install modules symmetrically (per-channel identical capacity/rank) to avoid BIOS training failures or automatic speed derating from 5600 MT/s.
Each DDR5 RDIMM integrates an on-module PMIC that converts the 1.1 V rail to the DRAM core supply, shifting point-of-load regulation onto the module itself. Verify the server platform's per-DIMM power budget and PMIC firmware (some platforms restrict PMIC programmability for security). A fully populated 8-channel EPYC/Xeon system with 16 GB single-rank modules draws meaningfully less than dual-rank equivalents, improving thermal headroom in 1U chassis with limited airflow.
DDR5 modules operate within JEDEC-specified thermal envelopes; sustained operation above the ambient design limit triggers refresh-rate doubling (2x refresh), which reduces effective bandwidth. In dense 2U or blade deployments, verify inlet air temperature to DIMM slots stays within platform specification, and prefer single-rank modules like this 1Rx8 part in slot-heavy configurations because their lower per-module dissipation eases airflow design and avoids throttling under sustained virtualization loads.
Compliance Information
Compliance declarations not present in retrieved data; obtain Samsung's official RoHS/REACH certificate via Samsung Semiconductor environmental documentation before regulated deployment.
