MC33XS2410 - Quad 100mOhm 60V High-Side Switch | NXP
MPN: MC33XS2410 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.9 | $3.90 |
| 10 | $3.55 | $35.50 |
| 100 | $3.1 | $310.00 |
| 500 | $2.78 | $1,390.00 |
| 1,000 | $2.45 | $2,450.00 |
MC33XS2410 Overview
A high-side switch is a power distribution device that connects and disconnects a load from the supply rail using a power MOSFET placed between the supply and the load. Within the power management hierarchy, it sits under power drivers and smart switches, alongside eFuses and load switches. Self-protected smart high-side switches integrate sensing, diagnostics, and fault management, replacing discrete MOSFET-plus-controller solutions and reducing board area, component count, and MCU software overhead in automotive and industrial power distribution systems.
Key features of the MC33XS2410 include the embedded 12-bit ADC that digitizes load current and output voltage for real-time condition monitoring, advanced digital control via an SPI interface, and comprehensive self-protection covering overcurrent, overtemperature, and overvoltage events. The flexible channel configuration supports four 100 mOhm channels or two 50 mOhm channels, allowing designers to trade channel count for per-channel current capability on the same footprint.
The high level of integration is the defining engineering attribute: with on-chip monitoring and protection, the MCU only reads status and writes control words over SPI, drastically simplifying hardware design and software development compared to discrete protection circuits. According to the NXP MC33XS2410 product data sheet (Rev. 7, 31 October 2022, 86 pages), the device is operational from 3.0 V to 60 V, covering 12 V automotive battery systems with substantial transient headroom such as load-dump conditions.
Typical applications include automotive body electronics and power distribution modules, relay replacement in industrial automation, and loads such as lamps, motors, resistors, and capacitive loads in 12 V and 24 V systems. The wide supply range and digital diagnostics make it well suited to ISO 26262-oriented safety architectures that require per-channel fault reporting.
A key design consideration is thermal management: at 100 mOhm on-resistance and multi-ampere channel currents, conduction losses reach the watt range, so the HTSSOP-28 exposed-pad package requires a solid PCB thermal pad with thermal vias.
This page adds value beyond the datasheet by consolidating drop-in alternatives, pricing context, application guidance, and engineering design notes in one place.
Drop-in alternatives for MC33XS2410 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
MC33XS2410EL
β Drop-Inβ In Stock
$6.86 / Unit
View Datasheet βMC34XS2410
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
MC10XS3435
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
MC33XS2410 Maximum Ratings & Electrical Characteristics
| Product Type | Quad self-protected high-side switch |
| Channel Configuration | Quad 100 mOhm / dual 50 mOhm |
| Power Supply Voltage (Operating) | 3.0 V to 60 V |
| Number of Channels | 4 (high-side) |
| Embedded ADC | 12-bit |
| On-Resistance | 100 mOhm (quad mode) / 50 mOhm (dual mode) |
| Control Interface | SPI (digital monitoring and control) |
| Protection Features | Self-protected: overcurrent, overtemperature, overvoltage |
| Package | 28-pin HTSSOP |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Applications | Automotive body electronics, industrial loads, relay replacement |
| Datasheet Revision | Rev. 7, 31 October 2022 |
| Datasheet Page Count | 86 pages |
MC33XS2410 28-pin htssop Pin Configuration Guide
Pin configuration for MC33XS2410 (28-pin htssop package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for MC33XS2410.
Refer to the datasheet for full pin configuration.
Typical Applications
MC33XS2410 is suitable for 6 applications: Automotive Body Electronics and Power Distribution, Relay Replacement in Industrial Automation, LED Lighting Loads, DC Motor and Actuator Control, Programmable Logic Controllers (PLC) I/O Power, E-vehicle Auxiliary and Charging Systems.
Automotive Body Electronics and Power Distribution
The MC33XS2410 fits automotive body control modules and smart junction boxes because its 3.0 V to 60 V supply range covers 12 V battery cranking, 14 V nominal operation, and load-dump transients without external clamping. Each 100 mOhm channel drives lamps, motors, or resistive loads, while the embedded 12-bit ADC reports per-channel current and voltage to the MCU over SPI, enabling open-load, short-circuit, and overtemperature diagnostics required in modern power distribution architectures. Channel flex between quad 100 mOhm and dual 50 mOhm mode lets one PCB serve multiple trim levels, cutting variant count and simplifying the BOM for tier-one suppliers.
Recommended
Relay Replacement in Industrial Automation
Replacing electromechanical relays with the MC33XS2410 eliminates contact wear, arcing, and coil inrush while providing solid-state control of 24 V industrial loads. The 60 V maximum supply rating gives comfortable headroom on 24 V rails, and the 100 mOhm on-resistance limits conduction loss, for example 0.4 W at a 2 A continuous load per channel. Unlike a relay, the SPI interface reports overcurrent, overtemperature, and open-load faults digitally, allowing a PLC or MCU to implement predictive maintenance and immediate fault isolation. The self-protected behavior also removes the need for external freewheeling and protection discretes around inductive loads.
Recommended
LED Lighting Loads
Automotive and industrial LED lamps benefit from the MC33XS2410 because LED loads demand both precise on/off control and diagnostic feedback for shorted or open strings. The 12-bit ADC captures per-channel load current so the MCU can detect degraded LED strings before complete failure, supporting safety-relevant lighting functions. The 3.0 V minimum supply keeps the switch functional during cranking dips, and the self-protection clears overcurrent faults from shorted strings without board damage. Because LEDs are capacitive/rectified loads with low steady current, thermal dissipation per channel stays low, letting all four 100 mOhm channels run simultaneously.
Recommended
DC Motor and Actuator Control
The MC33XS2410 drives small DC motors, pumps, and actuators directly from 12 V or 24 V rails. The 50 mOhm dual-channel configuration reduces conduction loss for higher-current motor branches, and the inrush tolerance plus programmable protection thresholds handle motor start currents without nuisance tripping. The embedded 12-bit ADC streams motor current over SPI, which can be used for stall detection and jam protection in wiper, seat, or HVAC actuator applications. Thermal design should account for extended inrush: estimated dissipation during a 5 A stall at 100 mOhm is 2.5 W per channel, demanding a solid exposed-pad copper area and thermal vias.
Recommended
Programmable Logic Controllers (PLC) I/O Power
In PLC digital output modules, the MC33XS2410 provides individually protected and monitored channels to field loads, replacing fuse-and-relay trees. The SPI control integrates cleanly with the module processor, and the 12-bit ADC enables per-channel load current telemetry that supports IoT-style predictive maintenance dashboards. With a 3.0 V logic-friendly interface and 60 V transient tolerance, it bridges the logic domain to harsh 24 V field wiring safely. Short-circuit protection reacts autonomously without MCU intervention, protecting field wiring even if the controller hangs, which is a key advantage over discrete MOSFET solutions that rely on software supervision.
Recommended
E-vehicle Auxiliary and Charging Systems
Electric two-wheelers, e-bikes, and light EVs use 12 V to 48 V auxiliary rails that fall inside the 60 V rating of the MC33XS2410, making it a compact four-channel distribution switch for lighting, horn, charge-enable, and communication modules. The wide 3.0 V to 60 V supply range tolerates charger-induced transients, and SPI diagnostics report per-rail health to the vehicle control unit. Using quad 100 mOhm mode for four small loads or dual 50 mOhm mode for two heavier ones lets one footprint cover multiple platform variants. Channel power sequencing via SPI also simplifies controlled bring-up of auxiliary domains after charge events.
Recommended
Recommended Products Summary
Engineering reference data for MC33XS2410 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC33XS2410EL | MC34XS2410 | MC10XS3435 |
|---|---|---|---|---|
| Package | 28-HTSSOP | 28-HTSSOP - same | 28-HTSSOP - same | 28-HTSSOP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Control Interface | SPI | SPI | SPI | SPI (register map differs - verify) |
| Pin-to-Pin Compatibility | Reference | Identical die variant | Pin-to-pin compatible (same family) | Same package - verify pinout/register map before swap |
Key Differentiators
- Embedded 12-bit ADC for digital load monitoring (vs MC10XS3435)
- Dual-mode channel flexibility (quad 100 mOhm / dual 50 mOhm) (vs MC33XS2410EL (same die) with single-config competitors like BTS7008-1EPA)
- 3.0 V minimum supply for cranking tolerance (vs MC10XS3435)
Design Notes
Size the PCB thermal design before choosing the channel configuration. Estimated: a 2 A continuous load on one 100 mOhm channel dissipates 0.4 W, and four such channels about 1.6 W total; in dual 50 mOhm mode the same 2 A drops to 0.2 W per channel. The 28-HTSSOP exposed pad must be soldered to a copper pour of at least 1 square inch with an array of thermal vias to the inner plane. Check junction temperature against the derating tables in the NXP datasheet Rev. 7 for your ambient temperature.
Decouple the power supply with a low-ESR bulk capacitor (typically 47-100 uF) close to the V_PWR pins to absorb inrush and load transients, plus a 100 nF ceramic at the logic supply pins. Route SPI (SCLK, SI, SO, CSB) away from the high-current load paths to avoid ground-bounce corrupting serial communication. Connect the exposed thermal pad to the ground plane with 9-16 vias, as it is both the thermal and principal electrical return path.
Do not exceed 60 V on V_PWR: automotive load-dump events must be clamped externally (TVS diode) if the system lacks central load-dump suppression. Never operate channels in parallel to exceed per-channel current without consulting the datasheet channel-pairing rules. When substituting MC10XS3435-class parts, remember the SPI register map differs even if the package matches - firmware changes are mandatory. Finally, confirm the exact AEC-Q100 and PPAP documentation level with NXP before releasing automotive designs.
Compliance Information
Designed for automotive applications; verify AEC-Q100 grade and PPAP documentation level on the NXP product page for MC33XS2410EL. RoHS/lead-free status per NXP standard product data.
