MC33XS2410EL - Quad 100mOhm 60V High-Side Switch | NXP
MPN: MC33XS2410EL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.12 | $6.12 |
| 10 | $5.55 | $55.50 |
| 100 | $4.87 | $487.00 |
| 500 | $4.35 | $2,175.00 |
| 1,000 | $3.92 | $3,920.00 |
MC33XS2410EL Overview
A high-side switch is a power semiconductor device placed between a supply rail and a load, switching the positive supply rather than the ground path. Within the power-management hierarchy (switch -> load driver -> power distribution IC -> power management IC), smart high-side switches integrate the power MOSFET, gate driver, charge pump, and protection circuitry in one package, replacing discrete MOSFET plus driver solutions. They report diagnostics such as load current, supply voltage, and fault status back to the microcontroller, enabling predictive maintenance and functional-safety concepts in modern vehicles and industrial systems.
Key differentiating features of the MC33XS2410 include its wide 3.0 V to 60 V operating range covering 12 V and 24 V automotive board-net conditions including load-dump transients, a nominal 3.6 A load current rating per the DigiKey listing, and two operating configurations (four 100 mOhm channels or two paralleled 50 mOhm channels). The embedded 12-bit ADC samples channel current and supply voltage on-chip, drastically reducing external sense resistors, amplifiers, and MCU software overhead compared with legacy smart switches.
Technically, the device combines N-channel power MOSFETs with integrated gate drive, active clamp, overcurrent, overtemperature, and loss-of-ground protections. Its SPI interface (16-bit) exposes configuration of channel on/off states, open-load detection thresholds in the off state, fault reporting, and ADC readback. Current-sense ratios are reported digitally rather than through an analog sense pin, improving accuracy and eliminating calibration.
Typical applications include automotive resistive, capacitive, and inductive loads such as LED lamps, relays, solenoids, heater elements, and small DC motors, plus industrial 24 V PLC output modules where 60 V transient ruggedness is valuable.
Design consideration: the 28-HTSSOP exposed-pad package requires a well-soldered thermal pad on the PCB to meet thermal performance; size the copper pour based on worst-case continuous load and RDS(on) dissipation.
This page synthesizes distributor pricing, cross-reference guidance, and practical design notes not found in the NXP datasheet alone, with data verified as of 2026-09-14.
Drop-in alternatives for MC33XS2410EL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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| Product Type | Quad self-protected high-side switch |
| Channel Configuration | Quad 100 mOhm / dual 50 mOhm |
| Number of Channels | 4 |
| Power Supply Voltage (Operating) | 3.0 V to 60 V |
| Nominal Load Current | 3.6 A |
| On-Resistance | 100 mOhm (per channel, quad) / 50 mOhm (paralleled dual) |
| Control Interface | SPI (16-bit) |
| Current Monitoring | Embedded 12-bit ADC |
| Package | HTSSOP-28 (28-HTSSOP, exposed pad) |
| Mounting Type | Surface Mount |
| Protection Features | Overcurrent, overtemperature, open-load detect, active clamp |
| Datasheet Revision | Rev. 7 - 31 October 2022 |
MC33XS2410EL htssop-28 (28-htssop, exposed pad) Pin Configuration Guide
Pin configuration for MC33XS2410EL (htssop-28 (28-htssop, exposed pad) package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for MC33XS2410EL.
Refer to the datasheet for full pin configuration.
Typical Applications
MC33XS2410EL is suitable for 6 applications: Automotive LED Lighting Loads, Relay and Solenoid Driving, Automotive Body Control Modules, Industrial 24 V PLC Output Modules, Resistive Heater Elements, Small DC Motor Loads.
Automotive LED Lighting Loads
The MC33XS2410 fits automotive LED lamp drivers because its four 100 mOhm channels can each drive LED strings or lamp loads while the embedded 12-bit ADC continuously reports load current, enabling open-circuit and short-circuit detection of individual lamps without external sense components. In a typical body-control module topology, each channel switches a lamp branch from the 12 V board net, and the 3.0 V to 60 V operating range withstands jump-start and transient conditions. The SPI interface allows the MCU to ramp or pulse channels for diagnostics, and the open-load detection in the off state flags failed bulbs during vehicle-off checks. Performance consideration: because LED loads are capacitive and low-current at turn-on, verify inrush limits and configure the fault thresholds accordingly to avoid nuisance shutdown.
Recommended
Relay and Solenoid Driving
The MC33XS2410 is well suited to relay and solenoid loads in automotive and industrial modules because its N-channel power stages include active clamping that safely dissipates inductive turn-off energy, eliminating external freewheeling diodes. The quad 100 mOhm configuration drives four relays independently, while the dual 50 mOhm configuration suits higher-current solenoid branches. The embedded 12-bit ADC reports coil current so the MCU can detect stuck contacts or shorted coils through abnormal signatures, and the overtemperature protection prevents channel destruction during jammed-solenoid stall conditions. Performance consideration: solenoid inrush and release energy must stay within the datasheet clamp ratings; for very large contactors, add an external clamp or choose a higher-current device. Overall BOM count drops versus discrete MOSFET plus diode solutions.
Recommended
Automotive Body Control Modules
In body control modules (BCM), the MC33XS2410 consolidates multiple load switches into one 28-HTSSOP device: lamps, relays, heaters, and small motors share a single SPI-controlled IC. The digital monitoring architecture directly addresses the BCM requirement for per-load diagnostics, since the 12-bit ADC streams channel current and supply voltage to the MCU, supporting load-dump awareness, wiring-harness fault detection, and predictive maintenance messages on the vehicle network. The 3.0 V to 60 V supply range covers cold crank and jump-start conditions of the 12 V board net. Design consideration: a single SPI bus can manage several MC33XS2410 devices through chip-select lines, simplifying firmware versus one analog control pin per load. Verify fault-report latency against your CAN response requirements in the datasheet timing tables.
Recommended
Industrial 24 V PLC Output Modules
The MC33XS2410 serves 24 V industrial PLC digital output modules because its 60 V maximum supply rating provides transient headroom on 24 V rails, and its protection set (overcurrent, overtemperature, open-load) implements the diagnostic coverage that industrial safety standards expect from smart outputs. Each of the four channels drives an actuator, indicator lamp, or sensor power branch, while the 12-bit ADC replaces discrete current-monitoring circuitry that PLC designers would otherwise populate per channel. The SPI diagnostics allow the PLC CPU to distinguish short-circuit, open-load, and overload conditions for each output point and report them via the fieldbus. Performance consideration: at 24 V continuous loads, check per-channel current derating with all four channels active using the datasheet safe-operating information and your module ambient specification.
Recommended
Resistive Heater Elements
The MC33XS2410 drives resistive heater loads such as seat heaters, mirror defrosters, and sensor pre-heaters effectively because the 12-bit ADC provides continuous current feedback that enables closed-loop power control and overtemperature diagnosis. In a dual 50 mOhm configuration, two paralleled channels deliver higher current with halved on-resistance, reducing conduction losses to roughly 0.13 W per amp (estimated from 50 mOhm), important for continuous-duty heater duty cycles. The MCU can implement PWM or slow-blow strategies over SPI and detect heater element failures through the monitored current signature. Performance consideration: heaters are benign inductive loads but stressful thermally; size the PCB thermal pad for the full continuous load and verify the junction temperature stays within datasheet limits at maximum ambient with all channels active.
Recommended
Small DC Motor Loads
The MC33XS2410 handles small DC motor loads, such as HVAC flap actuators, pump motors, and latch motors, by providing inductive clamp protection for motor windings and digital current monitoring that detects rotor stall through the characteristic inrush-then-current-rise signature. Each 100 mOhm channel starts motors up to the device rating, and the embedded diagnostics allow stall detection within milliseconds, protecting both the IC and the mechanical mechanism. Compared with a discrete MOSFET, no external current-sense resistor or comparator is needed, and the SPI configuration can disable the channel autonomously on fault. Performance consideration: verify that motor locked-rotor current and the clamped inductive energy per turn-off event remain within datasheet ratings, and consider paralleling two channels (dual 50 mOhm mode) for high-inrush motor branches.
Recommended
Recommended Products Summary
Engineering reference data for MC33XS2410EL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC10XS3435EK | BTS70121EPAXUMA1 |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | Infineon |
| Drop-in Replacement | - | No - different footprint/interface | No - different footprint/interface |
Key Differentiators
- Embedded 12-bit ADC digital current monitoring (vs MC10XS3435EK)
- Configurable quad/dual architecture (vs BTS70121EPAXUMA1)
- Wide 3.0 V to 60 V supply range (vs discrete MOSFET solutions such as IRLR3110ZTRLPBF)
Design Notes
The exposed pad of the 28-HTSSOP package is the dominant heat path and must be soldered to a copper land connected to ground. Estimated: one 100 mOhm channel at 3.6 A dissipates about 1.3 W (P = I^2 x R = 3.6^2 x 0.1), so with all four channels active the total can exceed 5 W in the quad configuration; use the dual 50 mOhm mode (halves per-amp dissipation) or adequate copper pour with thermal vias for high continuous loads. Verify junction temperature against the datasheet thermal impedance at your maximum ambient temperature.
Place a low-ESR bulk capacitor close to the VPWR pins to absorb load-transient current from switched channels, and provide a solid ground plane tied to the exposed pad with an array of thermal vias. Keep SPI traces short and, in automotive layouts, add series resistors and optional ESD protection at the SPI connector side per NXP system-basis design practice. Route high-current channel outputs with adequate trace width for 3.6 A continuous per channel and separate them from sensitive analog/SPI routing to limit di/dt coupling during switching edges.
Do not exceed the 60 V absolute supply limit: in 12 V and 24 V systems, load dump and inductive kick can exceed this at the module connector, so confirm the upstream clamping strategy before relying on the device rating alone. Follow the NXP datasheet power-up and SPI initialization sequence - channels must remain off until the device is configured, and fault flags should be cleared after readback. When paralleling channels for the dual 50 mOhm mode, adhere to the datasheet pairing instructions rather than paralleling arbitrary channels.
The SPI interface carries all control and diagnostic traffic, so ensure timing margins at your bus speed across the full temperature range per the datasheet AC characteristics. When several smart switches share one SPI bus, keep chip-select lines individually gated and add small series resistors (for example 33 to 100 ohm) to damp ringing on long traces. Misreads of the 12-bit ADC results after noisy switching events are avoided by polling diagnostics after switching transients settle rather than during edge transitions.
Compliance Information
Compliance status for the MC33XS2410EL ordering code was not present in the provided verified web data; consult the NXP product page at nxp.com/part/MC33XS2410EL for current RoHS/REACH declarations and quality packaging information.
